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Monday 12 October 2026
Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...
Monday 12 October 2026
SK Hynix's US$299 billion chip plan faces military base hurdle
SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production...
Monday 12 October 2026
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet...
Monday 12 October 2026
LG Display unveils maskless OLED technology, targeting more efficient IT displays
LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing...
Monday 12 October 2026
Former iPhone display plant in Japan reportedly to enter AI chip supply chain
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
Monday 12 October 2026
Commentary: Could a 65% US-content rule redraw China's 3.2T optical supply chain?
AI data centers are shifting toward faster networking architectures, with optical transceivers advancing from 800G and 1.6T toward 3.2T. Yet China's ability to retain its position...
Monday 12 October 2026
Kawasaki Heavy Industries bets JPY550 billion on physical AI, robotics
Kawasaki Heavy Industries is betting on physical AI as part of a multibillion-dollar growth plan to modernize factories, address labor shortages, and expand robotics across shipbuilding,...
Monday 12 October 2026
CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

Sunday 11 October 2026
IPC makers expand US production as supply chains, tariffs shift
Industrial PC (IPC) makers are adding US manufacturing as supply chains regionalize, tariff policy tightens, and government buyers press for local sourcing. For global readers, the...
Sunday 11 October 2026
Sysgration bets on battery backup, drones to hit US$314 million in sales by 2028
Sysgration posted record monthly consolidated revenue in September 2026 for the third consecutive month, pushing third-quarter revenue above NT$1 billion (approx. US$31.4 million)...
Saturday 10 October 2026
JNTC bets US$259 million on glass substrates ahead of 2028 ramp
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Saturday 10 October 2026
US plans for 'Autowarcom' deepen military's focus on autonomous weapons
US Defense Secretary Pete Hegseth announced plans for the creation of a combatant command focused on autonomous warfare and drones. Its planned establishment indicates the turn within...
Saturday 10 October 2026
Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
Friday 9 October 2026
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
Friday 9 October 2026
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...