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Monday 9 March 2026
Micron: LPDRAM server demand to outpace market; Taiwan key production base
The rapid expansion of generative artificial intelligence (AI) and large language models (LLMs) is driving a new phase of transformation in data center memory architecture, according...
Monday 9 March 2026
Nvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubin

Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity...

Monday 9 March 2026
RichWave sees steady Wi-Fi 7 demand despite 4Q25 revenue dip, Wi‑Fi 8 eyed for 2028 rollout
RF front-end supplier RichWave reported at an investor briefing on March 6 that steady demand for Wi-Fi 7 coincided with a slight sequential revenue decline in the fourth quarter of...
Monday 9 March 2026
LCD TV panel prices rise in 1Q26 as demand stays strong
After the Lunar New Year, LCD TV panel prices have continued to climb, driven by inventory buildup for sports events and rising costs. This momentum pushed February's LCD TV panel...
Monday 9 March 2026
Samsung keeps Galaxy S26 price hikes modest in Taiwan as memory costs rise
Samsung Electronics officially unveiled its annual flagship Galaxy S26 series and Galaxy Buds4 Bluetooth earphones on February 26, with Taiwan promotions announced on March 4. Rising...
Monday 9 March 2026
LCD monitor panel prices to rise in March 2026 as notebook panel declines slow
As LCD TV panel prices climb, LCD monitor panel prices have also seen a modest rebound. Although brand vendors are placing orders at different rates, overall demand for LCD monitors...
Sunday 8 March 2026
Adata chairman expects NAND price surge in 2H26
Memory module giant Adata reported record-high operations in 2025, with chairman Simon Chen forecasting a strong memory market throughout 2026. He highlighted that upstream manufacturers'...
Sunday 8 March 2026
Applied Materials VP warns AI growth may hit energy, not chip limits
AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...
Sunday 8 March 2026
DynaPack plans triple BBU capacity expansion to meet AI data center demand
With AI data centers now integrating battery backup units (BBU), battery module maker DynaPack plans to add an additional 200% to its production capacity at its Taiwan and Thailand...
Sunday 8 March 2026
Broadcom CEO sees copper interconnects viable through 2028

Broadcom reported strong results for the first quarter of fiscal 2026, driven by robust demand for cloud application-specific integrated...

Saturday 7 March 2026
TienPin eyes stable growth in 2026 as AI server liquid-cooling cleaning demand heats up
TienPin United Enterprise has been benefiting from a rapid surge in the artificial intelligence (AI) server liquid-cooling cleaning business since the second half of 2025, with its...
Friday 6 March 2026
Nvidia's LPU push could reshape inference economics as OpenAI signals major buy
Nvidia plans to shift the AI compute battleground from training to inference by integrating language processing unit technology and offering multiple inference chips, with OpenAI agreeing...
Friday 6 March 2026
AP Memory expands S-SiCap capacity as chipmakers shift toward custom memory
AP Memory expects growth momentum to extend into 2026, with revenue visibility already exceeding the typical six-month outlook seen in previous years. Tight supply in the global memory...
Friday 6 March 2026
Samsung bets on higher-priced Galaxy S26 to lift Taiwan revenue
Samsung Electronics unveiled its Galaxy S26 series and Galaxy Buds4 earphones on February 26. They disclosed a Taiwan rollout plan on March 4, with pre-orders running from March 4...
Friday 6 March 2026
Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...