Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...

Samsung Electronics and SK Hynix are upgrading their NAND flash factories in China to make chips with more than 200 layers, Reuters reported on October 21, citing four people...

Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...

DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...

AMEC is seeking an entry into South Korea's power semiconductor market through MOCVD equipment trials with SK Keyfoundry and Magnachip. The Chinese equipment supplier holds a large...

PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...

Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...

The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.

Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...

Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure...

SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting...

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...

LG Display (LGD) has reportedly continued developing microLED technology despite Apple Inc. ending its microLED project, though it has put large-scale mass-production investment on...

Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, as Tesla's AI5 chip delivery schedule and...