Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation...
Participation in the Global Pavilion at the upcoming SEMICON Taiwan 2026 has reached a new high, with the number of participating countries...
Kyushu's semiconductor production, investment and hiring have risen sharply since TSMC announced its Kumamoto expansion, but local companies...
TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion...
Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools,...
TSMC continues to expand its investment in Arizona, accelerating not only the relocation of semiconductor equipment and materials suppliers...
Zeiss, the exclusive supplier of ASML's extreme ultraviolet (EUV) optical systems, says the two companies operate as though they were...
