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Thursday 5 November 2026
EU launches EUR525 million push to close chip design gap
The European Union has launched a EUR525 million (approx. US$590 million) initiative to strengthen its semiconductor design industry, seeking to narrow the gap with the US and China...
Thursday 5 November 2026
China's Big Fund III pivots to 12-inch chip fabs, equipment acquisitions to close semiconductor supply chain gaps
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and...
Thursday 5 November 2026
Ukraine's top unmanned fleet developer looks to Taiwan for critical components
Ukrainian defense tech company UFORCE, creator of the Magura unmanned surface vessel credited with disabling or sinking 19 Russian warships in the Black Sea and emerging as a primary...
Thursday 5 November 2026
Commentary: AOI locks in China's InP substrates for AI optics, but export controls threaten supply
AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical...
Thursday 5 November 2026
Taiwan accelerates unmanned boat fleet as experts urge allied cooperation
The Research Institute for Democracy, Society and Emerging Technology (DSET) released a report on November 4 at the 2026 Taiwan Marine Tech & Unmanned Robotics Expo (MATURE Taiwan),...
Thursday 5 November 2026
SK Hynix leads HBM4 yield at 60%, expands DRAM supply
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production...
Thursday 5 November 2026
Syntec Technology's new factories in India, Malaysia to push capacity to more than double in 2027
Syntec Technology is actively advancing its global production capacity expansion and artificial intelligence (AI) technology deployment. The company announced on November 4 that its...
Thursday 5 November 2026
GlobalFoundries secures nearly US$1 billion in custom chip design wins as it expands into physical AI

GlobalFoundries is gaining traction in custom silicon, processor intellectual property (IP) and physical AI applications, as the chipmaker seeks...

Thursday 5 November 2026
Corning starts optical connectivity output in western India, plans larger adjacent plant for 2027
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest...
Thursday 5 November 2026
Taiwan-Netherlands launch four photonics R&D partnerships
Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging,...
Thursday 5 November 2026
DIGITIMES Insight: TSMC, ASML's 2031 photomask target puts High NA EUV suppliers on the clock
ASML and TSMC announced plans in September 2026, ahead of the SPIE BACUS symposium, to advance high-numerical-aperture extreme ultraviolet (High NA EUV) lithography by replacing the...
Thursday 5 November 2026
From assembly lines to front lines, defense opens new opportunities for automakers
As low capacity utilization, steep tariffs, and fierce competition from Chinese automakers pressure the industry, significant growth in European defense spending is opening new business...
Wednesday 4 November 2026
Former Intel packaging chief Navid Shahriari joins MediaTek as senior vice president
MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer.
Wednesday 4 November 2026
Why defense's blue ocean is no smooth sailing for automakers
Although the defense market has emerged as a new blue ocean for the auto industry, entering it is far from smooth sailing. The main concern remains the national security sensitivities...
Wednesday 4 November 2026
AI flash could cost 90% less per GB to make than HBM4 but squeeze NAND supply
High Bandwidth Flash (HBF) could give AI accelerators more memory at roughly one-tenth the manufacturing cost per gigabyte of HBM4. But producing it could consume far more wafer capacity...