CONNECT WITH US
NEWS TAGGED DESIGN
Thursday 4 June 2026
Samsung's rumored CIS production shift highlights industry debate over fab ownership
Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether...
Thursday 4 June 2026
Chenbro targets server rack global leadership in 3 years
Server chassis maker Chenbro is continuing to evolve, aiming to perfect the craftsmanship of mechanical components to become the world's top rack supplier, according to company CEO...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Thursday 4 June 2026
BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek
Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed...
Thursday 4 June 2026
Taiwan courts the world's AI startups in a bid to secure chip future
Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its...
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
Wednesday 3 June 2026
Google's AI glasses to boost wearable shipments to 17.5 million in 2026
Google moved into the AI glasses market with new Android XR smart glasses co-developed with Samsung Electronics and partnerships with eyewear brands, and the entry is expected to lift...
Wednesday 3 June 2026
COMPUTEX 2026 highlights spatial AI for homes and turnkey enterprise edge solutions
At COMPUTEX 2026 in Taipei, HOMEE AI, Osense Technology, and Senao International unveiled new AI products aimed at shifting deployment from cloud training to real-world inference and...
Wednesday 3 June 2026
Kentec aims to shorten the timeline for AI data center deployment
As artificial intelligence (AI) infrastructure grows larger and more complex, the challenge is no longer simply building data centers. It is building them fast enough.
Wednesday 3 June 2026
Pegatron unveils Vera Rubin AI infrastructure and AI Factory validation at Computex 2026
Pegatron announced a new generation of AI infrastructure products and an AI Factory validation framework at Computex 2026, showcasing the Nvidia Vera Rubin platform, HGX Rubin NVL8,...
Tuesday 2 June 2026
Chenbro debuts its comprehensive rack solutions for AI at COMPUTEX

Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed...

Tuesday 2 June 2026
PEGATRON Showcases AI Tech Maker Strategy at COMPUTEX 2026

PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing...

Tuesday 2 June 2026
Power Integrations unveils 1700V GaN auxiliary PSU for AI data centers
Power Integrations (PI) has announced two ultra-thin, compact auxiliary power supply (PSU) reference designs built for 800VDC AI data centers. PI principal training engineer Jason...
Tuesday 2 June 2026
Zhen Ding joins Nvidia MGX ecosystem to supply cable-free PCB technology for AI factories
PCB manufacturer Zhen Ding announced it had joined Nvidia's MGX ecosystem to support the deployment of the chipmaker's third-generation MGX modular architecture, which uses a PCB-based...
Tuesday 2 June 2026
Broadcom, Samsung launch Wi-Fi 8, 5G platform to bring fiber-grade FWA to mass market
Broadcom and Samsung Electronics have announced a broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 system-on-chip...