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    Tuesday 20 October 2026
    Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking
    Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...
    Tuesday 20 October 2026
    AI server demand lifts Tongtai drilling orders through 2027
    Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure...
    Tuesday 20 October 2026
    Taiwan anchors US chip revival, SEMICON West spotlights trusted partners
    SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting...
    Tuesday 20 October 2026
    AI substrate bottleneck shifts from design to manufacturing
    AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
    Tuesday 20 October 2026
    LGD continues microLED development despite Apple's exit
    LG Display (LGD) has reportedly continued developing microLED technology despite Apple Inc. ending its microLED project, though it has put large-scale mass-production investment on...
    Tuesday 20 October 2026
    Commentary: Samsung's US 2nm ramp faces no room for error
    Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, as Tesla's AI5 chip delivery schedule and...
    Tuesday 20 October 2026
    Hanmi Semiconductor establishes US hub to support AI packaging customers

    Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...

    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency

    Rugged edge computing brand – Cincoze has launched its new external EMC solution, the Power Protection Module (PPM), to further strengthen protection against the...

    Monday 19 October 2026
    ACM Research bets on panel-level packaging and overseas growth as adoption risks persist
    ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
    Monday 19 October 2026
    Foxconn, Mitsubishi Electric form alliance in automotive equipment business
    Foxconn announced on October 16 that it has formed a strategic alliance with Mitsubishi Electric through its investment management subsidiary Lin Yin International Investment. The...
    Monday 19 October 2026
    Von Ardenne's flexible equipment targets unsettled panel-level packaging market
    German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
    Monday 19 October 2026
    Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
    Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
    Monday 19 October 2026
    Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027
    Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese...
    Monday 19 October 2026
    SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
    SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
    Monday 19 October 2026
    Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
    South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
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    Oct 20, 08:00
    CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
    Tuesday 20 October 2026
    CES 2027 Welcomes First-Ever Chilean Global Pavilion
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking