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Friday 18 September 2026
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...
Friday 18 September 2026
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event...

Friday 18 September 2026
FCS Group eyes North America layout, as plastics industry turns to material innovation

The spotlight has been on industry innovation at the 2026 Taipei International Plastics and Rubber Industry Show (TaipeiPLAS), as Taiwan's...

Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...

Thursday 17 September 2026
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its ability to integrate hardware, software, sensing and control into deployable industrial...
Thursday 17 September 2026
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from policy friction to a strategic alignment. The rapid shift in their dynamic reflects...
Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

Thursday 17 September 2026
Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects

Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale:...

Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...
Thursday 17 September 2026
SK Hynix weighs US memory options as buyers lock in 2027 supply
SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional...
Thursday 17 September 2026
Samsung reportedly starts Tesla chip trial production at Taylor fab

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving...

Thursday 17 September 2026
TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain

Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new KRW101 billion...

Thursday 17 September 2026
Circular economy tests material mastery and consumers' willingness to pay
The EU's Packaging and Packaging Waste Regulation (PPWR, Regulation (EU) 2025/40) has been in force since Aug. 12, 2026, underscoring the rising importance of circular materials as...
Thursday 17 September 2026
Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration —...
Thursday 17 September 2026
Dassault Systemes shifts to AI-native platforms, stakes its next phase on Taiwan
Dassault Systemes marked 20 years in Taiwan with a sharper message about where it plans to go next. The company said it is moving beyond AI-enabled software and toward an AI-native...