Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible...
Academia Sinica's Center for Quantum Computer is focusing only on hardware, not algorithms or applications, and executive director Chii-Dong Chen said that approach is similar to the...
GlobalFoundries (GF) is positioning its Singapore operations as a core hub for the emerging era of physical AI, as the chipmaker expands investment in manufacturing capacity and next-generation...
Taiwan's Ministry of Economic Affairs (MOEA) released industrial production statistics for May 2026 on June 24, reporting that Taiwan's computer, electronic products, and optical products...
Century Wind Power announced on June 25 that its board approved a share-swap acquisition of 100% of Century Huaxin Wind Energy Co. and a proposed corporate name change to Century Energy...
Ability Enterprises said it plans to increase its exposure to Agility Robotics after the robot maker disclosed plans for a Nasdaq listing via a SPAC. The move underscores rising demand...
Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing...
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
E.Comis Technology, a subsidiary of E Ink Holdings Group, said it has scaled a self-developed, solvent-free optically clear adhesive to meet growing demand for thinner displays, better...
Foxconn announced on June 24 that it signed a memorandum of strategic cooperation with Japan's Sharp Corp., with both companies centering the partnership on complementary strengths...
EverFocus Electronics has announced a North America market expansion that includes participation in Automate 2026 and inclusion in Nvidia's official Interactive Ecosystem Map, aimed...
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask...
