China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed...

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

India has moved to build a major telecom manufacturing hub in Gwalior, a step that could reshape supply chains, investment flows, and...

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...

Qualcomm is raising prices across its product portfolio and accelerating a shift beyond smartphones as higher memory and manufacturing...

Advanced Chip and Circuit Materials (ACCM) today introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match...