CONNECT WITH US
NEWS TAGGED MANUFACTURING
Thursday 6 August 2026
Dark fiber essential for next-gen distributed AI centers

All-photonic networks (APN) are emerging as critical infrastructure for 6G, AI computing and smart cities. Nvidia's plan to expand...

Thursday 6 August 2026
Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
Thursday 6 August 2026
Fositek lifts server revenue mix to 56% and plans capacity expansion
Fositek said AI-driven demand increased the share of server-related products in its revenue mix in the second quarter of 2026 and helped improve profitability even as overall sales...
Thursday 6 August 2026
GlobalWafers says AI demand is lifting utilization and new LTA talks are underway
GlobalWafers said semiconductor demand has rebounded as AI and high-performance computing applications expanded, keeping its factories highly utilized and prompting a new round of...
Wednesday 5 August 2026
Mitsubishi Electric, Daikin expand US production to meet data center cooling demand

Mitsubishi Electric is establishing a cooling-equipment production company in Ohio, joining Daikin Industries in bringing manufacturing...

Wednesday 5 August 2026
Infineon sees AI demand outpacing supply as customers lock in long-term capacity

Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign...

Wednesday 5 August 2026
Furukawa Electric to invest JPY100 billion to double rollable ribbon cable capacity in response to data center demand
Furukawa Electric said on August 4 that it will invest approximately JPY100 billion (approx.US$630 million) in total to expand production capacity for optical fibers and optical fiber...
Wednesday 5 August 2026
Analysis: Musk's empire closes in on China — from orbit to the factory floor

SpaceX's rapid growth in AI, satellite connectivity, and space infrastructure is widening the strategic challenge for China beyond...

Wednesday 5 August 2026
Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
China steps up challenge to Starlink: targets annual satellite output of 7,360 in major ramp-up of commercial space industry

China's commercial space ambitions are entering a new phase as Beijing accelerates efforts to build an integrated space industry capable...

Wednesday 5 August 2026
From factories to consumers: Samsung's long retreat from China enters its final chapters

Samsung Electronics' latest move to scale back its smartphone retail network in China marks another milestone in a years-long restructuring...

Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Tuesday 4 August 2026
China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands
China's industrial enterprises above the designated size produced 484.28 billion integrated circuits in 2025, up nearly 350% from 108.72 billion in 2015, as the country expanded manufacturing...