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    LG Electronics's three strategies to counter competition from Chinese brands
    Sep 1, 19:00
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    Sep 1, 19:00
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    Sep 1, 19:00
    InP enters a capacity race as TCL moves into indium phosphide laser chips
    Sep 1, 19:00
    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
    Sep 1, 19:00
    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
    Sep 1, 19:00
    NEWS TAGGED SK HYNIX
    Tuesday 1 September 2026
    SK Hynix touts up to 5.15x inference gains with custom HBM

    SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

    Tuesday 1 September 2026
    Samsung locks 70% of memory output as HBM spot prices soar
    Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
    Tuesday 1 September 2026
    SK Hynix explores Intel as second source for HBM base dies
    SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
    Monday 31 August 2026
    Update: SK Hynix breaks silence on Japan expansion rumors
    To capture surging global demand for memory chips driven by artificial intelligence (AI), SK Hynix is actively exploring manufacturing and investment options in Japan.
    Friday 28 August 2026
    China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
    China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
    Friday 28 August 2026
    SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM
    SK hynix broke ground on August 27 on a US$4 billion advanced packaging plant in Purdue Research Park, its first US high-bandwidth memory (HBM) site.
    Thursday 27 August 2026
    SK Hynix questions PIM as thermal, packaging limits constrain HBM
    South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
    Thursday 27 August 2026
    CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
    CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

    Wednesday 26 August 2026
    SK hynix adds second major customer as Nvidia misses Samsung's top five
    SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
    Tuesday 25 August 2026
    Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
    On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
    Tuesday 25 August 2026
    Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

    Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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