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Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Foxconn takes EV ambitions deeper with Quantron commercial vehicle deal

Foxconn is expanding its global electric vehicle footprint through partnerships with German commercial vehicle brand Quantron and intelligent...

Monday 21 September 2026
CXMT closes in on DRAM leaders with G5 process breakthrough

China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the...

Monday 21 September 2026
IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing
Anderon LLC, an IBM company, has finalized a US$1 billion award under the US CHIPS and Science Act to expand quantum wafer manufacturing in Albany, New York. The move could help speed...
Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground

The US is reportedly pressuring Mexico to tighten rules of origin for AI hardware to limit the use of components produced outside North...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Sunday 20 September 2026
BYD plans four Europe factories as EU tariff pressure rises

BYD is planning four factories in Europe over the long term as it works to meet local manufacturing rules and expand its customer base...

Sunday 20 September 2026
Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign

Wiwynn is introducing collaborative robots (cobots) at its El Paso, Texas, facility and third plant in Mexico, alongside a central heat...

Sunday 20 September 2026
Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership

German commercial vehicle company Quantron and China's Hongjing Drive have formally agreed to establish a joint venture, Quantron China,...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
It has become increasingly evident that one of the factors undermining China's unparalleled competence in the global EV industry is manufacturing scale. But the continued development...
Saturday 19 September 2026
Compal takes Compal Broadband Networks private to fold networking into its edge AI stack
Compal Electronics is buying out the shares of its listed networking arm, Compal Broadband Networks (CBN), in a cash deal that will end CBN's public listing and give Compal full control...
Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...