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Wednesday 14 October 2026
AVC unveils 6MW In-Row CDU at OCP, adds predictive cooling
Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October...
Wednesday 14 October 2026
AI computing demand drives water management integration at Tianyi
Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
Wednesday 14 October 2026
Tsang Yow's semiconductor revenue share reaches 12%
Automotive drivetrain manufacturer Tsang Yow reported consolidated revenue of NT$86.36 million (US$2.69 million) in September 2026, down 2.3% month-over-month and 1.24% year-over-year...
Wednesday 14 October 2026
Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs
Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman...
Wednesday 14 October 2026
China's smartphone slump: Can Apple's new lineup light a spark?
China's smartphone market faces dual pressures as weakening consumer spending and rising component costs continue to weigh on the handset sector. According to third-quarter data from...
Wednesday 14 October 2026
Microsoft adds US$132.5 billion in lease commitments—but AI capacity takes years to build
Microsoft's lease commitments that have not yet commenced reached US$329.1 billion in the fourth quarter of fiscal 2026, which ended in June, according to its latest regulatory filing...
Wednesday 14 October 2026
ASML's record 3Q26 sales expose a capacity gap for AI chip demand through 2028
ASML reported record third-quarter 2026 net sales of EUR11.7 billion (approx. US$13.1 billion) and net income of EUR5 billion, while warning that its planned supply for 2027 and 2028...
Wednesday 14 October 2026
JCET redirects Korean factories towards AI to counter weak smartphone growth
JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure...
Wednesday 14 October 2026
AI chip competition shifts to data-center efficiency as memory, interconnect limits bite
As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....
Wednesday 14 October 2026
LGD's KRW104.1B auto LCD module sale collapses
LG Display (LGD) has canceled the planned sale of its automotive LCD module business at its Nanjing subsidiary, losing a potential KRW104.1 billion (about US$72 million) payment and...
Wednesday 14 October 2026
Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
Wednesday 14 October 2026
CyberTAN sells Hsinchu site in US$68B deal to fund strategy shift
CyberTAN Technology's sale of its Hsinchu Science Park factory and auxiliary facilities signals a broader shift toward higher-growth networking and AI infrastructure. The move may...
Wednesday 14 October 2026
TOK expands Koriyama photoresist capacity as AI chip demand rises
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
Memory bottlenecks drive HBM shift to 8-layer stacks
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...