CONNECT WITH US
NEWS TAGGED MANUFACTURING
Friday 16 October 2026
Gemtek partners with Starman to make optical transceivers in US
On October 15, network equipment maker Gemtek Technology announced a strategic partnership with Starman New Photonics, a subsidiary of Starman Holdings, to form a joint venture in...
Friday 16 October 2026
Taiwan to build industrial parks in US; Texas site already found
Taiwan plans to set up industrial parks in the US to help its supplier ecosystem reach customers like Nvidia and other local hardware manufacturers. It is starting with a complex in...
Friday 16 October 2026
Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU
US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional...
Friday 16 October 2026
Samsung to break ground on second Texas chip fab in November
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
Friday 16 October 2026
FICG eyes 4x optical communications capacity by 2027
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
Friday 16 October 2026
Analysis: Intel CEO Lip-Bu Tan's power of humility — how one phone call helped reshape the chip giant's comeback
As the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind...
Friday 16 October 2026
US chipmakers rely more on overseas production than supplier data suggests, SIA finds
The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However,...
Friday 16 October 2026
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Friday 16 October 2026
US pushes AI exports as chip industry flags supplier gaps and reshoring costs
At SEMICON West 2026, US officials and lawmakers promoted domestic manufacturing and AI export policies, while industry executives warned that supplier shortages, the premium for US-made...
Friday 16 October 2026
TSMC deal could slow Musk's Terafab, but US suppliers still see upside
The feasibility of Terafab's proposed construction was a major topic of discussion among semiconductor suppliers during SEMICON West 2026, held October 13–15 in San Francisco...
Friday 16 October 2026
CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
Friday 16 October 2026
TSMC details pricing, confirms agentic AI boosts CPU demand
TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise...
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach...
Friday 16 October 2026
TSMC excludes CPUs from AI accelerator growth forecast
Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI...
Friday 16 October 2026
China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking
Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization...