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Tuesday 5 May 2026
CHPT posts record April revenue on AI-driven HPC demand
Semiconductor test interface provider Chunghwa Precision Test Tech (CHPT) said its revenue in April 2026 continued to set a new all-time monthly high, driven by rising demand for semiconductor...
Tuesday 5 May 2026
MediaTek ASIC surge puts 60% revenue share within reach
MediaTek raised its outlook for its application-specific integrated circuit (ASIC) business during its first-quarter 2026 earnings call, signaling stronger growth prospects and sending...
Tuesday 5 May 2026
Ubiqconn establishes R&D base in Shalun to build collaborative unmanned vehicle ecosystem
Ubiqconn Technology said it moved into the Shalun Artificial Intelligence Industrial Zone and established an R&D base to create Taiwan's first application ecosystem for a collaborative...
Monday 4 May 2026
SEMICON SEA 2026 highlights Malaysia's push to scale semiconductor assembly, testing and packaging
SEMICON SEA 2026 convened from May 5 to 7 at the Malaysia International Trade and Exhibition Center in Kuala Lumpur to showcase Malaysia's expanding role in the global semiconductor...
Monday 4 May 2026
Croma ATE posts record 1Q26 revenue and profit as AI server demand lifts SLT and photonics orders
Croma ATE reported record first-quarter 2026 revenue and profits after customers booked full-year capacity, driven by soaring demand for AI server power supplies, the company announced...
Friday 1 May 2026
Advantest beats on AI chip testing, cautious outlook dents shares

Japan's Advantest closed its fiscal year with strong results, highlighting how AI-driven chip demand is reshaping semiconductor testing...

Thursday 30 April 2026
Taiwan OSAT Powertech lifts capex to US$1.6bn, targets AI packaging growth
Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...
Thursday 30 April 2026
Chunghwa Precision Test raises capex as HPC probe card orders hit 30% of sales
Chunghwa Precision Test Tech reported that strong demand from high-performance computing chip customers drove first-quarter 2026 revenue to NT$1.357 billion (US$43 million) and operating...
Thursday 30 April 2026
ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand
ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.
Wednesday 29 April 2026
China OSAT leader JCET expands in advanced packaging, profit climbs
China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
Wednesday 29 April 2026
Supermicro opens largest US campus in Silicon Valley, producing AI infrastructure
Supermicro's new 32.8-acre Silicon Valley campus will add hundreds of US positions and expand domestic production of AI infrastructure, signaling increased US capacity for enterprises...
Wednesday 29 April 2026
Chroma Paper Award: Boosting AI Innovation and Industry-Academia Ties

Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration...

Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Tuesday 28 April 2026
AI chip testing complexity lifts probe card and upstream supply chain demand
As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...