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    Notebook shipment update, July 2026
    12min ago
    NEWS TAGGED EQUIPMENT
    Monday 14 September 2026
    Beijing municipality bans civilian drones from mid-November
    China's capital, Beijing, is tightening drone controls further, with the municipal legislature approving revisions to the Beijing Regulations on Unmanned Aircraft Management that will...
    Monday 14 September 2026
    AI's energy demand ignites global nuclear rush, straining Taiwan's restart
    A worldwide nuclear comeback, fueled by artificial intelligence data centers and semiconductor demand, is tightening supply chains and labor markets just as Taiwan considers restarting...
    Monday 14 September 2026
    Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

    Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC),...

    Monday 14 September 2026
    Aurotek posts record August revenue on semiconductor, robot shipments

    Taiwanese robotics component maker Aurotek attributed its strong revenue growth in August 2026 to continued robust customer pull-ins...

    Monday 14 September 2026
    Shihlin Electric eyes orders through 2029 as T4 plant starts in 2027

    Shihlin Electric is bullish on continued growth in heavy electrical equipment and energy-related businesses as demand rises for Taiwan...

    Sunday 13 September 2026
    Delays trim CAEC August sales, but UPS demand outlook stays firm

    Changs Ascending Enterprise (CAEC) said some shipments of lithium iron phosphate battery systems used in semiconductor uninterruptible...

    Sunday 13 September 2026
    Taiwan's BTL builds new plant for high-power AI server testing, eyeing 4Q27 launch
    Electronic testing and certification provider BTL Inc. has kicked off construction plans for Guishan Plant 3. The expansion targets high-power testing capacity for AI server systems,...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Saturday 12 September 2026
    Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
    Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
    Friday 11 September 2026
    ASE to buy AOI, AVI equipment from Machvision for NT$334M
    ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection...
    Friday 11 September 2026
    ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
    German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
    Friday 11 September 2026
    Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
    Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
    Friday 11 September 2026
    China's DRAM supply chain clears another materials hurdle
    China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
    Friday 11 September 2026
    FCC closes a chip-level loophole while media debate another White House retreat

    A rule published in the Federal Register on September 11 pushes US communications supply-chain...

    Friday 11 September 2026
    Academia Sinica to open 8-inch quantum chip platform in September 2026

    Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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