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Tuesday 6 October 2026
China's 15th five-year plan elevates PCB role in AI supply chains
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have released the 15th Five-Year Plan for the development of the electronic...
Tuesday 6 October 2026
TSMC expansion pushes Da Yi Cheng Technology's orders over NT$10 billion, visibility through 2028
Da Yi Cheng Technology (DYC) has rapidly expanded in recent years, benefiting from the global semiconductor capacity expansion wave, which has driven demand for second-phase electrical...
Tuesday 6 October 2026
LB Semicon expands power chip capacity as Qualcomm production ramps up
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce...
Tuesday 6 October 2026
China's glass substrate ramp-up outpaces South Korea with WG Tech targeting 1M sqm
China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1...
Tuesday 6 October 2026
LinkCom eyes 4Q26 rebound on smart meter, wireless charging demand
Magnetic components maker LinkCom Manufacturing posted September consolidated revenue of NT$44.18 million (approx. US$1.39 million), up 32.53% from a month earlier and down 10.24%...
Monday 5 October 2026
China's ASML DUV stockpile spurs calls to close export-control loophole
Chinese semiconductor manufacturers have stockpiled hundreds of immersion deep ultraviolet (DUV) lithography systems worth billions of dollars in recent years, prompting a Washington...
Monday 5 October 2026
Exclusive: A*STAR IME's Yu-chieh Chien targets next-gen SiC through 8-inch R&D, reliability gains

Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien,...

Monday 5 October 2026
TSMC emerges as potential Terafab partner as suppliers see over 80% chance of Musk deal
Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium,...
Monday 5 October 2026
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
Friday 2 October 2026
ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform
ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...
Friday 2 October 2026
China turns to 3D packaging to push AI performance beyond front-end scaling limits
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
Friday 2 October 2026
Micron ramps up HBM capacity at Taiwan's four major sites
Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than...
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Friday 2 October 2026
Taiwan government backs 7 semiconductor schools to upgrade equipment
To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme...
Friday 2 October 2026
TSMC, NTU deepen R&D ties through nearly 50 projects a year
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...