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Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Cica-Huntek opens Arizona plant to support advanced chip manufacturing in the US
Cica-Huntek Chemical Technology said on July 16 that its subsidiary facility in Phoenix, Arizona, had been completed and officially opened after about US$8 million in investment. The...
Thursday 16 July 2026
Hanmi, Hanwha clash in court over HBM equipment patents
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
Thursday 16 July 2026
Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

Thursday 16 July 2026
CXMT's US$8.5 billion IPO signals China's accelerating challenge to global memory leaders
CXMT's Shanghai debut could reshape global memory markets by speeding China's push into advanced DRAM and HBM, while highlighting how US export controls are altering the industry's...
Wednesday 15 July 2026
PSMC lifts DRAM foundry prices 45% as 3D AI Foundry targets 20% revenue share
Major cloud service providers (CSPs) have front-loaded purchases of future DRAM capacity, and the global memory supply-demand gap is expected to last through 2027. Powerchip Semiconductor...
Wednesday 15 July 2026
Global semiconductor equipment sales set to hit record US$165.9B in 2026
Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
Wednesday 15 July 2026
SK Hynix reportedly starts ordering equipment for Yongin fab, plans 20,000 wafers a month

SK Hynix has begun placing orders with major suppliers for advanced DRAM manufacturing equipment for the first phase of its Yongin...

Wednesday 15 July 2026
AI computing demand lifts fiber prices and volume

AI data-center buildouts are driving global demand for high-speed optical interconnects and triggering a new round of capacity expansion...

Wednesday 15 July 2026
Nvidia looks to Mitsubishi Heavy for cooling and power as Japan's AI buildout accelerates
Nvidia and Mitsubishi Heavy Industries are weighing a partnership under which the Japanese industrial group would supply cooling systems and energy management equipment for the artificial-intelligence...
Wednesday 15 July 2026
Huawei's US$11B clean energy business turns Brazil into its next growth engine

Huawei Technologies is becoming an increasingly important supplier to the global energy transition, expanding beyond telecommunications...

Tuesday 14 July 2026
Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards

The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation...

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an...
Tuesday 14 July 2026
Intel concentrates its European chipmaking in Ireland with EUR5 billion Leixlip expansion
Intel is doubling down on Ireland as the anchor of its European manufacturing base, committing EUR5 billion (US$5.7 billion) to expand its Leixlip campus barely a year after scrapping...
Tuesday 14 July 2026
Gemtek says optical module ramp will drive growth from 2027
Gemtek Technology said its high-speed optical module business is set to become a major growth driver from 2027, after a business model transition weighed on first-half revenue. The...