ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection...
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
Wistron and Wiwynn both posted record-high monthly revenue in August 2026 as shipments of artificial intelligence (AI) servers continue to expand. Both companies remain highly confident...
At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR...
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
SuperAlloy Industrial, a global automotive wheel supplier, reported August consolidated revenue of NT$550 million (approx. US$17.4 million), up 2.46% from a year earlier, and NT$5.052...
Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
