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Wednesday 14 October 2026
300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Wednesday 14 October 2026
BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders

China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising...

Wednesday 14 October 2026
AI computing demand drives water management integration at Tianyi
Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
Wednesday 14 October 2026
Tsang Yow's semiconductor revenue share reaches 12%
Automotive drivetrain manufacturer Tsang Yow reported consolidated revenue of NT$86.36 million (US$2.69 million) in September 2026, down 2.3% month-over-month and 1.24% year-over-year...
Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Wednesday 14 October 2026
ASML's record 3Q26 sales expose a capacity gap for AI chip demand through 2028
ASML reported record third-quarter 2026 net sales of EUR11.7 billion (approx. US$13.1 billion) and net income of EUR5 billion, while warning that its planned supply for 2027 and 2028...
Wednesday 14 October 2026
Broadcom executive says chipmakers must tackle packaging, power limits together
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Wednesday 14 October 2026
Hua Hong forges strategic alliances with four Chinese chip equipment giants
Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
Wednesday 14 October 2026
Adani and Jabil plan 50:50 JV to make AI data center hardware in India
A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up...
Wednesday 14 October 2026
Apple's new home devices tie Siri AI to subscriptions and newer iPhones
The smart home hardware Apple unveiled on October 13 is priced as premium equipment, but the fine print points to two larger goals. The first is to put Siri AI, Apple's new generative...
Wednesday 14 October 2026
LGES diversifies ESS equipment suppliers after Daejin Machinery default, court rehabilitation
LG Energy Solution (LGES) is reportedly restructuring its energy storage system (ESS) battery equipment supply chain after major partner Daejin Machinery entered financial difficulties...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Wednesday 14 October 2026
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast...
Tuesday 13 October 2026
AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...
Tuesday 13 October 2026
Samsung's US$9B chip expansion faces funding, supply hurdles
Samsung affiliates plan to invest a combined KRW12.26 trillion (approx. US$9.18 billion) in semiconductor operations across South Korea and Vietnam, but the projects face different...