Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...
SATELLITE 2026, the international satellite industry's premier event, runs from March 23 to 26 in Washington, where Universal Microwave Technology, Inc. will once again engage with...
Automation equipment maker Kenmec Mechanical Engineering and over-the-counter-listed Meta Green Cooling have disclosed that Taipei prosecutors have initiated a public prosecution over...
SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
Micron Technology's planned Singapore expansion, driven by soaring AI memory demand, requires hundreds of transformers, signaling supply constraints that could affect global AI and...
Czech microscopy equipment supplier Tescan is continuing to deepen its presence in the Asia-Pacific market, targeting growing opportunities in semiconductor failure analysis (FA)....
SK Hynix said it has confidentially submitted a registration statement to the US Securities and Exchange Commission for a potential listing of American depositary shares, as part of...
Chinese solar supply chain companies say that Tesla and SpaceX, both led by Elon Musk, are quietly building a dual-track solar strategy spanning Earth and space, an emerging structure...
Eternal Materials expects operations in 2026 to outperform 2025, driven primarily by growth in precision equipment and scaling shipments of semiconductor advanced packaging materials...
Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained...
Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely per...
