News tagged equipment at DIGITIMES

NEWS TAGGED EQUIPMENT

Thursday 18 June 2026

Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the...

Thursday 18 June 2026

Nichicon raises e-cap prices as supply tightens, costs increase

Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's...

Thursday 18 June 2026

Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027

Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...

Thursday 18 June 2026

Samsung said to open fab data to suppliers in AI factory push

Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers,...

Thursday 18 June 2026

China launches probe into Beidou infrastructure quality scandal

China has launched a probe into a Beidou high-precision smart monitoring project in Shandong, after reports of severe construction...

Thursday 18 June 2026

Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles

Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...

Wednesday 17 June 2026

Tong Yang sees steadier auto parts demand as tariff and conflict risks ease

Tong Yang Group said global auto parts demand could stabilize in the second half of 2026 as tariff uncertainty eases and Middle East tensions cool, a shift that may help restore order...

Wednesday 17 June 2026

D-Link bets on AI therapy robots, targeting 100,000-unit shipments in 2027

D-Link is accelerating its transformation from a networking equipment brand into a broader AI and connectivity company, with CEO CJ Chang saying 2026 will mark the company's "rebirth"...

Wednesday 17 June 2026

Exclusive: Largan taps Han's Laser equipment as optics makers target FAU growth

Taiwan optical leader Largan Precision has disclosed an equipment order worth about NT$650 million (US$20.6 million) from Chinese laser-processing...

Wednesday 17 June 2026

PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth

Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...

Wednesday 17 June 2026

Hiwin unit Matrix Precision deepens Japan cooperation as demand for high-precision gears rises

Matrix Precision, a unit of Hiwin Technologies, said it deepened cooperation with Japan after a delegation from the Japan Gear Manufacturers Association visited its facilities as gear...

Wednesday 17 June 2026

Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity...

Tuesday 16 June 2026

AI chip race sends semiconductor equipment sales to record US$36.55 billion

Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced...

Monday 15 June 2026

CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Monday 15 June 2026

Walsin sees passive component crunch stretching into 2028 as memory shortages weigh

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...

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