CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 27 October 2026
AI demand squeezes automotive memory, pushing automakers to take control of chip supply
Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory...
Tuesday 27 October 2026
Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit
Nvidia CEO Jensen Huang's visit to Kazakhstan highlighted plans to build an AI computing hub for Europe, with projects spanning GPU clusters, data centers, talent, and physical AI...
Tuesday 27 October 2026
Nvidia says GPUs last 8 years, unlocking AI financing
After the GTC Berlin conference, Nvidia CEO Jensen Huang and Silicon Valley technology investor Gavin Baker spoke with Yahoo Finance for about half an hour. Huang confirmed...
Tuesday 27 October 2026
Nvidia's Berlin keynote highlights AI scaling challenges in Europe
Nvidia opened GTC 2026 in Berlin on October 21 with a keynote highlighting AI infrastructure, security architecture, and Physical AI, while a Greenpeace protest briefly interrupted...
Tuesday 27 October 2026
China supply-chain price hikes strain domestic demand
China’s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to...
Tuesday 27 October 2026
Fine M-Tec rejects component blame as foldable market outlook remains positive
Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and...
Tuesday 27 October 2026
AI data center boom risks squeezing power chip supplies for auto, electronics
The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more...
Tuesday 27 October 2026
Weekly news roundup: iPhone Duo shipment target revised upward amid display issues
This week's coverage highlights shifting technology supply chains and rising demand across foldable smartphones, memory, energy storage, robotics, and AI infrastructure. Apple lifted...
Tuesday 27 October 2026
HCLTech and Rapidus open India centers to support semiconductor engineering
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...
Tuesday 27 October 2026
As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge
Days after the launch of Apple's US$2,000 iPhone Duo, a wave of reports regarding broken inner screens has surfaced across Reddit, TechCrunch, and Forbes. Early buyers...
Tuesday 27 October 2026
Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI
Cadence Design Systems is betting that chipmakers will want AI models trained on its own design tools and run wherever customers choose. That puts it on a different route from rival...
Tuesday 27 October 2026
Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets
Cadence Design Systems used its third-quarter earnings call to argue that demand for chip design tools is no longer tied only to the AI hardware buildout. It pointed to analog and...
Tuesday 27 October 2026
India sets October 2028 target for homegrown smartphone brand
India's electronics and IT minister, Ashwini Vaishnaw, has set October 23, 2028, as the date by which the country will have mobile phones that are designed, manufactured, and branded...
Tuesday 27 October 2026
Cadence raises 2026 outlook as AI design demand drives record backlog
Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying...
Monday 26 October 2026
Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware
In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...