CONNECT WITH US
NEWS TAGGED EMBEDDED
Wednesday 3 June 2026
The robotics future will arrive in stages, Qualcomm exec predicts
Qualcomm's view of the robotics industry points to a market that is rapidly taking shape, but along sharply diverging paths of complexity and time horizon.
Wednesday 3 June 2026
MediaTek denies rumored EMIB adoption timeline
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...
Sunday 31 May 2026
Silicon Motion lays out AI-focused storage roadmap for edge, enterprise and automotive
Silicon Motion Technology (SMI) has released a portfolio of AI-optimized storage controllers and products ahead of Ccmputex 2026, targeting edge inference, AI PCs, enterprise AI infrastructure...
Wednesday 27 May 2026
Transcend to spotlight AI-ready enterprise SSDs and DDR5 memory at COMPUTEX 2026
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying...
Wednesday 27 May 2026
ECS to Showcase AI-ready Computing Platforms at COMPUTEX 2026

Elitegroup Computer Systems (ECS), a leading global provider of motherboards, mini PCs, and computing solutions, will participate in COMPUTEX 2026 from June 2 to 5, 2026,...

Monday 25 May 2026
Embedded substrates draw AI chip interest as packaging turns strategic
Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...
Tuesday 19 May 2026
ITE Tech awaits PC, NB visibility as price hikes begin in 2H26
ITE Tech's stable first-quarter results and planned price increases from the second half of 2026 signal potential cost pass-through across global PC, notebook, and embedded markets,...
Friday 15 May 2026
UMC rolls out 14nm FinFET platform for OLED driver ICs
United Microelectronics Corp. (UMC) has released a 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, marking a new step in the foundry's process roadmap...
Friday 15 May 2026
Edge AI is transforming wearables into proactive health and sensing platforms
Edge AI is accelerating across consumer devices and is increasingly embedded in wearables, reshaping smartwatches, earbuds, and smart rings into proactive sensing and response endpoints,...
Monday 4 May 2026
AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron
Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
Thursday 23 April 2026
Texas Instruments signals a stronger recovery on industrial and AI demand
Texas Instruments (TI) reported first-quarter 2026 revenue of US$4.83 billion, up 19% year on year, with net income rising 31% to US$1.55 billion and earnings per share of US$1.68...
Tuesday 21 April 2026
Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027
Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM)...
Wednesday 15 April 2026
Exein deepens APAC push with regional hub aimed at device-level security compliance
Italian embedded cybersecurity firm Exein opened an Asia-Pacific operations center and Taipei office, positioning Taiwan as its regional hub. The move aims to help manufacturers across...
Wednesday 15 April 2026
Exein opens Taipei hub with unlimited Taiwan investment, aims to build chip-to-application cybersecurity ecosystem
Italian embedded cybersecurity firm Exein has opened an Asia-Pacific operations center in Taipei and pledged essentially unlimited investment in Taiwan, a move with implications for...
Tuesday 14 April 2026
Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...