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    Chinese startups accelerate into AI glasses as Taiwan faces supply chain pressure
    11h 51min ago
    6-inch SiC substrate prices recover as supply tightens and demand picks up
    11h 51min ago
    South Korean equipment and materials makers accelerate hybrid bonding R&D for HBM5 and beyond
    11h 51min ago
    Taiwanese IC design firms race to capture AI vision solution demand
    11h 51min ago
    GigaDevice flags three key memory variables for the next three years
    11h 51min ago
    NEWS TAGGED EQUIPMENT
    Monday 13 July 2026
    Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

    Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced...

    Monday 13 July 2026
    Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
    Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the...
    Monday 13 July 2026
    Applied Materials India eyes larger role in global chip equipment development
    Applied Materials India is preparing to take on broader ownership of selected semiconductor equipment product initiatives, as the US-based chipmaking equipment supplier expands its...
    Monday 13 July 2026
    AI, LEO, and broadband upgrades lift Taiwan networking makers

    Taiwan networking equipment makers posted strong results in June 2026, with rising demand for AI data center expansions, high-speed...

    Monday 13 July 2026
    CPO mass production accelerates new four-stage test equipment market
    AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
    Monday 13 July 2026
    SK Hynix hybrid bonding push signals next phase of HBM packaging race
    SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
    Sunday 12 July 2026
    Hermes Testing's June revenue more than doubles as advanced chip test demand surges
    Hermes Testing Solutions said that its June 2026 revenue jumped sharply as rising demand for advanced chip testing lifted sales of its custom products, cleaning materials, and engineering...
    Saturday 11 July 2026
    China's display makers raise billions to close the OLED gap — and South Korea is watching
    Chinese display panel and materials companies are tapping capital markets to fund next-generation OLED, oxide and Mini LED technologies, drawing close attention from South Korea's...
    Friday 10 July 2026
    Largan samples CPO product in July 2026, eyes GC edge
    Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
    Friday 10 July 2026
    SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
    SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
    Friday 10 July 2026
    Acer unit Highpoint posts record first-half revenue on Asia-Pacific growth
    Highpoint Service Network (HSN), a subsidiary of Acer, posted record revenue for the second quarter and first half of 2026 as sales grew across its Asia-Pacific operations.
    Friday 10 July 2026
    TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

    TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

    Friday 10 July 2026
    Huawei joins China Mobile, Baidu to build China's first NPO optical interconnect standard

    Huawei has joined more than 20 Chinese technology companies and research bodies to launch OPEN NPO, the country's first multi-source agreement...

    Friday 10 July 2026
    Taiwan seeks a bigger role in the global LEO satellite race

    As the global low-Earth orbit (LEO) satellite industry enters a new phase of rapid expansion, Taiwan faces a pivotal opportunity to...

    Friday 10 July 2026
    GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs
    GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    AI Summit Seoul