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Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Wednesday 21 October 2026
Qisda integrates four companies to build scalable rack-scale AI solutions
Qisda Group is targeting rack-scale AI opportunities in data centers by accelerating development of its rack-scale AI solutions. Through in-house design, manufacturing, and cross-domain...
Wednesday 21 October 2026
Murata develops world's smallest NTC thermistor, targets 2027 mass production
Japan's Murata Manufacturing has developed the world's smallest NTC thermistor, the 008004 NCU01 series, measuring 0.25mm × 0.125mm. Compared with Murata's previous smallest...
Wednesday 21 October 2026
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
Wednesday 21 October 2026
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
Wednesday 21 October 2026
Axcelis plans US$35 million semiconductor facility in South Korea
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house....
Wednesday 21 October 2026
Apple expands US iPhone supply ties with Perryman and Qnity
Apple announced new and expanded US supplier partnerships on October 20, 2026, including plans to commit up to US$100 million to titanium producer Perryman Company over three years...
Wednesday 21 October 2026
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
Wednesday 21 October 2026
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
Chinese tech giants ByteDance, Alibaba, and Tencent have collectively ordered more than 3 million units of Nvidia's new RTX PRO 5500 graphics cards, representing a total value exceeding...
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Samsung reportedly shifts foundry focus to 4nm, 5nm as 2nm deals take longer
Samsung Electronics is increasingly relying on its 4nm and 5nm foundry processes to improve near-term profitability as negotiations with major customers for its next-generation 2nm...
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Foxconn's planned JPY115 billion (US$726.83 million) investment in Mitsubishi Electric Mobility will create a joint venture to expand their electric-vehicle and autonomous-driving...