During its first quarter 2026 earnings call, VinFast Auto Ltd. unveiled a series of significant corporate moves, including a transition in board leadership, a major restructuring of...
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Nvidia and Hyundai Motor Group have agreed to deepen their collaboration in artificial intelligence, robotics, and future mobility technologies as the two companies seek to accelerate...
Amazon has reached a multiyear, multibillion-dollar agreement with Corning to supply optical fiber, cable, and connectivity equipment for its US data centers, a move that stands to...
During its first-quarter 2026 earnings call, VinFast Auto highlighted India as a pivotal "core growth engine" for the company's international expansion. Management reported that business...
Genius Electronic Optical reported consolidated revenue of NT$1.629 billion (US$51.5 million) in May 2026, marking a month-on-month decline from NT$2.314 billion in April but a 30.24%...
Molex is building out a dual-track strategy for AI interconnects, backing both copper and optical solutions as customers pursue different deployment paths, while expanding its Taiwan...
Beneath the rapid expansion of electric vehicles and artificial intelligence infrastructure, a quieter battle is unfolding in the semiconductor supply chain.
India's tablet market grew 5% year-over-year in the first quarter of 2026, even as memory prices rose and macroeconomic conditions remained uncertain. For global consumers and manufacturers,...
Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman...
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used...
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
