Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies...

TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...

AUO Group's AET SustainTek, formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly entered...

South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology...

Network equipment maker Alpha Networks said it has teamed up with Taiwan's Industrial Technology Research Institute (ITRI) and Chen Lung Technology to jointly advance the "B5G/Pre-6G...

Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai...

The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry...

Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...

TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...

Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...

On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...