Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening...

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Chief Telecom Inc. said a June 29 search by prosecutors and investigators over an alleged illegal smuggling case involving high-end...

HKC Corporation has debuted on the Shenzhen Stock Exchange main board, cementing a three-way leadership structure in China's display...

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The...

Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing...

ChangXin Memory Technologies has signed a long-term DRAM supply agreement with Tencent Holdings valued at more than CNY20 billion (approx...

Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment...

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring...

Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in...

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...