Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 14 April 2026

China's 2nm AI GPU hits prototype, production unclear

Shanghai Dishan Technology has advanced its 2nm-class AI GPU into the prototyping stage, marking a rare push by a China-based designer into cutting-edge AI silicon — though manufacturing...

Tuesday 14 April 2026

Panel makers lift 1Q26 sales on early orders; demand outlook turns cautious

Front-loaded orders, fewer February working days, and a low base lifted Taiwanese panel makers' March revenue. In the first quarter of 2026, Innolux, GiantPlus, and Hannstar Display...

Tuesday 14 April 2026

Apple increased foldable display inventory by 20% ahead of iPhone Fold launch

Despite slowing growth in the foldable smartphone market, Apple has reportedly increased its foldable display panel inventory by 20% for its first foldable phone, the iPhone Fold,...

Tuesday 14 April 2026

Samsung Foundry advances space semiconductor chip and technology development

As global companies unveil plans for space AI data centers, South Korean firms are prioritizing space-related technology as a new growth driver. Samsung Electronics' foundry division...

Tuesday 14 April 2026

Google and Intel expand CPU partnership, boosting ASIC and startup opportunities

Google recently announced an expanded collaboration with Intel to increase the deployment of Xeon processors in its cloud AI data centers. This move reflects the rapidly growing demand...

Monday 13 April 2026

MediaTek revenue hits record on AI chip demand, TPU orders key

Taiwan-based chip designer MediaTek reported record monthly revenue in March 2026, highlighting how new growth drivers are helping cushion a weakening smartphone market.

Monday 13 April 2026

China chipmaker Hygon expands CPU-GPU strategy for AI compute

China's push for AI self-sufficiency is lifting Hygon Information Technology from a server CPU supplier into a broader AI compute platform...

Monday 13 April 2026

TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line

Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...

Monday 13 April 2026

Taiwan panel makers keep sub-7.5G lines, pivot to flexible capacity strategy

BOE former chairman Wang Dongsheng once predicted that panel production lines below Generation 7.5 would eventually be phased out following the end of the industry's oligopolistic...

Monday 13 April 2026

India roundup: Domestic chip firms anchor India's semiconductor ambitions

India is advancing its semiconductor ecosystem via design alliances and acquisitions, while recalibrating...

Monday 13 April 2026

DIGITIMES Insight: US MATCH Act tightens export noose while Intel swaps debt for control and Nvidia co-opts rivals

The semiconductor industry is undergoing coordinated shifts that could reshape equipment flows, corporate financing, and supplier relationships in the AI era, according to DIGITIMES...

Monday 13 April 2026

Taiwan's chip program covers 200+ high-end devices to boost advanced IC design talent

The Chip-based Industrial Innovation Program (Taiwan CBI), a decade-long, NT$300 billion (US$9.4 billion) initiative launched by the Executive Yuan to support academic and research...

Sunday 12 April 2026

Murata produces seven automotive MLCCs for autonomous driving and power supply markets

Murata Manufacturing, a leading Japanese passive component manufacturer, announced that it has begun mass production of seven types of multilayer ceramic capacitors (MLCCs) for automotive...

Sunday 12 April 2026

Why some ASIC design service firms are missing out on the AI boom?

Taiwan's ASIC design service providers delivered sharply divergent results in the first quarter of 2026, underscoring how exposure to artificial intelligence (AI) demand does not translate...

Saturday 11 April 2026

Samsung Exynos 2700 benchmark leak offers early look at 2nm SF2P performance

Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process...

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