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Wednesday 28 October 2026
SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade
Solidigm, the US-based subsidiary of SK Hynix, is in talks with the US Department of Commerce over a potential US$45 billion investment in a new NAND flash memory fabrication plant,...
Wednesday 28 October 2026
Unimicron steers resources to Taiwan AI substrates with NT$50.9B equipment orders, Japan unit sale
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Wednesday 28 October 2026
Semiconductor equipment is not AI chip growth's biggest bottleneck
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
Wednesday 28 October 2026
MiCo Ceramics acquires idle LGD plant for KRW150 billion to boost semiconductor component capacity
South Korean semiconductor equipment component maker MiCo Ceramics is set to acquire an idle facility in Gumi, North Gyeongsang Province, from LG Display (LGD) for KRW150 billion (approx...
Wednesday 28 October 2026
SpaceX turns Nvidia GPUs into long-duration assets with US$40 billion Apollo deal
The momentum surrounding chip financing is being met with a subtler but increasingly consequential shift in how AI infrastructure is funded, as technology giants expand compute commitments...
Tuesday 27 October 2026
JIMTOF 2026 draws 94 Taiwan machine tool exhibitors
One of the world's three major machine tool shows, Japan's International Machine Tool Fair (JIMTOF 2026), opened this week, with 94 Taiwan companies exhibiting. The exhibitors are...
Tuesday 27 October 2026
AI data centers drive cooling, power, modular infrastructure demand
As AI server computing density and server rack power consumption rise, data center construction must also take into account cooling, power distribution, energy management, and electromechanical...
Tuesday 27 October 2026
Mitsubishi Materials scales thermistor capacity sixfold amid AI boom
Mitsubishi Materials will expand production of thermistors, temperature sensors used in optical communications equipment, as the spread of generative AI drives demand for optical transceivers...
Tuesday 27 October 2026
Fujifilm expands South Korean capacity to meet AI chip demand
Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek...
Tuesday 27 October 2026
Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge
Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced...
Tuesday 27 October 2026
Vietnam's first fab reportedly faces doubts over 2027 target
Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer...
Tuesday 27 October 2026
Tamil Nadu adds independent chip subsidy route as Indian states vie for investment
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
Tuesday 27 October 2026
Celestica's AI growth puts capacity in focus as revenue outlook reaches US$40 billion
Celestica's latest results suggest that its next challenge will be expanding production fast enough to serve AI infrastructure customers while keeping cash requirements under control...
Tuesday 27 October 2026
Sunic System wins overseas OLEDoS equipment order
As AI expands into wearable devices, South Korean OLED deposition equipment maker Sunic System has secured another overseas order for OLEDoS (OLED on Silicon) deposition equipment,...
Monday 26 October 2026
Taiwan wafer-testing supplier Hermes Testing Solutions commits more than US$215 million to advanced chip testing expansion
Hermes Testing Solutions Inc. (HTSI), a semiconductor wafer-testing solutions provider, is expanding its Taiwan operations. Its board approved budget authorisations on October 22 for...