News tagged equipment at DIGITIMES

NEWS TAGGED EQUIPMENT

Sunday 6 September 2026

Trumpf CTO says advanced packaging reshapes semiconductor equipment race

AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...

Saturday 5 September 2026

Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics

Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...

Saturday 5 September 2026

Taiwan semiconductor output targets NT$8 trillion

As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...

Saturday 5 September 2026

SiPh, optical lens demand ignite laser race

Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...

Saturday 5 September 2026

Taiwan satellite ground equipment output grows 13%, nears NT$300B

Taiwan's satellite ground equipment industry posted 13% year-over-year growth in 2025 as local firms push deeper into the low-Earth...

Saturday 5 September 2026

Marketech profits hit record in 1H26 on overseas orders

Marketech International Corp. (MIC) posted record results in the second quarter of 2026, with consolidated revenue of NT$21.2 billion (approx. US$668.6 million), up 48.2% quarter-over-quarter...

Friday 4 September 2026

CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...

Friday 4 September 2026

MSScorps August revenue hits new high on silicon photonics gains

MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...

Friday 4 September 2026

K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap

Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...

Friday 4 September 2026

Ennostar accelerates AI optical communications with micro LED

Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...

Friday 4 September 2026

Kyocera completes Nagasaki plant for semiconductor ceramics and packages

Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor...

Friday 4 September 2026

China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls

China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...

Friday 4 September 2026

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...

Friday 4 September 2026

Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins

Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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