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Tuesday 26 May 2026
Darfon Electronics invests in AI cooling systems maker GrAndvance
As demand for high-performance computing continues to rise, thermal management has emerged as one of the most critical constraints on server performance. Liquid cooling systems, once...
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Wonderful Hi-Tech sees rising demand from low-orbit satellites and AI data centers
At its annual shareholders' meeting on May 25, Ringo Chang, chairman of Wonderful Hi-Tech, said the cable and connectivity supplier expects revenue growth to resume in 2026, with profit...
Tuesday 26 May 2026
Wiwynn expands US capacity as AI server boom strains power and supply chains

Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure...

Tuesday 26 May 2026
AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners...

Tuesday 26 May 2026
Win Semiconductors bets on optical and satellite communications growth
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of Win Semiconductors, said the company is actively advancing a range...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
Tuesday 26 May 2026
GlobalWafers rolls out phased GaN capacity expansion to ease supply crunch
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing...
Tuesday 26 May 2026
ASML expands Taiwan hiring and operations to meet advanced chip demand
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV...
Tuesday 26 May 2026
Kian-Shen reports 2025 revenue decline but eyes growth in electric bus chassis and sustainable transport
Kian-Shen Industrial, a unit of Yulon Motor, reported on May 26 that 2025 consolidated revenue fell to NT$1.246 billion, a 15% decrease from the prior year, as customer labor shortages,...
Tuesday 26 May 2026
GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI...
Tuesday 26 May 2026
Intel CEO Lip-Bu Tan Taiwan-bound for closed-door meetings ahead of Computex
Intel CEO Lip-Bu Tan is set to arrive in Taiwan this weekend, joining AMD CEO Lisa Su and Nvidia CEO Jensen Huang in a high-stakes push by the world's top chip leaders to deepen ties...
Tuesday 26 May 2026
Taiwan MLCC makers plug into AI server demand
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20...