News tagged design at DIGITIMES

NEWS TAGGED DESIGN

Friday 24 July 2026

SK Hynix seeks US engineers for 3D stacked DRAM push

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...

Friday 24 July 2026

Nvidia 800V HVDC enters production in 1Q27, Delta set for 2Q ramp

SemiAnalysis recently forecast that large-scale deployment of Nvidia's native single-ended 800V high-voltage direct current power architecture could slip from the market's previous...

Thursday 23 July 2026

Moonshot AI model challenges EDA moat with 2-day chip design

China AI startup Moonshot AI has drawn intense attention from the semiconductor industry after unveiling its new large language model Kimi K3, which delivered strong results across...

Thursday 23 July 2026

Apple's first foldable iPhone faces production hurdles

Apple's long-rumored foldable iPhone is drawing fresh attention as supply-chain updates point to a possible debut at the company's...

Thursday 23 July 2026

Samsung Fold series debuts wide-screen design in strategic shift

Samsung Electronics unveiled three new foldable smartphones at its annual Galaxy Unpacked event in London on July 22, 2026, including the Galaxy Z Fold8, Galaxy Z Flip8, and Galaxy...

Thursday 23 July 2026

Merck makes 'AI for AI' its new semiconductor materials strategy

As the global AI race intensifies, Germany's Merck is extending its reach into semiconductor materials research with an "AI for AI"...

Thursday 23 July 2026

Samsung unveils new foldables in London as it expands lineup

Samsung Electronics used its annual Galaxy Unpacked event in London on July 22, 2026, to signal a broader push into foldable smartphones that could influence device trends worldwide...

Wednesday 22 July 2026

Foxconn's Jun Seki says L4 adoption will be in 80% of new cars by 2040

Foxconn group's EV strategy chief Jun Seki said on July 21 in Tokyo that Level 4 (L4) and above autonomous driving will likely be installed in 80% of new cars by 2040, and that the...

Wednesday 22 July 2026

Nvidia details Vera CPU for agentic AI workloads

Nvidia has outlined the design of its Vera CPU, positioning the chip for agentic AI systems that rely heavily on the processor for code execution, tool calls, retrieval, and data handling...

Wednesday 22 July 2026

Siemens to acquire Precision Innovations for AI-powered chip planning

Siemens said it has agreed to buy Precision Innovations in a deal that would add AI-powered chip planning tools to its electronic design automation business. The move could affect...

Wednesday 22 July 2026

Intel and Fortinet deepen collaboration on new security processor

Intel and Fortinet have expanded their long-standing partnership to develop the Fortinet Security Processor 6 (SP6), a move expected...

Wednesday 22 July 2026

WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample

Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip...

Wednesday 22 July 2026

WAIC 2026: Biren's 1,024-GPU NPO super node sharpens China's AI infrastructure race

Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence...

Wednesday 22 July 2026

Apple and Samsung drive foldables toward 4:3 displays as market enters next design cycle

The global foldable smartphone market is entering a new product cycle as Apple prepares to debut its first foldable iPhone and Samsung Electronics reportedly reshapes its foldable...

Wednesday 22 July 2026

Ablecom expands Taoyuan capacity to meet rising AI server rack demand

Ablecom Technology said it is expanding production capacity in Taoyuan, Taiwan, as demand grows for AI high-density compute and hyperscale data center buildouts. The chassis and advanced...

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BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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