As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
SK Hynix is accelerating production of 1b DRAM for high-bandwidth memory as quality testing of Nvidia's next-generation HBM4 nears its final stage, according to Korean media and industry...
Taiwan's supply chain has reaped the benefits of Nvidia's AI leadership. In Taiwan, it received NT$6.7 billion (US$211.9 million) in subsidies in 2023 under the Taiwan AI Innovation...
SK Hynix has reportedly made significant progress in the quality testing of Nvidia's sixth-generation high-bandwidth memory (HBM4) products, boosting the likelihood that it will become...
Geopolitical tensions between the Netherlands and China led to Nexperia halting shipments at the end of 2025, raising concerns over potential disruptions in the automotive semiconductor...
ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
Msscorps held its year-end gathering on February 1, 2026, during which chairman Chi-Lun Liu highlighted the company's two decades of deep expertise in semiconductor testing and analysis...
Taiwan's semiconductor test supply chain is experiencing strong growth driven by increased demand for AI and HPC chips, industry sources report. Close collaborations with foundries...
Powertech Technology (PTI) and its subsidiary test and assembly firm Greatek jointly held an online investor conference to discuss future operations. Greatek president Yu-Chang Chi...
Chinese microcontroller (MCU) supplier Cmsemicon has raised prices on its MCU and NOR Flash products by 15% to 50%, citing tighter chip supply and higher packaging and testing costs...
Enterprise investments in 5G private networks are expected to significantly increase following amendments to the "Regulations Governing the Establishment and Use of Mobile Broadband...
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
Memory testing and packaging firm Powertech Technology (PTI) reported that its revenue and earnings met expectations in the fourth quarter of 2025. Quarterly revenue reached NT$21.41...
Samsung Electronics is emerging as the leading supplier of sixth-generation High Bandwidth Memory (HBM4) to Nvidia and AMD as of February 2026, backed by growing confidence in its...
