CONNECT WITH US
NEWS TAGGED EQUIPMENT
Tuesday 26 May 2026
ASML expands Taiwan hiring and operations to meet advanced chip demand
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV...
Tuesday 26 May 2026
GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI...
Tuesday 26 May 2026
Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks...
Tuesday 26 May 2026
FSP Group partners at COMPUTEX 2026 for AI power opportunities

As Artificial Intelligence (AI) applications rapidly expand from cloud computing to edge computing, smart manufacturing, networking equipment, and AI PCs, stable and...

Monday 25 May 2026
Lam Research CEO: New fabs alone will not solve chip bottlenecks
Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
Monday 25 May 2026
Topco and Bloom Energy install Taiwan's first on-site SOFC low-carbon data center power system
Topco Energy Service, a Topco Group unit, and Bloom Energy installed a 2.6MW solid oxide fuel cell on-site power system at a Taiwan IC design firm's Miaoli data center, creating what...
Monday 25 May 2026
India roundup: India accelerates chip ambitions, but ecosystem gaps remain a key challenge

India is advancing its technology and semiconductor ambitions through new fab projects, packaging...

Saturday 23 May 2026
CXMT IPO puts China's DRAM supply-chain push in focus

CXMT's planned Shanghai listing is becoming more than a test of investor appetite for China's top DRAM maker. It is also putting a spotlight...

Friday 22 May 2026
Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers...
Friday 22 May 2026
Lam Research launches PLP Center of Excellence, replacing wafers with panels
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
Thursday 21 May 2026
US targets Hua Hong's 7nm nodes while China targets South Korean partners to evade sanctions

The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering...

Thursday 21 May 2026
SMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US

China's semiconductor self-sufficiency drive has taken another step forward, with SMIC and Hua Hong Group jointly establishing Shanghai...

Wednesday 20 May 2026
ASML to deliver first High-NA chips within months despite cost concerns
ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
Wednesday 20 May 2026
Tatung boosts North American renewables push with transformer wins and mass-production play
Tatung announced at the IEEE PES T&D 2026 exhibition in Chicago that it has expanded its North American footprint with a mix of large-transformer contracts and mass-production...