中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects
    1min ago
    Global data center capex could reach US$31.6 trillion by 2050 as AI demand surges
    1min ago
    Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war
    2min ago
    Sigmaintell: Memory shortage to ease in 2027 before chip growth hits 2029 wall
    3min ago
    CXMT rides AI boom to 80% operating margin
    4min ago
    Swiss drone maker shifts production to Taiwan
    5min ago
    eCloudvalley expands enterprise AI Agent portfolio
    5min ago
    Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
    Sep 14, 18:47
    Xpeng expands Turing chip from EVs into humanoid robots
    Sep 14, 18:47
    Corning sees CPO and glass core as new semiconductor battlegrounds
    Sep 14, 18:47
    China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
    Sep 14, 18:46
    China's AIDC token costs hinge on access to advanced GPUs
    Sep 14, 18:46
    NEWS TAGGED DESIGN
    Monday 14 September 2026
    Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
    AI data centers are moving decisively toward 1.6T connectivity, with 800G now mainstream in AI clusters and 400G remaining common in general cloud and enterprise deployments.
    Monday 14 September 2026
    Sandisk recruits engineers in Korea as memory talent race heats up

    Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

    Monday 14 September 2026
    Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

    Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years,...

    Monday 14 September 2026
    CPO nears mass production — next battle about interfaces, yield and maintenance
    As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
    Monday 14 September 2026
    AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
    Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
    Monday 14 September 2026
    India's chip show nearly doubles in two years, with suppliers leading the build-out
    The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
    Friday 11 September 2026
    Taiwan govt boosts EDA R&D to target global gaps
    Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
    Friday 11 September 2026
    Huawei, Xiaomi, Apple take different bets on foldables

    Competition in the foldable smartphone market is intensifying as Huawei, Xiaomi, and Apple roll out or prepare next-generation foldable...

    Friday 11 September 2026
    Apple makes the hinge, not the screen, the centerpiece of its first foldable
    Apple has built its first foldable around a component nobody sees. The iPhone Duo, unveiled 9 September and on sale from 23 October at a starting price of US$1,999, is defined less...
    Friday 11 September 2026
    Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
    Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...
    Thursday 10 September 2026
    MicroIP lands NT$630 million AI smart-building contract in northern Taiwan
    MicroIP said on Sept. 10 that it secured a systems integration contract worth about NT$630 million for a major AI smart residential project in northern Taiwan. The agreement is expected...
    Thursday 10 September 2026
    STMicroelectronics ties AI data center carbon cuts to power design, not location
    STMicroelectronics (ST) recently shared its perspective on balancing AI growth with sustainability during a press conference in Taiwan. The company emphasized that controlling carbon...
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    Samsung trims foundry partner network as remaining DSPs gain momentum
    Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
    Thursday 10 September 2026
    Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
    Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
    1/59 pages
    Research_DB
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Semicon_TW