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Friday 14 August 2026
VinSpace signs SpaceX launch deal for first satellites in 2027
Vietnamese aerospace startup VinSpace has signed a contract with SpaceX to launch its first satellites in 2027. Bloomberg reported that the payloads will fly on a SpaceX Transporter...
Friday 14 August 2026
US report puts China-linked tariff evasion through Asia under the spotlight

A new US government-linked report says American tariff revenue is being drained by tens of billions of dollars a year through illegal...

Friday 14 August 2026
Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly...

Friday 14 August 2026
Apple opens advanced manufacturing center in Houston to expand US smart skills
Apple opened of its new 20,000-square-foot Advanced Manufacturing...
Friday 14 August 2026
Lam Research to spend more than US$3 billion expanding global R&D labs
Lam Research plans to invest more than US$3 billion over the next five years to expand its global research and development lab network, increasing experimental capacity as semiconductor...
Friday 14 August 2026
Dixon Technologies to take 51% stake in new smartphone OEM venture with vivo Mobile India

Dixon Technologies has disclosed plans to incorporate a new subsidiary, Adivistar Electronics India Private Limited, in which it will...

Friday 14 August 2026
Taiwan tech dividend expansion to accelerate non-tech industry upgrades
Taiwan is seeking to sign an agreement with the US to avoid double taxation, seen as the last major hurdle to unlocking Taiwanese investment in the US. Taiwan's technology dividend...
Friday 14 August 2026
Applied Materials sets 2028 capacity target as it commits new manufacturing hires
Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
Friday 14 August 2026
Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Friday 14 August 2026
Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
Friday 14 August 2026
Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth

Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming...

Friday 14 August 2026
Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
Samsung delays High-NA EUV adoption until 1nm production in 2030
Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...