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Friday 10 July 2026
Largan samples CPO product in July 2026, eyes GC edge
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
Friday 10 July 2026
Acer unit Highpoint posts record first-half revenue on Asia-Pacific growth
Highpoint Service Network (HSN), a subsidiary of Acer, posted record revenue for the second quarter and first half of 2026 as sales grew across its Asia-Pacific operations.
Friday 10 July 2026
TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026
Huawei joins China Mobile, Baidu to build China's first NPO optical interconnect standard

Huawei has joined more than 20 Chinese technology companies and research bodies to launch OPEN NPO, the country's first multi-source agreement...

Friday 10 July 2026
Taiwan seeks a bigger role in the global LEO satellite race

As the global low-Earth orbit (LEO) satellite industry enters a new phase of rapid expansion, Taiwan faces a pivotal opportunity to...

Friday 10 July 2026
GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...
Friday 10 July 2026
Meta readies Iris chip, locks in supply for push to 14 gigawatts
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion...
Friday 10 July 2026
Liteon Technology June revenue jumps 37% on AI server power demand
Liteon Technology reported consolidated revenue of NT$18.7 billion (US$580 million) in June 2026, up 8% from May and 37% from a year earlier, as demand for AI and cloud computing high-end...
Friday 10 July 2026
E&R Engineering advances glass substrate pilot production to 2H27
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global...
Friday 10 July 2026
D-Link wins SpaceX, German telecom orders in supply-chain and 4G push

D-Link Corporation has secured supply-chain access to SpaceX and won a separate 4G fixed wireless access order in Germany, underscoring...

Friday 10 July 2026
TSMC, ASML, and Imec target 2D chip mass production in Taiwan within five years

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor...

Thursday 9 July 2026
CXMT IPO leaves HBM off the funding list, tempering China AI memory hype

CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into...

Thursday 9 July 2026
Edom posts record first-half revenue on AI and networking demand
Edom Technology reported record first-half revenue for 2026, driven by rising demand for AI servers and networking equipment. The IC distributor said June consolidated revenue reached...
Thursday 9 July 2026
SK Hynix supplier talks show AI memory boom shifting pricing power

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...