Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October...
Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission...
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
US defense technology company Shield AI has delivered its first V-BAT vertical takeoff and landing unmanned aircraft to Taiwan's Coast Guard Administration after winning a contract...
Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital and says it is in advanced discussions to close multiple acquisitions...
SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
Nvidia and Cisco have introduced a new pluggable optics form factor to expand AI infrastructure without sharply increasing power use or network complexity. For global cloud operators,...
AMD has introduced Helion, an open rack architecture designed for agentic AI workloads that could change how data centers allocate compute, power, and cooling. The system targets hyperscale...
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration...
