SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
A Chinese court has ordered the freezing of more than CNY2.14 billion (approx. US$318 million) in domestic assets belonging to Dutch semiconductor manufacturer Nexperia and its equipment...
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
SEMICON Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
The US Department of Commerce's National Telecommunications and Information Administration (NTIA) has launched the "Call to Action for 6G Leadership and Security," bringing together...
A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...
