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Monday 19 January 2026
China's Innosilicon launches LPDDR6 IP with commercial shipments
As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...
Monday 19 January 2026
Apple leads global smartphone market, Huawei tops China in 2025
Despite supply-chain pressure and memory shortages, the global smartphone market remained resilient in 2025, supported by strong demand for high-end models, foldable devices, and early...
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
OpenAI taps Cerebras for US$10 billion AI chip buildout
OpenAI said it would partner with the artificial intelligence chip maker Cerebras to build 750 megawatts of ultra-low-latency AI computing capacity, a project that will come online...
Monday 19 January 2026
KLA Strengthens Taiwan Presence, Investing NT$465M in Talent and Technology

The semiconductor industry stands at one of its most pivotal moments. As AI drives explosive demand for computing power, chip manufacturing grows exponentially - die...

Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Monday 19 January 2026
Taiwan's DDI chipmakers fight for survival beyond displays

Taiwanese DDI vendors rode a post-pandemic growth wave, but demand turned increasingly uncertain in 2025. Weak consumer end markets, slowing...

Monday 19 January 2026
Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors
Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The...
Sunday 18 January 2026
SK Hynix accelerates advanced packaging from Korea to Indiana
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
Saturday 17 January 2026
TSMC speeds up US expansion while keeping FX strategy simple
TSMC is speeding up its multibillion-dollar expansion in Arizona after posting strong earnings, signaling confidence in long-term artificial intelligence demand and the US push to...
Saturday 17 January 2026
NIAR launches chip-level advanced packaging platform to boost Taiwan's semiconductor edge
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
Saturday 17 January 2026
Micron's new fabs target 2030 rollout as supply shortages linger

Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing...

Saturday 17 January 2026
Top 10 Chart: Taiwan's IC design sector ends 2025 with an AI-led split
Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer...
Saturday 17 January 2026
NAND makers hike prices up to 100%, squeezing low-end consumer drives
The large-scale deployment of artificial intelligence servers has driven a sharp increase in demand for mass storage, with market sources saying NAND flash contract prices for the...
Saturday 17 January 2026
Samsung DS rebounds to record KRW20 trillion under new leadership
Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...