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Wednesday 12 August 2026
MediaTek, Realtek, Himax, Elan eye optical communications boom in 2027
The use of optical communications in cloud AI data-center interconnect architectures is rising sharply, and Taiwan IC design firms including MediaTek, Realtek Semiconductor, Himax...
Wednesday 12 August 2026
Memory giants hold $38 billion in customer guarantees as buyer leverage seen returning by 2029
The global memory industry has embraced a new business model over the past two quarters. Memory manufacturers are not only signing multi-year supply agreements with customers, but...
Wednesday 12 August 2026
DB HiTek profit jumps 43% as TSMC, Samsung scale back 8-inch capacity
DB HiTek posted a 43% jump in second-quarter operating profit as tighter 8-inch foundry supply and stronger power semiconductor demand kept its fabs running near full capacity, with...
Wednesday 12 August 2026
Nichidenbo sees MLCC supply tightness as AI pushes lead times to 36 weeks

Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

Wednesday 12 August 2026
TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
CoreWeave accelerates power expansion as AI infrastructure demand surges
CoreWeave reported second-quarter fiscal 2026 revenue of US$2.6 billion, up 112% year-over-year and 24% sequentially, and raised its full-year outlook as demand for its AI cloud infrastructure...
Wednesday 12 August 2026
IBM, Together AI plan large-scale Nvidia cluster on IBM Cloud

IBM and Together AI have announced a collaboration to deploy a dedicated Nvidia-powered inference cluster on IBM Cloud, a move that...

Wednesday 12 August 2026
OCP: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
CoreWeave's revenue more than doubles as US$104 billion backlog tests its ability to build fast enough
CoreWeave's second-quarter results showed the AI cloud provider converting demand into revenue faster, even as its widening net loss and ballooning capital spending underline the central...
Wednesday 12 August 2026
Apple's shadow looms over TSMC's Sony sensor deal

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

Wednesday 12 August 2026
TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...
Wednesday 12 August 2026
Topco and Wah Lee post record July sales on semiconductor materials demand

Topco Scientific Co. and Wah Lee Industrial Corp. both reported record July revenue as chipmakers ran at full utilization and customers...

Wednesday 12 August 2026
Lite-On's LEO satellite power growth signals a deeper shift in global manufacturing

Lite-On Technology reported strong revenue growth in the first seven months of 2026, fueled by demand for AI, cloud, and LEO satellite...