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Wednesday 30 September 2026
Samsung SDI targets AI data centers with cylindrical LFP batteries and fire-propagation safeguards
Samsung SDI is accelerating its push into the artificial intelligence (AI) data center battery market, unveiling, for the first time, a cylindrical lithium iron phosphate (LFP) battery...
Wednesday 30 September 2026
Murata begins mass production of world's smallest three-terminal MLCCs
Murata Manufacturing has started mass production of its LLD series, a new class of ultra-compact capacitors that could help device makers worldwide fit more power management into smaller...
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
Wednesday 30 September 2026
Foxconn links motors, humanoids, smart factories into a vertically integrated robotics strategy
Foxconn has partnered with Chinese automotive design and engineering services provider IAT Automotive Technology to establish Beijing Futekang Intelligent Robot Technology, extending...
Wednesday 30 September 2026
Micro LED smartwatches set back as costs remain a fatal hurdle
Micro LED has reached mass production in several end-market applications in recent years, but it is still facing intense competition from OLED. Garmin's new fenix 9 smartwatch has...
Wednesday 30 September 2026
Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs
Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at...
Wednesday 30 September 2026
Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...

Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Qualcomm, Liquid AI tout on-device AI potential at Snapdragon Summit
Qualcomm Technologies held its Snapdragon Summit 2026 in Maui, Hawaii, from September 22 to 24. During the keynote on the second day, Qualcomm president and CEO Cristiano Amon spoke...
Tuesday 29 September 2026
Meta adds camera-free AI glasses as Samsung prepares 2026 launch
Meta has introduced a camera-free smart glasses model while Samsung Electronics prepares to enter the AI glasses market in 2026, as privacy concerns and product design trade-offs reshape...
Tuesday 29 September 2026
Advantech's North America expansion signals a deeper shift toward local manufacturing, services

Advantech is expanding manufacturing, engineering, and fulfillment capabilities in North America as demand grows for locally designed...

Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Sunday 27 September 2026
Keysight pushes design-to-deployment standard for AI cluster validation

As AI applications expand rapidly across industries, testing and validation have become essential to moving innovation from R&D...

Thursday 24 September 2026
Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...

Thursday 24 September 2026
Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...