CONNECT WITH US
NEWS TAGGED DESIGN
Thursday 22 October 2026
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development,...
Thursday 22 October 2026
Inside Nvidia DSX POD: How a factory-built AI data center could go live in 14 days
Nvidia used its first GTC conference in Berlin to present a factory-style approach to AI, framing AI production as an industrial process. CEO Jensen Huang introduced the DSX full-stack...
Thursday 22 October 2026
BOS, LG, and HANA Micron team up on Korean automotive chiplets
BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Wednesday 21 October 2026
HD Hyundai Robotics unveils dual-arm robot as FIX 2026 opens
HD Hyundai Robotics unveiled a dual-arm robot under development at FIX 2026 in Daegu, South Korea, on October 21, marking its first public showing as the company seeks to expand beyond...
Wednesday 21 October 2026
Qisda integrates four companies to build scalable rack-scale AI solutions
Qisda Group is targeting rack-scale AI opportunities in data centers by accelerating development of its rack-scale AI solutions. Through in-house design, manufacturing, and cross-domain...
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
LX Semicon uses AI agents to cut display chip design time by 80%
South Korean IC design firm LX Semicon has deployed AI agents in the development of display driver ICs (DDIs), reducing the design time for a benchmark image-processing engine from...
Tuesday 20 October 2026
Powertip Technology transitions into a solutions provider as demand and costs rise
Powertip Technology is transitioning from a module design and supply company to a solutions provider. The company has seen rising demand in the first half of 2026 as the electronics...
Tuesday 20 October 2026
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
Tuesday 20 October 2026
AI substrate bottleneck shifts from design to manufacturing
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
Tuesday 20 October 2026
China's S2C–HyperSilicon merger targets hardware emulation gap in domestic EDA with Empyrean backing
China's electronic design automation (EDA) industry is consolidating, with Shanghai-based S2C and Wuxi-based HyperSilicon merging into a unified digital front-end EDA platform. Backed...
Tuesday 20 October 2026
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
China is proposing to extend AI technology export controls to chip design, memory technologies, and large-scale computing clusters, introducing specific technical thresholds for ea...
Tuesday 20 October 2026
MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency

Rugged edge computing brand – Cincoze has launched its new external EMC solution, the Power Protection Module (PPM), to further strengthen protection against the...