News tagged equipment at DIGITIMES

NEWS TAGGED EQUIPMENT

Sunday 6 September 2026

TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy

Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...

Sunday 6 September 2026

Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands

South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...

Sunday 6 September 2026

Tongtai doubles semiconductor orders on AI data-center demand

Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...

Sunday 6 September 2026

Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027

AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...

Sunday 6 September 2026

Trumpf CTO says advanced packaging reshapes semiconductor equipment race

AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...

Saturday 5 September 2026

Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics

Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...

Saturday 5 September 2026

Taiwan semiconductor output targets NT$8 trillion

As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...

Saturday 5 September 2026

SiPh, optical lens demand ignite laser race

Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...

Saturday 5 September 2026

Taiwan satellite ground equipment output grows 13%, nears NT$300B

Taiwan's satellite ground equipment industry posted 13% year-over-year growth in 2025 as local firms push deeper into the low-Earth...

Saturday 5 September 2026

Marketech profits hit record in 1H26 on overseas orders

Marketech International Corp. (MIC) posted record results in the second quarter of 2026, with consolidated revenue of NT$21.2 billion (approx. US$668.6 million), up 48.2% quarter-over-quarter...

Friday 4 September 2026

CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...

Friday 4 September 2026

MSScorps August revenue hits new high on silicon photonics gains

MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...

Friday 4 September 2026

K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap

Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...

Friday 4 September 2026

Ennostar accelerates AI optical communications with micro LED

Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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