Foxconn Technology Group Chief Strategy Officer Jun Seki unveiled three new electric vehicles (EVs) at Hon Hai Tech Day 2026 (HHTD 26): the Model A+, an SUV derived from the Model...
Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image...
Foxconn Chairman Young Liu said at the opening of Hon Hai Tech Day 2026 (HHTD26) on October 30 that the company's core competitive strengths lie in its "processing capabilities" and...
Intel is cutting manufacturing costs for its newest processors, but the gains are reaching individual products and its foundry business at different speeds. Its October 29 earnings...
Samsung Electronics has secured a 2nm foundry order from Taiwan-based ASIC design house Faraday Technology. This win expands the application scope of Samsung's 2nm process from mobile...
As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.
French automaker Peugeot has unveiled the all-electric RCZ Vision concept sports car with two transparent microLED displays in the cockpit, supplied by AUO. The screens showcase a...
Applications for silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding across the electronics industry, affecting not only component selection but also product...
South Korean chip designer Global Technologies (GT) has secured a place in Hyundai Motor and Kia's supply chain with its first automotive semiconductor product, a smart LED module...
Huawei has extended its semiconductor-focused "Tau (τ) Law" framework to 5G base station design, using co-design across algorithms, chip architectures, and high-speed interconnects...
Apple's first touchscreen Mac reverses a design stance the company defended for more than a decade and is a premium-priced test of whether touch and tandem OLED can lift Mac demand...
Hyderabad-based Spintronics AI Semiconductors said on October 27 that it is evaluating the feasibility of establishing a gallium nitride (GaN) semiconductor fabrication facility at...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory...
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...
