The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry...
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...
Millimeter-wave phased-array solutions provider Tmytek is set to list on the Innovation Board in September. Although the company has yet to turn profitable, its revenue mix has been...
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
K-Safety Expo 2026, South Korea's leading dedicated safety-industry exhibition, will open September 2 at BEXCO in Busan, bringing together companies, government agencies, research...
Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for...
SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
A Chinese court has ordered the freezing of more than CNY2.14 billion (approx. US$318 million) in domestic assets belonging to Dutch semiconductor manufacturer Nexperia and its equipment...
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
