SK Hynix has begun placing orders with major suppliers for advanced DRAM manufacturing equipment for the first phase of its Yongin...

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical...

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the...

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...