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Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
Former SMIC CEO targets China photomask IPO after 12-inch wafer bet
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask...
Wednesday 24 June 2026
FSC sees higher-margin orders as low-carbon demand boosts equipment sales
Fu Chun Shin Machinery (FSC Group) reported stronger revenue and profitability in 2025, driven by growing demand for low-carbon and smart manufacturing solutions. At its June 22 shareholders...
Wednesday 24 June 2026
China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
Wednesday 24 June 2026
BenQ Materials unveils medical strategy, eyes 50% revenue share
BenQ Materials is stepping up its medical push, with Chairman Z.C. Chen saying that its medical business is expected to account for 35% of revenue by the end of 2026, a record high...
Wednesday 24 June 2026
EU eyes tariffs on Chinese PHEVs as BEV curbs prove ineffective
The EU has imposed higher tariffs on Chinese battery electric vehicles (BEV) for more than a year, but the impacts have been limited. According to foreign media reports, the EU is...
Tuesday 23 June 2026
AI data center buildout fuels optical interconnect race, but 6-inch InP wafers hit supply wall

Technology giants are continuing to expand AI computing infrastructure, driving demand for high-performance optical interconnect components...

Tuesday 23 June 2026
Chinese Premier Li Qiang puts China's advanced manufacturing agenda on display before Summer Davos
Chinese Premier Li Qiang will attend Summer Davos 2026, to be held from June 23 to 25 in Dalian, Liaoning province. The forum, formally the Annual Meeting of the New Champions, will...
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Tuesday 23 June 2026
Apple's global assembly partners hit by wave of ransomware, Tata Electronics latest victim

Tata Electronics, Apple's exclusive iPhone assembler in India, confirmed a major data breach on June 23, 2026, weeks after the WorldLeaks...

Tuesday 23 June 2026
Laster Tech secures Mexico orders through 2029 and moves into AI robot supply
Laster Tech said its new Mexico plant already has order visibility through 2029, underscoring how automakers are reshaping supply chains across North America and beyond. The LED automotive...
Monday 22 June 2026
AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe....

Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
Toto reportedly bets bigger on semiconductor materials as AI pushes industry toward 1nm era

Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion...