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Friday 14 August 2026
Applied Materials sets 2028 capacity target as it commits new manufacturing hires
Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
Friday 14 August 2026
Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Friday 14 August 2026
Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
Friday 14 August 2026
Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth

Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming...

Friday 14 August 2026
Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
Samsung delays High-NA EUV adoption until 1nm production in 2030
Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
Thursday 13 August 2026
SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...
Thursday 13 August 2026
Foxconn broadens beyond AI servers with EVs, robotics and Japan chip fab above 90% utilisation
Foxconn used its second-quarter 2026 earnings conference on August 12 to detail progress beyond its fast-growing AI server business, spanning cloud and data centre solutions, electric...
Thursday 13 August 2026
Samsung SDI-GM battery reset shows how ESS is reshaping the US EV supply chain

Samsung SDI is ending its battery manufacturing partnership with General Motors (GM) in Indiana, terminating a major EV joint venture...

Thursday 13 August 2026
LG Chem reportedly wins cathode supply deal for Hyundai-LG Energy Solution's US battery venture
LG Chem has been selected as a cathode material supplier for HL-GA Battery Company, the US battery manufacturing joint venture between Hyundai Motor Group and LG Energy Solution, according...
Thursday 13 August 2026
ITTS reports first-half growth as ERP and AI projects gain traction
Information Technology Total Services (ITTS) said its business recovered in the first half of 2026 as enterprise resource planning (ERP) implementation work advanced and data governance...
Thursday 13 August 2026
GaAs gains ground in short-reach AI optics as InP constraints mount
As AI workloads push data center interconnects from 800G toward 1.6T, indium phosphide (InP) has become a critical material for high-speed optical links, particularly for longer-distance...
Thursday 13 August 2026
India's state of Odisha sweetens chips, renewable energy incentives to court ISM projects

Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support...