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Thursday 10 September 2026
Nanoprinting lithography shifts from round to square, increasing waveguide output
Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
Thursday 10 September 2026
Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
Thursday 10 September 2026
Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion
Wistron and Wiwynn both posted record-high monthly revenue in August 2026 as shipments of artificial intelligence (AI) servers continue to expand. Both companies remain highly confident...
Thursday 10 September 2026
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR...
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
Thursday 10 September 2026
SuperAlloy advances semiconductor aluminum certification
SuperAlloy Industrial, a global automotive wheel supplier, reported August consolidated revenue of NT$550 million (approx. US$17.4 million), up 2.46% from a year earlier, and NT$5.052...
Thursday 10 September 2026
Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
Wednesday 9 September 2026
Enterprise AI spending gives Taiwan's Systex a new growth wing
Systex reported consolidated revenue of NT$5.9 billion (approximately US$187 million) in August 2026, up 61.91% from NT$3.64 billion a year earlier. Revenue for the first eight months...
Wednesday 9 September 2026
Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

Wednesday 9 September 2026
Axcelis to build new Korea manufacturing site in US$35 million expansion
Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip...
Wednesday 9 September 2026
Huawei orchestrates China's DUV lithography push to cut reliance on ASML
Huawei is emerging as a central organiser of China's effort to build a domestic semiconductor equipment supply chain, backing critical lithography suppliers and helping connect them...
Wednesday 9 September 2026
India's HCLTech opens semiconductor lab in Bengaluru to serve global chip supply chains
HCLTech has opened a new semiconductor laboratory in Bengaluru, a move that could matter for chipmakers and device makers worldwide as they look for faster testing, qualification,...
Wednesday 9 September 2026
Arm expands push for agentic AI infrastructure with new Neoverse chip design
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...