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Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
South Korea risks 'HBM 2.0' trap in emerging CPO market
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Monday 31 August 2026
US rallies 24 nations to compete for 6G
The US Department of Commerce's National Telecommunications and Information Administration (NTIA) has launched the "Call to Action for 6G Leadership and Security," bringing together...
Monday 31 August 2026
Musk tackles key AI power bottleneck with in-house turbine foundry
A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
Monday 31 August 2026
Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace
Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test
Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
Exclusive: IC design faces wire bonding bottleneck in 2027
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
Friday 28 August 2026
YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan
Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...
Friday 28 August 2026
Vanguard says Taoyuan fab fire did not disrupt production
Vanguard International Semiconductor said a fire broke out late on August 27 on the roof of its Wafer Fab 3 in Taoyuan City, Taiwan, but the incident caused no major impact on production...
Friday 28 August 2026
Anthropic opens research preview of hardware standard for AI agents
A new hardware standard could make it easier for AI agents to operate laboratory and factory equipment across borders and industries. Anthropic says its Model Hardware Standard aims...
Thursday 27 August 2026
Trump declares emergency over foreign grid equipment, likely eyeing Chinese power hardware
US President Donald Trump signed an executive order on August 26 declaring a national emergency over the security of America's electrical grid. It restricts the purchase, import, and...
Thursday 27 August 2026
Chart: Hyperscale capex dollar is buying less Nvidia than it did one year ago
The five largest cloud operators spent US$181.5 billion on property and equipment in the June quarter, 87% more than a year earlier. Nvidia's hyperscale revenue was US$48.7 billion...
Thursday 27 August 2026
China OLED buildout lifts Korean equipment sales as backlogs grow
Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
Thursday 27 August 2026
Yttek's ground equipment supports FORMOSAT-8 first satellite
Taiwan aerospace communications equipment maker Yttek said its HyperSDR satellite ground-station modem, developed at the request of the Taiwan Space Agency (TASA), successfully received...