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    NEWS TAGGED TESTING
    Friday 1 May 2026
    Advantest beats on AI chip testing, cautious outlook dents shares

    Japan's Advantest closed its fiscal year with strong results, highlighting how AI-driven chip demand is reshaping semiconductor testing...

    Thursday 30 April 2026
    Taiwan OSAT Powertech lifts capex to US$1.6bn, targets AI packaging growth
    Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...
    Thursday 30 April 2026
    Chunghwa Precision Test raises capex as HPC probe card orders hit 30% of sales
    Chunghwa Precision Test Tech reported that strong demand from high-performance computing chip customers drove first-quarter 2026 revenue to NT$1.357 billion (US$43 million) and operating...
    Thursday 30 April 2026
    ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand
    ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.
    Wednesday 29 April 2026
    China OSAT leader JCET expands in advanced packaging, profit climbs
    China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
    Wednesday 29 April 2026
    Supermicro opens largest US campus in Silicon Valley, producing AI infrastructure
    Supermicro's new 32.8-acre Silicon Valley campus will add hundreds of US positions and expand domestic production of AI infrastructure, signaling increased US capacity for enterprises...
    Wednesday 29 April 2026
    Chroma Paper Award: Boosting AI Innovation and Industry-Academia Ties

    Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration...

    Tuesday 28 April 2026
    US chip packaging capacity to hit 10% by 2032
    The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
    Tuesday 28 April 2026
    AI chip testing complexity lifts probe card and upstream supply chain demand
    As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    Tmytek expands testing capacity with new high-frequency lab
    As 6G standardization accelerates and low-Earth-orbit satellite applications gain traction, the communications industry is entering a new phase — one defined by the native integration...
    Monday 27 April 2026
    Broadcom, Marvell set to benefit as 1.6T optical modules near mass production
    1.6T optical communication modules are set for broad adoption in AI data centers in 2026, with optical transceiver vendors and key IC design houses preparing for shipments. Broadcom's...
    Monday 27 April 2026
    Innolux enters leading tier of advanced packaging with new RDL and TGV technology
    Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
    Saturday 25 April 2026
    Taiwan's industrial production surges on AI infrastructure demand
    Data released by Taiwan's Ministry of Economic Affairs (MOEA) on April 23 showed that major global cloud service providers continue to expand procurement of artificial intelligence...
    Friday 24 April 2026
    DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
    SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that...
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    TechForum0520
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook