CONNECT WITH US
NEWS TAGGED EQUIPMENT
Friday 31 July 2026
Tokyo Electron raises outlook as AI data center spending lifts memory demand
Tokyo Electron lifted its operating profit outlook for April-September 2026 on July 30, citing continued investment in AI data centers and stronger semiconductor capital spending....
Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals

China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed...

Friday 31 July 2026
CHPT raises 2026 capex to NT$500M

Test interface maker Chunghwa Precision Test Tech (CHPT) held an investors' conference on July 29, saying revenue growth in the second...

Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
AI server BBU demand triples battery-module capacity ahead of 800V HVDC rollout

Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according...

Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Friday 31 July 2026
CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...
Thursday 30 July 2026
China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
Advantest lifts fiscal 2026 forecast as AI chip test demand surges

Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

Thursday 30 July 2026
Lam Research raises outlook as AI-driven semiconductor demand fuels record revenue and margin expansion
On July 29, Lam Research reported record fiscal fourth-quarter results and issued stronger-than-expected guidance, signaling that rising demand for artificial intelligence is accelerating...
Thursday 30 July 2026
US FCC curbs Chinese inverters and robots, accelerating global shift in connected device security
As power grids, renewable energy systems, and artificial intelligence data centers expand, a new US restriction on Chinese-made inverters and robots could affect suppliers, utilities,...