NeoFuse, a security-enhanced version of eMemory's one-time programmable (OTP) non-volatile memory (NVM) technology, has been qualified on the TSMC N5 process. Another design tape-out...
United Microelectronics (UMC) has introduced 28eHV+, the latest advancement in its 28nm embedded high voltage (eHV) technology. The process node is designed for driver ICs used in...
GlobalFoundries (GF) has announced the acquisition of Renesas Electronics' proprietary and production-proven conductive bridging random access memory (CBRAM) technology, a low-power...
Taiwan-based industrial PC (IPC) maker Ibase Technology hosted an opening ceremony for its new factory in Taoyuan, Taiwan on January 12 and the company's capacity is expected to rise...
China-based Ecarx, an auto tech startup backed by Geely Auto, and Smart Automobile unveiled recently their jointly-developed high-performance immersive digital cockpit computing platform...
Yeestor Microelectronics, a China-based flash storage controller supplier, has applied to launch its IPO on the Sci-Tech Innovation Board (STAR) of the Shanghai Stock Exchange, according...
Himax Technologies' TDDI chip solution for tablets has attracted orders from Xiaomi for its high-end tablets and 2-in-1 devices, according to the Taiwan IC design house.
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
VIA Technologies' edge AI solutions for smart transportation have attracted orders from Toyota Material Handling Taiwan, according to the Taiwan-based company specializing in embedded...
Despite rampant inflation and other macro headwinds, IC Insights continues to anticipate an 11% increase in total semiconductor sales this year - the same growth rate that was forecast...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Taiwan-based pure-play foundries continue to see orders for automotive semiconductors ramp up while stepping up their capacity expansion pace, according to industry sources.
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Kioxia has started sampling its new UFS Ver. 3.1 embedded flash memory devices for automotive, according to the company. The new lineup utilizes Kioxia's cutting-edge BiCS FLASH 3D...
