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Monday 21 September 2026
Samsung builds fab robot team, targets chip equipment maintenance

Samsung Electronics has formed a dedicated organization to develop and deploy robots in its semiconductor fabs, with equipment preventive...

Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
This week's reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk's unusual engineering push in Korea and Google's...
Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Monday 21 September 2026
ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth

ACM Research Shanghai is staking its growth case on two developments: planned tool installations at customers outside mainland China...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Sunday 20 September 2026
Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips

Taiwan's listed semiconductor equipment, components, and solutions suppliers are growing at nearly twice the pace of the chipmakers...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Friday 18 September 2026
Chip equipment makers face waits of up to 40 months for critical parts
The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate...
Friday 18 September 2026
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied...
Friday 18 September 2026
Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented...
Friday 18 September 2026
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...
Friday 18 September 2026
Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push
Samsung Display (SDC) is reportedly preparing to invest about KRW 300 billion in a 12-inch RGB OLED-on-Silicon (OLEDoS) production line, moving the next-generation microdisplay technology...