CONNECT WITH US
NEWS TAGGED EQUIPMENT
Thursday 12 November 2026
Naver signs US$1.5 billion AI cloud deal with US firm
Naver said on November 12 it had signed a KRW2 trillion (approx. US$1.5 billion) AI computing services contract with a US-based AI inference company, securing its first major customer...
Thursday 12 November 2026
SoftBank rejects Musk's default claim, books JPY597.2B data-center loss
SoftBank Group (SBG) has denied SpaceX CEO Elon Musk's claim on X that the company defaulted after ordering turbines, while saying its AI infrastructure plans remain on track. However,...
Thursday 12 November 2026
DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers
DIGITIMES observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm. Warpage issues in organic substrates have...
Thursday 12 November 2026
DFI targets industrial edge AI, with automation leading 42% of opportunities
Industrial computer (IPC) maker DFI reported higher revenue and profit in the third quarter of 2026, with earnings per share (EPS) reaching NT$1.29 (US$0.039), up sharply from NT$0.66...
Thursday 12 November 2026
Taiwan PCB equipment maker Ta Liang's four-digit backlog sets stage for high-margin TM4 growth
Taiwan-based Ta Liang Technology, a printed circuit board (PCB) equipment manufacturer, said its order visibility for PCB and semiconductor equipment extends through 2027, with its...
Thursday 12 November 2026
Mitsubishi Gas Chemical bets on AI packaging with Thailand BT materials line
Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine)...
Thursday 12 November 2026
Tekscend's cost strategy and global edge
As global foundry capacity expands and market dynamics shift, competitive pressures have intensified significantly across major manufacturing regions, particularly in mature process...
Thursday 12 November 2026
TECO pivots to AI infrastructure services with Japan project
TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and...
Thursday 12 November 2026
ABF substrate shortage to last through 2028 as Wah Lee targets next-gen products
Demand for AI, high-performance computing (HPC), and semiconductors continued to rise, driving Wah Lee Industrial's 3Q26 profit to record-high levels. Gross profit reached NT$2.06...
Thursday 12 November 2026
Samsung, AMD team up to upgrade chip testing
Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with...
Thursday 12 November 2026
Mitsui Kinzoku bets on AI copper foil with JPY190 billion investment in Malaysia plant
Mitsui Kinzoku will invest about JPY190 billion (approx. US$1.2 billion) to build a copper foil plant near its existing Malaysia site, targeting demand from optical communications...
Thursday 12 November 2026
Taiwan mobilizes academic R&D to address post-Moore semiconductor equipment gaps
Taiwan is stepping up efforts to develop next-generation semiconductor research equipment, as conventional commercial tools increasingly fall short of emerging R&D requirements...
Thursday 12 November 2026
SoftBank takes JPY768 billion AI hit, rethinks equipment strategy
SoftBank Group (SBG) posted a JPY768 billion (approximately US$4.85 billion) net loss for the first half of fiscal 2026, from April to September 2026, its first loss in nearly two...
Thursday 12 November 2026
HKC’s Mianyang Gen 6 OLED investment faces delays
China’s HKC has again stalled its OLED expansion, with equipment orders for its Gen 6 OLED line in Mianyang, Sichuan, yet to be placed despite plans for deposition equipment...
Thursday 12 November 2026
Universities aren't factories: Can a hot-rodding spirit drive semiconductor innovation?
The National Science and Technology Council's Department of Engineering and Technologies recently issued a call for proposals encouraging academia to modify expensive semiconductor...