Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However,...
Myson Century, a subsidiary of Sun Yad Group, signed strategic memorandums of understanding with IXI EW, SafeSky Systems USA, and Global Ordnance Group at the Association of the United...
Strong global demand for AI infrastructure hardware is prompting buyers to secure capacity through advance payments and long-term contracts, driving Taiwan's semiconductor, packaging...
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
As it becomes harder and costlier to shrink transistors, advanced packaging has become the place chip equipment makers look to for their next leg of growth, and ASML appears to be...
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still...
Aurotek Corp. reported record consolidated revenue of NT$1.113 billion (US$34.7 million) in the third quarter of 2026, up 57.93% from a year earlier. Orders from semiconductor, high-end...
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
