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Friday 16 October 2026
US pushes AI exports as chip industry flags supplier gaps and reshoring costs
At SEMICON West 2026, US officials and lawmakers promoted domestic manufacturing and AI export policies, while industry executives warned that supplier shortages, the premium for US-made...
Friday 16 October 2026
TSMC deal could slow Musk's Terafab, but US suppliers still see upside
The feasibility of Terafab's proposed construction was a major topic of discussion among semiconductor suppliers during SEMICON West 2026, held October 13–15 in San Francisco...
Friday 16 October 2026
CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
Friday 16 October 2026
TSMC details pricing, confirms agentic AI boosts CPU demand
TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise...
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach...
Friday 16 October 2026
TSMC excludes CPUs from AI accelerator growth forecast
Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI...
Friday 16 October 2026
China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking
Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization...
Friday 16 October 2026
China's YMTC targets 9,600 MT/s with 4F² DRAM design
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Friday 16 October 2026
Samsung's Austin chip workforce shrinks 32% as Taylor 2nm fab nears opening
Samsung Electronics' semiconductor workforce in Austin, Texas, shrank 32% in 2025 as local operating expenditures plunged nearly 75%, contrasting with increased activity at its nearby...
Thursday 15 October 2026
Aurotek posts record 3Q26 revenue, up 58% on automation demand
Aurotek Corp. reported record consolidated revenue of NT$1.113 billion (US$34.7 million) in the third quarter of 2026, up 57.93% from a year earlier. Orders from semiconductor, high-end...
Thursday 15 October 2026
FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines
FIC Group opened its PRO3C (Malaysia) Sdn. Bhd. manufacturing facility in Johor, Malaysia, on October 15, expanding its optical communications production footprint in Southeast Asia...
Thursday 15 October 2026
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Thursday 15 October 2026
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
TSMC has confirmed that it is in discussions with Elon Musk's Terafab initiative over potential semiconductor manufacturing cooperation, marking the first public acknowledgment of...
Thursday 15 October 2026
TSMC eyes US$54.3bn in 4Q26 revenue, but 2nm ramp and overseas fabs pressure margins

TSMC expects fourth-quarter 2026 revenue to reach US$52.3 billion to US$54.3 billion, potentially rising as much as 61% year-over-year, with sustained...

Thursday 15 October 2026
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...