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Tuesday 13 October 2026
AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...
Tuesday 13 October 2026
Samsung's US$9B chip expansion faces funding, supply hurdles
Samsung affiliates plan to invest a combined KRW12.26 trillion (approx. US$9.18 billion) in semiconductor operations across South Korea and Vietnam, but the projects face different...
Tuesday 13 October 2026
AMEC chairman warns of AI bubble risk, sees consolidation ahead for China's chip equipment industry
Advanced Micro-Fabrication Equipment (AMEC) chairman and general manager Gerald Yin has warned of a potential AI investment bubble, cautioning that surging demand for chipmaking equipment...
Tuesday 13 October 2026
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools,...
Tuesday 13 October 2026
South Korea's YMT targets fivefold rise in glass-substrate plating capacity
South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
Tuesday 13 October 2026
Wistron expands Taiwan capacity with NT$8 billion investment
Wistron announced plans to invest roughly NT$8 billion (approx. US$250.67 million) to expand its production capacity in Taiwan. On October 12, the board approved an additional capital...
Tuesday 13 October 2026
TSMC power plant funding talks still conceptual, says Taipower
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower)...
Tuesday 13 October 2026
Applied Materials opens R&D center to speed chipmaking for the AI era
Applied Materials has opened its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, positioning the Silicon Valley site as a new hub for...
Tuesday 13 October 2026
Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's...
Tuesday 13 October 2026
Terafab and beyond: Musk's push to fuse silicon, robotics, space into one AI system
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration...
Tuesday 13 October 2026
Foxconn partners on Taiwan-made battery storage systems for 2027 rollout
Tun Green Power partnered with Foxconn, Billion Watts, NoonSpare Energy Technology, and Rich Electric to develop behind-the-meter energy storage systems (ESS) using Taiwan-made lithium...
Tuesday 13 October 2026
BTL sees AI testing surge, schedules extend to 1Q27
Electronic testing laboratory BTL reported September 2026 revenue of NT$87 million (US$2.73 million), up 10.2% year-over-year, as AI server testing projects at its second Guishan plant...
Tuesday 13 October 2026
China's Jinai Tech backed by state, targets 2027 advanced process pilot-line launch with ambition laid upon SEA
China's 15th Five-Year Plan and the Ministry of Industry and Information Technology's strong chip project are accelerating the domestic replacement of semiconductor equipment and materials...
Monday 12 October 2026
Leadsun Greentech enters EV charging with three DC fast-charging sites
Leadsun Greentech has entered Taiwan's electric vehicle charging market by acquiring equipment at three supercharging sites in Hsinchu, Taichung and Yunlin, expanding its renewable...
Monday 12 October 2026
Samsung, SK Hynix accept ASML's 10% price hike in parts, report says
Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries...