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Friday 31 July 2026
US CSP leaders keep capex growth as AI monetization deepens
Concerns over whether AI is a bubble hinge on two key questions: can related investments be monetized, and will cloud service providers (CSPs) keep expanding capital spending? Based...
Friday 31 July 2026
Tokyo Electron raises outlook as AI data center spending lifts memory demand
Tokyo Electron lifted its operating profit outlook for April-September 2026 on July 30, citing continued investment in AI data centers and stronger semiconductor capital spending....
Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
Auto chip demand recovers, but restocking remains elusive

Automotive chip sales are improving across Europe and the US, but major suppliers say global carmakers and their suppliers are still...

Friday 31 July 2026
Memory shortages deepen as prices climb into the second half of 2026

Memory shortages are tightening across the supply chain, and higher contract prices are set to ripple through global electronics markets...

Friday 31 July 2026
AI server boom reshapes MLCC pricing as capacity shifts upmarket

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

Friday 31 July 2026
CHPT raises 2026 capex to NT$500M

Test interface maker Chunghwa Precision Test Tech (CHPT) held an investors' conference on July 29, saying revenue growth in the second...

Friday 31 July 2026
Delta Electronics raises 2026 capex to NT$70B, sees AI-related sales topping 25% of total

Delta Electronics expects capital spending to rise to roughly NT$70 billion in 2026 from NT$46.1 billion in 2025, driven by growing...

Friday 31 July 2026
AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026
Apple braces for "hundred-year flood" in component costs
Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a looming challenge: rising memory prices, tight supply of advanced chips, and heavier...
Friday 31 July 2026
Amazon's accelerating cloud growth reinforces AI investment case despite heavier spending outlook
Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud computing business underscored rising demand for artificial intelligence services...
Friday 31 July 2026
Apple beats quarterly estimates, but softer outlook and supply constraints temper optimism
Apple reported stronger-than-expected fiscal third-quarter results, driven by robust iPhone and Mac demand, but warned that supply constraints and rising memory costs would weigh on...
Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
UMC raises capex to US$2B, eyes AI SiPh
UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...
Friday 31 July 2026
US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...