中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Notebook brands shift production back to China as Southeast Asia costs rise
    12min ago
    WRC 2026 spotlights five robotics trends as robots go to work
    15min ago
    Nvidia server prices to rise up to 17% as memory costs climb
    16min ago
    NEWS TAGGED EQUIPMENT
    Monday 24 August 2026
    Taiwan semiconductor materials team up to build local supply chain

    Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies...

    Monday 24 August 2026
    India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
    India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
    Saturday 22 August 2026
    Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model
    As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
    Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving...
    Friday 21 August 2026
    Hiwin expands into CPO optical coupling process; 2H26 robotics revenue outlook brightens
    Hiwin Technologies Chairman Eric Y. T. Chuo stated that the company has supplied samples of miniature ball screws and single-axis robots to co-packaged optics (CPO) vendors across...
    Friday 21 August 2026
    CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
    Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
    Friday 21 August 2026
    Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
    Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring...
    Thursday 20 August 2026
    China reportedly delays germanium, quartz clearances, impacting Taiwan optics and aerospace suppliers
    China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery...
    Thursday 20 August 2026
    AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
    Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating...
    Thursday 20 August 2026
    Jusung, PSK China sales plunge over 40% amid China's chip self-sufficiency drive

    Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

    Thursday 20 August 2026
    Nvidia, TSMC, chip gear makers ride AI boom into high-margin club
    Strong AI demand is driving a wave of high profitability across the semiconductor supply chain, with equipment and materials suppliers increasingly joining a "high-margin club." Trailing...
    Thursday 20 August 2026
    Delta expands AI automation push into robotics, semiconductors, machinery

    Delta Electronics outlined a broader AI strategy at the Taipei International Industrial Automation Exhibition on August 19, unveiling...

    Thursday 20 August 2026
    Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
    Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
    Thursday 20 August 2026
    CXMT planned to use Samsung process data to develop DRAM, ex-engineer says
    A former Samsung Electronics researcher has testified that ChangXin Memory Technologies (CXMT) intended from its earliest days to develop DRAM using Samsung process data, an account...
    1/75 pages
    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
    reportAIglasses