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Wednesday 21 October 2026
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
Wednesday 21 October 2026
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
Wednesday 21 October 2026
Axcelis plans US$35 million semiconductor facility in South Korea
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house....
Wednesday 21 October 2026
Apple expands US iPhone supply ties with Perryman and Qnity
Apple announced new and expanded US supplier partnerships on October 20, 2026, including plans to commit up to US$100 million to titanium producer Perryman Company over three years...
Wednesday 21 October 2026
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
Wednesday 21 October 2026
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
Chinese tech giants ByteDance, Alibaba, and Tencent have collectively ordered more than 3 million units of Nvidia's new RTX PRO 5500 graphics cards, representing a total value exceeding...
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Samsung faces delays securing 2nm customers as 4nm capacity reaches full utilization
Samsung Electronics' foundry business has yet to finalize contracts with major global technology companies for its 2nm process, while demand has pushed its 4nm production lines close...
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Foxconn's planned JPY115 billion (US$726.83 million) investment in Mitsubishi Electric Mobility will create a joint venture to expand their electric-vehicle and autonomous-driving...
Wednesday 21 October 2026
Contrel, FSE combine laser and plasma processes for advanced packaging
Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing...
Tuesday 20 October 2026
Jensen Huang urges Germany to embrace physical AI at Berlin summit
German Chancellor Friedrich Merz and Nvidia CEO Jensen Huang urged German businesses to embrace AI at an industry summit in Berlin on October 19, aiming to revive the economy and modernize...
Tuesday 20 October 2026
Global Tek's new Thailand plant enters trial production in 3Q26, targeting AI liquid cooling and aerospace opportunities
Global Tek Industrial held an opening ceremony on the 20th for its Super Smart Manufacturing Park in Chonburi, Thailand. Spanning 177,600 square meters, the facility is the group's...
Tuesday 20 October 2026
AUO selects glass substrate specs for semiconductor processes, not size rivalry
AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...