Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic...
Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages...
YMTC's parent company, CCSH Corporation, had planned to raise CNY33 billion (approx. US$4.93 billion) through an IPO on Shanghai's STAR Market to finance production-line upgrades and...
V5 Technologies, a major provider of advanced semiconductor optical inspection and image-processing software, reported consolidated revenue of NT$316 million (US$9.61 million) in October...
Optoelectronic chip testing equipment maker EnliTech reported self-assessed consolidated revenue of approximately NT$51.504 million (US$1.57 million) in October 2026, up 71.33% year...
At Hon Hai Tech Day 2026 (HHTD 26), Foxconn showcased the Nvidia DSX POD containerized solution. By leveraging factory pre-building, electromechanical integration, and pre-testing,...
Industrial PC leader Advantech reported record quarterly revenue and net profit for the third quarter of 2026, propelled by strong demand across semiconductor equipment, factory automation,...
Advantech expects strong growth in 2027, identifying semiconductor equipment, edge AI and robotics as its principal growth engines. The Taiwanese industrial computing company reported...
Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers...
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and...
Rising global oil prices have driven up food costs, squeezing consumer discretionary budgets for products with higher price elasticity, such as smartphones and consumer electronics...
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares...
German quantum-sensing startup QuantumDiamonds has tested its technology on high-bandwidth memory (HBM) devices, including cases involving individual through-silicon via (TSV) failures,...
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
