Since the 20nm node, advancements in DRAM process technology have decelerated, with development from 19 to 11nm occurring in small, 1 to 2nm steps across several nodes labeled from...
Former Samsung Electronics executive Jin-seok Choi was recently detained again by court order for leaking DRAM process technology to China, with over 30 additional researchers now...
Semiconductor expert Jin-seok Choi, who was previously accused of leaking Samsung Electronics' 20nm DRAM manufacturing technology data to China and attempting to establish a "cloning...
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, announces an advanced process based...
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
The 30–40% reduction in output at Winbond Electronics' wafer fab in Taichung (central Taiwan) has been reduced to less than 20%, and the memory chipmaker plans to begin installing...
Macronix International and Winbond Electronics have both reduced output in response to the current decline in the memory chip market, but continue to make progress in new product...
Taiwan's memory maker Windbond Electronics has cut into the supply chain of Europe's largest e-bike maker with its specialty DRAM, and is also actively developing sales of its flash...
Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth...
Specialty DRAM specialist Winbond Electronics plans to advance its second-phase facility construction at its new plant in Kaohsiung, southern Taiwan to ease tight capacity for specialty...
China-based memory foundry ChangXin Memory Technologies (CXMT) is gearing up for its entry into the DDR3 memory market segment with its in-house developed 17nm process technology,...
Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Chip orders for notebooks are expected to stay robust until the end of the third quarter, according to Arthur Chiao, chairman for specialty DRAM and flash memory maker Winbond Elec...
