117 news items tagged wafer fab
Global semiconductor equipment sales to rebound in 2020
Thursday 12 December 2019Global semiconductor manufacturing equipment sales will drop 10.5% to US$57.6 billion in 2019 from last year's historic peak of US$64.4 billion but stage a 2020 recovery and set a...
UMC sees clear growth momentum for 5G in 2020
Monday 2 December 2019Taiwan's pure-play foundry UMC will see clear growth momentum in 2020 come from ever-increasing chips foundry demand for 5G applications, with clients moving actively to pull in shipments...
TSMC Nanjing swings to quarterly profit
Tuesday 26 November 2019TSMC Nanjing Company has reported its first quarterly profit for the third quarter, which narrowed its losses to NT$1.41 billion (US$46.1 million) in the first three quarters of 2019...
Chinese DRAM maker CXMT ramping 19nm process output
Wednesday 13 November 2019China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has managed to improve its 19nm process manufacturing yield rates to satisfactory levels, and is...
TSMC, UMC enjoy ramp-up in China fab utilization rates
Tuesday 5 November 2019Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have both seen their China-based wafer fab utilization rates pick up recently, driven by growing...
AI system value hinges on decision-making capability, says Macronix executive
Friday 1 November 2019In incorporating AI-based systems, enterprises must first determine the real purpose of adopting them and should noy use them merely as a tool for data presentation, otherwise the...
VIS stays cautious
Friday 1 November 2019Vanguard International Semiconductor (VIS) remains cautious about its outlook for the rest of 2019, citing still high inventory levels at its customers, according to the Taiwan-based...
TSMC to accelerate 3nm fab construction
Thursday 24 October 2019TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according...
Wafer capacity by feature size shows rapid growth at sub-10nm
Thursday 17 October 2019Leading-edge processes, defined as sub-28nm technologies, accounted for the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, sub-28nm...
SMIC to move FinFET process to volume production by year-end 2019
Thursday 15 August 2019China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.
Foxconn set to build 12-inch wafer fab in 2020 as IDM
Wednesday 3 July 2019Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...
China memory maker CXMT to roll out 8Gb LPDDR4 DRAM by end-2019
Tuesday 11 June 2019China-based DRAM maker ChangXin Memory Technologies (CXMT) is stepping up DRAM production deployments as it will kick off commercial runs of its production lines by the end of 2019...
New TSMC 8-inch fab to fulfill robust automotive chip orders
Friday 22 March 2019TSMC's new 8-inch wafer fab to be built in Tainan will have its capacity mostly fulfill robust orders for automotive chips from STMicroelectronics and other dedicated chipmakers,...
Lite-On Semi to enjoy double-digit revenue increase in 2Q19
Friday 22 March 2019Lite-On Semiconductor, a maker of discrete and analog IC components, is expected to see its second-quarter revenues register a double-digit sequential growth as it will soon kick...
New SK Hynix China fab nears completion
Wednesday 6 March 2019SK Hynix held recently a "topping out" ceremony to celebrate a major milestone of the construction of its new 8-inch wafer fab in Wuxi, China, according to industry sources. The facility...
200mm fabs to add 700,000 wafers through 2022, says SEMI
Thursday 14 February 2019Robust demand for more content for mobile, Internet of Things (IoT), automotive and industrial applications will drive production of 700,000 200mm wafers from 2019 to 2022, a 14%...
Taiwan maintains largest share of global IC wafer fab capacity, says IC Insights
Thursday 14 February 2019Taiwan led all regions/countries in wafer capacity with 21.8% share, a slight increase from 21.3% in 2017, according to IC Insights. Taiwan first became the global wafer capacity...
Is Globalfoundries seeking a buyer?
Tuesday 12 February 2019Globalfoundries' recent moves have invited speculation that the US pure-play foundry may be looking for a buyer. Does Globalfoundries' majority shareholder, Abu Dhabi's Advanced Technology...
Flash memory remains primary target for semi capex spending, says IC Insights
Monday 14 January 2019The semiconductor industry is expected to allocate the largest portion of its capex spending for flash memory again in 2019, marking the third consecutive year that flash has led...
2018 review and 2019 outlook: Mixed impacts of trade war on East Asia IC firms
Wednesday 9 January 2019The huge annual trade deficit of up to US$375 billion is definitely a major reason for the US to raise tariffs on goods imported from China, but the trade war seems to be more of...
TSMC to build new 8-inch fab capacity
Friday 7 December 2018Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to build a new 8-inch wafer fab at its manufacturing site in Tainan, southern Taiwan to satisfy robust customer...
ASE reportedly to set up IC testing service center in Nanjing
Friday 30 November 2018ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), plans to set up an IC testing service...
SMIC expects to post 7-9% revenue decrease in 4Q18
Thursday 8 November 2018China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 7-9% sequentially in the fourth quarter of 2018, with gross margin...
Winbond set to ramp up 25nm DRAM chip production in 4Q18
Tuesday 30 October 2018Winbond Electronics saw shipments of chips built using 38nm process technology ramp up substantially to account for 24% of the chipmaker's total DRAM sales in the third quarter of...
Winbond starts constructing new 12-inch fab
Wednesday 3 October 2018Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
- Cypress puts wafer fab up for sale (Dec 16) - EE Times
- Authorities bust group stealing Win Semiconductors trade secrets (Oct 6) - Focus Taiwan news channel
- TSMC said to build 12-inch wafer fab in Nanjing, China (Aug 28) - TechNewsDaily
- Indian fab project hires former Globalfoundries executive (Aug 3) - EE Times
- Could India's analog wafer fab be moving south? (Jul 3) - EE Times
- Rohm buys Renesas wafer fab (May 28) - EE Times
- NXP staff strike for more pay (March 3) - EETimes Europe
- Texas Instruments acquires UTAC facility in Chengdu, China (December 19) - Company release
- Construction of 450mm Fab 'Well Underway' (August 15) - EE Times
- Blog: India fab infected by delay bug (July 2) - EE Times