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Thursday 4 June 2026
Formosa Chemicals moves into AI data center materials and DUV photoresist precursors
Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The...
Thursday 4 June 2026
Huawei's MineHarmony OS links 935 mining devices in China's smart mining push
Huawei's MineHarmony (Mine Harmony OS), a mining-focused industrial Internet of Things operating system jointly developed with China Energy Group, has surpassed 200 ecosystem partners...
Thursday 4 June 2026
BOE races Samsung for Gen 8.6 OLED title despite low yield

BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display...

Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs...

Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
Pegatron's Chairman sees a future where AI can think and act
As the artificial intelligence industry moves beyond chatbots and text generation, a new question is emerging: what happens when AI can act on the physical world, not just understand...
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Wednesday 3 June 2026
Kentec aims to shorten the timeline for AI data center deployment
As artificial intelligence (AI) infrastructure grows larger and more complex, the challenge is no longer simply building data centers. It is building them fast enough.
Wednesday 3 June 2026
Middle East war drives LME aluminum to 4-year high, squeezing chip equipment margins
Rising global geopolitical risk and tightening supply in some markets have pushed London Metal Exchange (LME) aluminum prices higher in volatile trading, adding cost pressures to industries...
Tuesday 2 June 2026
South Korea cuts EUV equipment approvals to speed Samsung and SK Hynix expansion
South Korea's Ministry of Trade, Industry, and Energy announced on June 2, 2026, that it would sharply streamline domestic approval procedures for extreme ultraviolet equipment used...
Monday 1 June 2026
SK Hynix Cheongju plant fire triggers HF leak
SK Hynix's Cheongju campus was hit by a fire on June 1, 2026, prompting the emergency evacuation of all 3,600 workers from the M15 and M15X plants. Seven people were taken to the hospital...
Sunday 31 May 2026
GIS takes AR and optical communication opportunities to pave transformation
Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in...
Sunday 31 May 2026
Senao Networks projects 2026 growth as ISP expansion offsets memory shortage risks
Networking equipment maker Senao Networks reported that shareholders approved its 2025 financial report and a cash dividend of NT$3 (US$0.096) per share at a meeting on May 28, 2026,...
Sunday 31 May 2026
AI demand and chip investment lift Taiwan exports and business outlook
Taiwan's economic outlook improved in April 2026 as rising AI demand and receding Middle East geopolitical risks boosted manufacturers' business sentiment, the National Development...
Sunday 31 May 2026
Winbond accelerates custom memory transition
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply...