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Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
AI server BBU demand triples battery-module capacity ahead of 800V HVDC rollout

Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according...

Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Friday 31 July 2026
CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...
Thursday 30 July 2026
China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
Advantest lifts fiscal 2026 forecast as AI chip test demand surges

Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

Thursday 30 July 2026
Lam Research raises outlook as AI-driven semiconductor demand fuels record revenue and margin expansion
On July 29, Lam Research reported record fiscal fourth-quarter results and issued stronger-than-expected guidance, signaling that rising demand for artificial intelligence is accelerating...
Thursday 30 July 2026
US FCC curbs Chinese inverters and robots, accelerating global shift in connected device security
As power grids, renewable energy systems, and artificial intelligence data centers expand, a new US restriction on Chinese-made inverters and robots could affect suppliers, utilities,...
Wednesday 29 July 2026
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
US blocks new foreign-made robots and power inverters in AI security crackdown

The US has barred new foreign-produced advanced robots and power inverters from receiving regulatory approval, extending its technology...

Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...