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Wednesday 27 May 2026
China-based SmartSens, Unisoc team up on Micro LED optical interconnects for AI clusters
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for...
Wednesday 27 May 2026
Motorola launches Razr fold in Taiwan as foldable market gains momentum
Motorola launched its Razr foldable in Taiwan on April 26, after first unveiling the device at MWC 2026 in Barcelona in March 2026, and introduced new accessories, including wireless...
Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
Tuesday 26 May 2026
Inside China's chip war: How Xiaomi, BYD, and Nio are rewriting the rules
China's semiconductor war has been underway for seven or eight years now.
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Kian-Shen reports 2025 revenue decline but eyes growth in electric bus chassis and sustainable transport
Kian-Shen Industrial, a unit of Yulon Motor, reported on May 26 that 2025 consolidated revenue fell to NT$1.246 billion, a 15% decrease from the prior year, as customer labor shortages,...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Tuesday 26 May 2026
SK hynix unveils 'iHBM' thermal solution to boost AI performance

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

Tuesday 26 May 2026
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
Monday 25 May 2026
Nichidenbo appoints WT Microelectronics representative as chairman to cement share-swap tie-up
Nichidenbo's May 22 board changes and planned equity link with WT Microelectronics signal a strategic pivot that could influence global component supply chains, as leadership shifts...
Friday 22 May 2026
AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...
Friday 22 May 2026
Intel's foundry reset: 14A, 10A and tougher engineering rules
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on...
Thursday 21 May 2026
Tech Forum 2026: Taiwan must design space, not just build it
At DIGITIMES' Tech Forum 2026 this week, Taiwan's top space official delivered a blunt assessment of the island's growing role in the global space economy: Taiwan has become...
Thursday 21 May 2026
Five weak links India Semiconductor Mission 2.0 must fix
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...