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Wednesday 17 June 2026
Tong Yang sees steadier auto parts demand as tariff and conflict risks ease
Tong Yang Group said global auto parts demand could stabilize in the second half of 2026 as tariff uncertainty eases and Middle East tensions cool, a shift that may help restore order...
Wednesday 17 June 2026
D-Link bets on AI therapy robots, targeting 100,000-unit shipments in 2027
D-Link is accelerating its transformation from a networking equipment brand into a broader AI and connectivity company, with CEO CJ Chang saying 2026 will mark the company's "rebirth"...
Wednesday 17 June 2026
Exclusive: Largan taps Han's Laser equipment as optics makers target FAU growth

Taiwan optical leader Largan Precision has disclosed an equipment order worth about NT$650 million (US$20.6 million) from Chinese laser-processing...

Wednesday 17 June 2026
PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth
Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...
Wednesday 17 June 2026
Hiwin unit Matrix Precision deepens Japan cooperation as demand for high-precision gears rises
Matrix Precision, a unit of Hiwin Technologies, said it deepened cooperation with Japan after a delegation from the Japan Gear Manufacturers Association visited its facilities as gear...
Wednesday 17 June 2026
Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity...

Tuesday 16 June 2026
AI chip race sends semiconductor equipment sales to record US$36.55 billion
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced...
Monday 15 June 2026
CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Monday 15 June 2026
Walsin sees passive component crunch stretching into 2028 as memory shortages weigh

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...

Monday 15 June 2026
Galatek opens Penang hub to meet surging semiconductor equipment demand

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor...

Monday 15 June 2026
South Korea's chip equipment players ride the HBM4 wave

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

Monday 15 June 2026
Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...

Monday 15 June 2026
AI server tracker: Taiwan's AI supply chain posts triple-digit gains in May as server makers and memory chips surge
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure...
Monday 15 June 2026
AI power race lifts transformer demand, gives Fortune Electric pricing edge
AI-driven demand for power infrastructure is pushing up transformer demand, while long lead times at global giants such as Siemens, ABB, and GE are reshaping bargaining power across...
Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...