Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout...
Foxconn chairman Young Liu stated that the company would announce a collaboration with OpenAI at Hon Hai Tech Day (HHTD25). On the morning...