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Monday 8 June 2026
Molex expands in Taiwan as AI interconnect demand splits between copper and optics
Molex is building out a dual-track strategy for AI interconnects, backing both copper and optical solutions as customers pursue different deployment paths, while expanding its Taiwan...
Monday 8 June 2026
Apple M5 Pro teardown points to chiplet strategy shift
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
Monday 8 June 2026
Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Monday 8 June 2026
Nvidia and SK Hynix announce multiyear memory partnership covering AI servers, PCs, and robotics
Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman...
Sunday 7 June 2026
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape

Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to...

Sunday 7 June 2026
While China floods the humanoid market, America's top three are quietly building patent moats
Compared with China's crowded humanoid robot market, where competition is becoming increasingly intense, the US humanoid robot sector is still concentrated among a small number of...
Friday 5 June 2026
Huawei's Tau Law stirs debate over China's post-Moore's Law chip path

Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed...

Friday 5 June 2026
Foxconn deepens AI push with Intel on inference racks
Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Friday 5 June 2026
Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market
Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly...
Friday 5 June 2026
AI cooling demand is pushing server pumps into sharper focus
As AI pushes liquid cooling into mainstream server thermal design, suppliers are widening their focus beyond Nvidia's benchmark thermal designs. Industry players say pumps are emerging...
Friday 5 June 2026
PEGATRON COMPUTEX AI from Cloud Infrastructure to the Physical World

PEGATRON Corporation (PEGATRON) officially opened its booth at COMPUTEX 2026, presenting its AI Tech Maker strategy and its role in helping move AI from infrastructure...

Friday 5 June 2026
Arm says Taiwan powers its rise as agentic AI lifts PC growth
Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI...
Friday 5 June 2026
Foxconn, Intel link chips, racks and systems in AI infrastructure push
Foxconn announced on June 4 a strategic partnership with Intel to explore end-to-end AI solutions spanning chips, racks, systems, and applications, with cooperation covering AI rack...
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...