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NEWS TAGGED TESTING
Sunday 15 March 2026
Niching sees AI-driven thermal products lift early 2026 revenue despite Lunar New Year slowdown
Semiconductor packaging and testing material supplier Niching Industrial Corp. reported NT$200 million (approx. US$6.29 million) in revenue for January and February 2026, a year-over-year...
Friday 13 March 2026
AI server tracker: February revenue highlights across testing, design services, and rail kits

The global AI server supply chain continues to demonstrate steady growth, according to February 2026 revenue reports from key companies in the testing,...

Friday 13 March 2026
KYEC reports strong February revenue of NT$3.22 billion

King Yuan Electronics Co. (KYEC), a global leader in semiconductor testing, announced a robust financial performance for February 2026. The company...

Thursday 12 March 2026
Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26
Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first...
Wednesday 11 March 2026
Commentary: Tencent quietly builds WeChat AI agent to reclaim China's super-app lead

Tencent is reportedly developing an AI agent for its flagship messaging platform WeChat, a move that could reshape how users interact...

Wednesday 11 March 2026
ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion
ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...
Wednesday 11 March 2026
JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

Wednesday 11 March 2026
Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...
Wednesday 11 March 2026
Inmax advances into memory supply chain with DDR wafer-level test system
Inmax recently announced that its self-developed DDR wafer-level test system has been adopted by a major DDR memory manufacturer and has successfully been validated for mass production...
Tuesday 10 March 2026
OpenAI to acquire Promptfoo to strengthen security testing for enterprise AI agents
OpenAI said it plans to acquire AI security startup Promptfoo to strengthen safety and evaluation capabilities for enterprise AI agents. The deal aims to integrate automated security...
Tuesday 10 March 2026
MAtek's testing business grows with AI-era chip complexity, but profits fall
MAtek reported record quarterly revenue in the fourth quarter of 2025 amid rising outsourced demand for materials analysis and reliability assurance, but net income after tax declined...
Sunday 8 March 2026
Taiwan and the UK sign space industry pact to deepen supply chain cooperation

Six months after Taiwan and the United Kingdom held their first Taiwan–UK Space Industry Roundtable in Taiwan in September 2025,...

Friday 6 March 2026
Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026
Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such...
Friday 6 March 2026
Supply-chain firms become front-line partners as tech outpaces testing and standards
Rapid iteration in AI and low-earth orbit satellite communications has pushed suppliers to assume design and validation roles, reshaping Taiwan's position in global manufacturing e...
Thursday 5 March 2026
Keysight sees rising AI infrastructure test demand, order-to-ship ratio above 1
Keysight Technologies forecasts rapid growth in AI infrastructure testing and verification through 2026 as deployments expand from chip-level to cluster-scale, Taiwan chairman and...