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NEWS TAGGED MANUFACTURING
Tuesday 17 May 2022
Actron, Eris eyeing IDM-like operations for car, industrial power devices
Taiwan-based power semiconductor suppliers including Actron Technology and Eris Technology are aggressively utilizing manufacturing and supply-chain resources from their affiliated...
Tuesday 17 May 2022
YMTC sampling 192-layer 3D NAND chips
China's Yangtze Memory Technologies (YMTC) has delivered samples of its in-house developed 192-layer 3D NAND flash memory to a few customers recently, according to industry sources...
Monday 16 May 2022
SMIC no longer discloses revenue by process nodes
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported first-quater 2022 sales, but omitted a revenue breakdown by manufacturing process nodes...
Friday 13 May 2022
ASMedia transitions to 28nm process for part of chip production
ASMedia Technology, an affiliate of Asustek Computer specializing in high-speed transmission chips, has transitioned to 28nm process manufacturing for part of its chip solutions while...
Thursday 12 May 2022
Wistron NeWeb expects chip shortage to persist through 1Q23
Networking device assembler Wistron NeWeb expects the shortage of MCUs, MOSFETs, power management ICs (PWM IC) and other chips demanding mature process manufacturing to persist and...
Thursday 12 May 2022
PWM IC firms expect more available 8-inch fab capacities in 2023
With their bigger peers transitioning to 12-inch wafer manufacturing, Taiwan-based power management IC (PWM IC) suppliers expect more 8-inch fab capacities to be available to satisfy...
Wednesday 11 May 2022
PSMC to fully utilize fab capacity over next 2 quarters
Powerchip Semiconductor Manufacturing (PSMC) will be running its 12- and 8-inch fabs at full capacity utilization in the next couple of quarters, according to the pure-play foundry...
Wednesday 11 May 2022
TSMC plans 5-9% price hike starting in 2023
TSMC has notified clients of a 5-9% price hike for both its advanced and mature processes, and the new prices are set to go into effect in January 2023, according to industry sourc...
Tuesday 10 May 2022
The memory industry (2): The era of makers utilizing manufacturing processes and equipment for both DRAM and 2D NAND flash
NAND flash was invented by Toshiba in 1989 and entered commercial mass production in the early 2000s. Since NAND flash has much faster access speed than mechanical hard drives, and...
Monday 9 May 2022
The memory industry (1): The era of DRAM driving semiconductor manufacturing process improvement
Semiconductor is a high-tech industry that requires continuous investment in the development of cutting-edge technologies to create new economic value. With the advantage of entering...
Friday 6 May 2022
ProLogium to adopt predictive simulation to mass produce solid-state battery for EV
ProLogium is ready to produce the world's first batch of high-performance solid-state batteries for electric vehicles (EV) soon. The Gigafactory in Taoyuan, Taiwan is planning to...
Friday 6 May 2022
China still has strong role in global manufacturing, says Inventec chair
Southeast Asia is unlikely to replace China as the world's manufacturing hub in the short term, according to Tom Cho, chairman of ODM Inventec. For Taiwanese businesses, the decision...
Friday 6 May 2022
MaxLinear to acquire Silicon Motion
MaxLinear and Silicon Motion Technology have entered into a definitive agreement under which MaxLinear will acquire Silicon Motion in a cash and stock transaction that values the...
Thursday 5 May 2022
GF strikes US$117 million supply agreement with US Department of Defense
GlobalFoundries has announced a US$117 million agreement with the US Department of Defense (DoD) to provide a strategic supply of US-made semiconductors that are critical to national...
Thursday 5 May 2022
Diode maker Eris optimistic about 2Q22
Taiwan-based Eris Technology has reported record-high April revenue thanks to automotive and industrial control applications, and it anticipates continued profit growth in the second...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.