China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and...
Touch module maker General Interface Solution Holding (GIS) said the second half of 2026 will be more challenging as global memory...
The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...
China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project...
Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator,...
Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040,...
