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Wednesday 24 June 2026
High memory prices and weak demand hinder revenue of CyberTAN in advancing into AI and Wi-Fi 7
CyberTAN Technology said rising memory prices have dampened customer orders and softened recent revenue, a sign that global electronics demand remains cautious. The networking equipment...
Wednesday 24 June 2026
China's chip-equipment push starts to weigh on Japanese suppliers

China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with...

Wednesday 24 June 2026
VFT targets semiconductors, foldable display, energy materials

Optical film and nano-coating materials developer Victory For Technology (VFT) is focusing on three key areas — AI and semiconductor...

Wednesday 24 June 2026
FSC sees higher-margin orders as low-carbon demand boosts equipment sales
Fu Chun Shin Machinery (FSC Group) reported stronger revenue and profitability in 2025, driven by growing demand for low-carbon and smart manufacturing solutions. At its June 22 shareholders...
Wednesday 24 June 2026
China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
Wednesday 24 June 2026
Spectrum Electrics opens Taoyuan plant to boost power equipment push and North America orders
Spectrum Electrics opened its Guanyin second plant in Taoyuan on June 23, marking a strategic shift toward power equipment and electromechanical operations as the firm pursues overseas...
Wednesday 24 June 2026
Samsung's Texas fab gains momentum with the arrival of ASML engineers

Samsung Electronics' foundry plant in Taylor, Texas, is showing signs of moving into equipment-level execution. Key engineers from ASML...

Tuesday 23 June 2026
Huawei renews Wi-Fi 6 patent push, putting networking equipment makers on alert

Huawei has continued to pursue patent litigation against networking equipment makers in Europe in recent years, with its latest case...

Tuesday 23 June 2026
NYCU, Phison join forces to build AI heterogeneous computing resource management platform
Taiwan's National Yang Ming Chiao Tung University (NYCU) and Phison Electronics are teaming up to build a GPU resource management platform to improve the efficiency of computing resource...
Tuesday 23 June 2026
Chinese Premier Li Qiang puts China's advanced manufacturing agenda on display before Summer Davos
Chinese Premier Li Qiang will attend Summer Davos 2026, to be held from June 23 to 25 in Dalian, Liaoning province. The forum, formally the Annual Meeting of the New Champions, will...
Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
LTO Batteries power up industrial electrification: Taiwan and South Korea players widen global deployments
Lithium titanate oxide (LTO) batteries are emerging as a promising solution for industrial electrification and critical energy infrastructure, where safety, rapid charging and long...
Tuesday 23 June 2026
TECO, Billion Watts and Tun Green Power form JV to develop Australia solar and storage projects
TECO Electric & Machinery's Australia unit, Billion Watts, and Tun Green Power announced a strategic partnership to develop the Seaspray solar and battery energy storage project...
Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...