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Thursday 5 November 2026
Price hikes, market saturation curb global telecom, consumer electronics export growth
Rising global oil prices have driven up food costs, squeezing consumer discretionary budgets for products with higher price elasticity, such as smartphones and consumer electronics...
Thursday 5 November 2026
Samsung reportedly plans 2nm fab to boost HBM base-die output
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
Thursday 5 November 2026
Winbond approves US$2.2 billion fab expansion, seeks long-term deals with 10 customers
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares...
Thursday 5 November 2026
QuantumDiamonds targets HBM defects as it develops inline inspection tool
German quantum-sensing startup QuantumDiamonds has tested its technology on high-bandwidth memory (HBM) devices, including cases involving individual through-silicon via (TSV) failures,...
Thursday 5 November 2026
FPT starts chip-testing plant trials in northern Vietnam, plans packaging expansion
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Thursday 5 November 2026
Taiwan-Netherlands launch four photonics R&D partnerships
Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging,...
Thursday 5 November 2026
DIGITIMES Insight: TSMC, ASML's 2031 photomask target puts High NA EUV suppliers on the clock
ASML and TSMC announced plans in September 2026, ahead of the SPIE BACUS symposium, to advance high-numerical-aperture extreme ultraviolet (High NA EUV) lithography by replacing the...
Thursday 5 November 2026
AI squeezes chip component capacity as Zyxel flags longer lead times, higher memory costs
Slowing capex by global telecom operators and surging prices for memory and other components weakened Taiwan-based networking equipment maker Zyxel Group's operations in the third...
Thursday 5 November 2026
Nvidia DSX POD leads modular wave as Taiwanese firms race into AI data-center integration
As AI data center construction continues to scale up, shortening build times and bringing computing capacity online faster have become key priorities for cloud service providers (CSPs)...
Thursday 5 November 2026
Subsidies pave the way as cheap cells squeeze Taiwan's energy storage players into a profit battle
With Taiwan's electricity prices poised to rise, large power users set to bear the brunt, and the government planning to broaden the definition of large power users, pairing electricity...
Wednesday 4 November 2026
Apple eyes sputtered HMO process for next-gen OLED
Apple is reportedly developing high-mobility oxide (HMO) technology for next-generation OLED displays and evaluating it at its own research facilities in Taiwan. Although the mass-production...
Wednesday 4 November 2026
South Korean chipmakers face financing dilemma behind AI memory demand
Samsung Electronics' and SK Hynix's dependence on sustained AI infrastructure spending is bringing customer financing risk into focus. As demand for high-bandwidth memory and server...
Wednesday 4 November 2026
US chip curbs on China complicate SK Hynix's US$45 billion NAND plan
SK Hynix's plans for a US$45 billion NAND investment in New York face a regulatory hurdle as Washington holds back approval for American chipmaking equipment needed at the company's...
Wednesday 4 November 2026
Tech giants commit over US$3 trillion as AI infrastructure faces funding, power test
Alphabet, Meta Platforms, Microsoft, Amazon, and Oracle have disclosed more than US$3 trillion in future commitments for leases, equipment purchases, energy, and construction as the...
Wednesday 4 November 2026
Screen doubles investment as Kyoto equipment site takes shape
Screen Holdings is expanding production of semiconductor cleaning equipment with a JPY25 billion (US$157.53 million) site in Nagaokakyo, Kyoto, while raising its capex budget for the...