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Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains

As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

Wednesday 2 September 2026
Tmytek to list on Innovation Board in September on antenna module growth
Millimeter-wave phased-array solutions provider Tmytek is set to list on the Innovation Board in September. Although the company has yet to turn profitable, its revenue mix has been...
Tuesday 1 September 2026
Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
Tuesday 1 September 2026
K-Safety Expo 2026 to open in Busan, spotlighting AI-driven safety technologies
K-Safety Expo 2026, South Korea's leading dedicated safety-industry exhibition, will open September 2 at BEXCO in Busan, bringing together companies, government agencies, research...
Tuesday 1 September 2026
Trymax lands multi-year AOI order as InP laser capacity race tightens
Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for...
Tuesday 1 September 2026
SEMI lifts 2028 wafer fab equipment forecast to US$220 billion
SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
Tuesday 1 September 2026
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
A Chinese court has ordered the freezing of more than CNY2.14 billion (approx. US$318 million) in domestic assets belonging to Dutch semiconductor manufacturer Nexperia and its equipment...
Tuesday 1 September 2026
TSMC delays CoWoS orders as CoPoS plans take shape
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Tuesday 1 September 2026
Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
Tuesday 1 September 2026
Taiwan's G2C+ Alliance members target global markets
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
Tuesday 1 September 2026
Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
South Korea risks 'HBM 2.0' trap in emerging CPO market
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Monday 31 August 2026
US rallies 24 nations to compete for 6G
The US Department of Commerce's National Telecommunications and Information Administration (NTIA) has launched the "Call to Action for 6G Leadership and Security," bringing together...