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Monday 2 November 2026
Musk may let TSMC run his Texas chip fab as his go-it-alone plan stalls
Elon Musk is reportedly reconsidering his approach to collaborating with TSMC on the Terafab project, signaling a potential shift from his original ambition to independently build...
Monday 2 November 2026
India roundup: India accelerates semiconductor push as states, chipmakers and equipment suppliers expand investment

India's semiconductor ambitions are gathering momentum as states launch new subsidies, chipmakers weigh fabs, global suppliers consider manufacturing,...

Monday 2 November 2026
Humanoid robots, robotaxis take center stage at Korea's FIX 2026
South Korean companies showcased humanoid robot components, dual-arm machines, and autonomous driving systems at FIX 2026 in Daegu, offering a look at how developers are bringing automation...
Sunday 1 November 2026
The 20% problem: why Taiwan's imported equipment parts still carry 70% of the cost
Taiwan can manufacture some of the world's most advanced chips, package them into increasingly complex AI systems, and connect much of the surrounding electronics supply chain within...
Sunday 1 November 2026
Foxconn expands AI deployment with smart manufacturing across sites worldwide
As part of its efforts to harness AI for tangible benefits, Foxconn is integrating AI models, computing infrastructure, factory management, and automation equipment to build a model...
Sunday 1 November 2026
Six decades in the making: Why the world can't easily copy Taiwan's chip ecosystem
Taiwan's semiconductor strength is often described today through leading-edge process nodes, advanced packaging capacity, or its pivotal role in the global AI supply chain. At the...
Saturday 31 October 2026
Ibiden expands AI packaging substrate capacity for Intel from 2029
Ibiden on October 29 raised its fiscal 2026 forecast, projecting consolidated net profit to rise 40% year-over-year to JPY89 billion (US$563 million) and revenue to increase 36% to...
Saturday 31 October 2026
DIGITIMES Insight: Arm extends from IP licensing to server CPU products, with strong growth potential in China
Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI)...
Friday 30 October 2026
HHTD 26: Mitsubishi Electric Mobility to join Foxconn in 2027, targeting JPY1T revenue by 2030
Speaking at Hon Hai Tech Day (HHTD 26), Kazunori Tanaka, Representative Director and President of Mitsubishi Electric Mobility, emphasized that the company's core competitiveness in...
Friday 30 October 2026
C Sun Mfg invests in Nemstek to expand advanced packaging equipment
C Sun Mfg announced on October 30 that it would subscribe for 1,900 lots of Nemstek's privately placed common shares as a strategic investor, giving it an expected stake of approximately...
Friday 30 October 2026
KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers
KLA Corporation, the US maker of semiconductor inspection and metrology equipment, is evaluating a manufacturing foray in India and is considering one or two applications under the...
Friday 30 October 2026
Intel tells Taiwan's chip suppliers to build service capacity early
Intel told Taiwanese chip equipment and materials suppliers that they need spare parts and service capability in place early if they want its business. The company said this at a supplier...
Friday 30 October 2026
Trump targets foreign robotics imports under Section 232, citing national security risks
Citing a grave threat to national security and the vulnerability of American critical infrastructure, President Donald J. Trump has directed the Secretary of Commerce and the US Trade...
Friday 30 October 2026
Doosan Enerbility expands AI power push with US gas turbine orders, next-gen nuclear
Doosan Enerbility is strengthening its position in the AI-driven power infrastructure market, backed by 12 gas turbine orders in the US and an expanding nuclear energy portfolio. At...
Friday 30 October 2026
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.