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Friday 12 June 2026
Cadence deepens Intel Foundry partnership on next-generation chip design
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The...
Friday 12 June 2026
PCIM 2026: Overcoming thermal warping in direct-cooled EV power modules
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing...
Friday 12 June 2026
Power semiconductors race to cut resistance for GPU cooling
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used...
Thursday 11 June 2026
Applied Materials invests US$500 million in Singapore to meet AI chip demand
As artificial intelligence (AI) fuels an unprecedented surge in demand for advanced semiconductors, Applied Materials is deepening its commitment to one of Asia's most important chipmaking...
Thursday 11 June 2026
PCIM 2026: Why the Silicon survival, physics, and the AI vortex are forcing reality check

While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric...

Wednesday 10 June 2026
Malaysia electronics exports seen rising through 2026 despite trade and cost pressures
Malaysia's electronics sector is expected to keep expanding into 2026, even as tariffs, geopolitical tensions, and rising input costs weigh on manufacturers. Industry leaders say the...
Tuesday 9 June 2026
Tencent takes dual-track AI chip route with Canghai V2 and domestic partnerships
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing...
Tuesday 9 June 2026
Ultraband & NTT-AT sign MOU to boost RF, Power collaboration

Ultraband Technologies, an emerging IC design startup, announced today the official signing of a Memorandum of Understanding (MOU) with NTT ADVANCED  TECHNOLOGY...

Monday 8 June 2026
NTT taps Korean, Taiwanese partners for JPY70 billion-plus IOWN fund

NTT plans to establish an investment fund of more than JPY70 billion (approx. US$440 million), with major South Korean and Taiwanese...

Friday 5 June 2026
TSMC says AI demand is straining entire supply chain, not just chipmakers
TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment,...
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
Thursday 4 June 2026
Foxconn, SK Group eye deeper AI infrastructure ties in Asia

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers,...

Thursday 4 June 2026
Nvidia's Jensen Huang courts Korean giants in robotics expansion

Nvidia CEO Jensen Huang is visiting South Korea this week as the company seeks to expand its partnerships with major Korean conglomerates...

Thursday 4 June 2026
EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure
The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source...
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs...