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    UMC targets 12-inch TFLN to break 400G SiPh bottleneck
    1min ago
    Apple's M6 and M5 Ultra break rule tying process to chip strength
    1min ago
    How Taiwan is closing its semiconductor materials gap — three shifts to watch
    9min ago
    Micro LED maker PlayNitride targets Micro LED optical communications within two years
    9min ago
    Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%
    10min ago
    AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
    10min ago
    US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles
    31min ago
    China memory-module makers report surging profits, strained cash flow
    32min ago
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    Sep 1, 19:00
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    Sep 1, 19:00
    InP enters a capacity race as TCL moves into indium phosphide laser chips
    Sep 1, 19:00
    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
    Sep 1, 19:00
    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
    Sep 1, 19:00
    NEWS TAGGED DEMAND
    Wednesday 2 September 2026
    DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs

    DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing...

    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains

    As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

    Tuesday 1 September 2026
    Taoyuan eyes northern AIDC hub, touts Tatan and LNG cooling edge
    Taiwan's limited land and heavy dependence on imported energy have made power a scarce and strategic resource in the compute era, putting AI data center (AIDC) site selection on the...
    Tuesday 1 September 2026
    Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains
    Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages...
    Tuesday 1 September 2026
    AI server demand lifts Japanese capacitor shipments by 22% in first half of 2026
    Japanese electronic component shipments rose in the first half of 2026 as demand from AI servers drove strong growth in capacitors and other parts. According to Nikkei and...
    Tuesday 1 September 2026
    ASE CEO describes AI resource squeeze as a short-term problem
    AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
    Tuesday 1 September 2026
    South Korea CCL exports surge 42% on AI demand
    South Korea's copper-clad laminate, or CCL, exports jumped sharply in the first seven months of 2026 as AI infrastructure investment and larger semiconductor packaging lifted demand,...
    Tuesday 1 September 2026
    Tmytek moves toward Taiwan listing as millimeter-wave demand nears mass production
    Tmytek is preparing to list on the Taiwan Innovation Board as its millimeter-wave platforms approach commercial scale. For global telecom, satellite, and defense customers, the timing...
    Tuesday 1 September 2026
    SEMI lifts 2028 wafer fab equipment forecast to US$220 billion
    SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
    Tuesday 1 September 2026
    China's memory chipmakers post a record 1H — but not all of it came from chips
    Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...
    Tuesday 1 September 2026
    LG Energy Solution secures long-term US lithium supply
    LG Energy Solution has signed a long-term supply agreement with Smackover Lithium for battery-grade lithium carbonate, a move that could strengthen supply chains for energy storage...
    Tuesday 1 September 2026
    TSMC delays CoWoS orders as CoPoS plans take shape
    TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
    Tuesday 1 September 2026
    Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers
    Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...
    Tuesday 1 September 2026
    JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
    JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
    Tuesday 1 September 2026
    Cisco: CPO is ready for mass deployment amid surging AI data-center demand
    For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...
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    GlobalExhibition
    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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