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Wednesday 30 September 2026
TDK and Taiyo Yuden to explore alliance on AI-grade capacitors and inductors
TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the...
Wednesday 30 September 2026
Neocloud lifts OEM buying as ODM-direct share slips below 80% in 2026
Taiwan-based server original design manufacturers (ODMs) have long been key partners for cloud service providers (CSPs) through the ODM-direct model, but the model's share is declining...
Wednesday 30 September 2026
AI boom strains PCB supply chain as materials, equipment shortages persist into 2027
Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...
Tuesday 29 September 2026
Foxtron writes a new chapter in Taiwan auto history
Taiwan's auto market has faced plenty of challenges in recent years, from broader industry headwinds to continued scrutiny of domestic car production. Against that backdrop, Foxconn-backed...
Tuesday 29 September 2026
Cerebras to power Gimlet's push for faster AI inference
Cerebras Systems is expanding its push into AI inference infrastructure through a collaboration with Gimlet Labs, as demand grows for computing systems capable of delivering faster...
Tuesday 29 September 2026
AI boom sends China and Taiwan's PCB makers racing to HK for capital
Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed...
Tuesday 29 September 2026
Solidigm weighs US IPO as AI storage demand lifts valuation
SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation...
Tuesday 29 September 2026
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
Tuesday 29 September 2026
LG expands AI data center cooling ties with Microsoft, SK Enmove
LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC)...
Tuesday 29 September 2026
VSMC Singapore fab fully booked as VIS weighs Fab 2
Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor...
Tuesday 29 September 2026
Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

Tuesday 29 September 2026
LG AI Research expands sovereign AI push into Kazakhstan, Middle East
LG AI Research is moving into Kazakhstan and the Middle East to capture demand for sovereign AI in emerging markets. The South Korea-based unit is using its model development and commercialization...
Tuesday 29 September 2026
IDC says AI agent growth will widen global compute shortage by 2027

AI agents are moving into enterprise workflows and driving a sharp rise in demand for AI infrastructure, with a new report from IDC...

Tuesday 29 September 2026
AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used...

Tuesday 29 September 2026
Blade Hydrogen Green Technology targets waste hydrogen power for AIDC

As electricity demand from AI data centers and the semiconductor industry climbs rapidly, Blade Hydrogen Green Technology is tapping...