Rapidus has established strategic partnerships with two leading electronic design automation (EDA) companies to expedite the mass production of next-generation semiconductor chips.
PGC (Progate Group Corporation) has recently teamed up with North American strategic allies to meet the growing demand for advanced process technologies in AI, high-performance computing...
The integration of artificial intelligence (AI) in chip design has become a focal point in the semiconductor industry. Leading electronic design automation (EDA) companies, including...
Synopsys has announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate...
As AI continues to captivate the tech world, industry experts are shifting their focus to the next big challenge: energy efficiency. Brandon Wang, vice president of corporate strategy...
Since 2024, the global Electronic Design Automation (EDA) industry has seen considerable consolidation. The Chinese EDA sector, despite its long-standing fragmentation and early developmental...
Following the collaboration with Taiwan-based PSMC to build a 300mm wafer fab in India, Tata Electronics plans to expedite the operation of the fab with tools provided by Synopsys.
Synopsys Users Group (SNUG) Taiwan 2024 demonstrated the state-of-the-art EDA innovations and Artificial intelligence (AI) driven solutions for the chip design community.
Bangalore, often dubbed India's Silicon Valley, has long been the heart of the country's semiconductor industry, attracting heavyweight corporations and pioneering startups. This...
At the SNUG Taiwan 2024 conference organized by Synopsys, Joachim Kunkel, General Manager of the Solutions Group at Synopsys, delivered the keynote speech. The event featured design...
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tape-outs.
EDA giant Synopsys has completed the tape-out of a high-performance mobile SoC design using Samsung Electronics' 3nm GAA (Gate-All-Around) wafer foundry process. This chip is set...
To sustain its chip design capabilities, Taiwan must advance its development of Electronic Design Automation (EDA) tools for 3D Heterogeneous Integration (3DHI) and explore next-generation...
Synopsys has disclosed extensive EDA and IP collaboration with TSMC for advanced node designs, which have been used in a wide range of AI, high-performance computing, and mobile applications...
