China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...
SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by...
Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...
In the past, due to high equipment costs and bulky sizes, thermal imaging technology was predominantly confined to specialized fields such as security surveillance, firefighting...
Japan and France are moving to reduce their reliance on Chinese heavy rare earths, backing a recycling project in southwestern France...
