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NEWS TAGGED DEMAND
Tuesday 9 June 2026
SuperAlloy targets semiconductor supply chain with recycled aluminum push
SuperAlloy reported that rising demand from global luxury and supercar manufacturers, alongside green procurement policies, drove higher sales of recycled aluminum in May, lifting...
Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...
Tuesday 9 June 2026
Delta, Liteon tackle AI power and load stability needs
As AI shifts from training to inference and agents, computing and power demand are growing exponentially, putting energy supply and load stability at the center of the industry's next...
Tuesday 9 June 2026
Tencent takes dual-track AI chip route with Canghai V2 and domestic partnerships
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing...
Tuesday 9 June 2026
Topco monthly sales hit third-highest level on chip materials demand
Topco Scientific said strong demand from artificial intelligence and high-performance computing drove higher shipments of advanced-process materials, lifting consolidated revenue in...
Tuesday 9 June 2026
Yesiang begins shipping recycled filters as 2nm demand lifts AMC market
Taiwan's Yesiang has started volume shipments of a newly certified recycled advanced micro-contamination (AMC) filter as semiconductor makers push deeper into 2nm and smaller nodes...
Tuesday 9 June 2026
GSEO surpasses NT$10 billion in five-month revenue and plans July mass production
Genius Electronic Optical reported consolidated revenue of NT$1.629 billion (US$51.5 million) in May 2026, marking a month-on-month decline from NT$2.314 billion in April but a 30.24%...
Tuesday 9 June 2026
Taiwan server makers post strong May sales as AI demand continues to drive orders
Taiwan's leading server manufacturers reported strong May sales, underscoring how global AI infrastructure spending is reshaping demand for data center hardware. The gains point to...
Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Tuesday 9 June 2026
Panasonic raises SP-Cap prices as AI drives passive component demand
Passive component prices are staying elevated as AI continues to drive demand, with industry sources saying pricing in 2026 will remain at high levels. Panasonic is set to launch a...
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Tuesday 9 June 2026
HiSilicon chip price hikes put China's AI compute supply chain back in focus
Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after...
Tuesday 9 June 2026
AI demand is turning memory chips into rationed assets, Morgan Stanley says
AI is reshaping the global memory-chip market, according to Morgan Stanley, by pulling in more DRAM, HBM, and NAND, and turning once-cheap components into scarce resources. The shift...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.