Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 22 September 2026

MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...

Tuesday 22 September 2026

MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook

MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.

Tuesday 22 September 2026

AT&S Unveils Strategy to Drive AI Growth

Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering...

Tuesday 22 September 2026

Daeduck nears long-term supply deals as Doosan expands capacity amid tight T-glass supply

South Korea's PCB and semiconductor substrate supply chain is expanding capacity as demand from servers and data centers rises, with customers moving to secure long-term supply while...

Tuesday 22 September 2026

AI inference demand surges as training slowdown talk fades

Calls to slow frontier AI model training have sparked debate across the AI semiconductor industry, but executives at the AI Infra Summit in Santa Clara, California, said the real buildout...

Monday 21 September 2026

Taiwan delays 2026 power rate decision as war drives fuel costs higher

Taiwan's Ministry of Economic Affairs delayed a 2026 electricity rate decision on September 18 after the Middle East war pushed up fuel...

Monday 21 September 2026

Rebellions chips process over 4 billion tokens a day for SK Telecom

South Korean AI chipmaker Rebellions has expanded its neural processing units (NPUs) across four commercial SK Telecom services, with the infrastructure now processing about 14 million...

Monday 21 September 2026

Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Monday 21 September 2026

India roundup: Semicon India 2026 puts commercial production and supplier investment in focus

India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...

Friday 18 September 2026

Winbond cements server NOR lead with Infineon deal

Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...

Friday 18 September 2026

Corning to raise display glass substrate prices 15% from 4Q26

Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...

Friday 18 September 2026

CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Friday 18 September 2026

Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026

Foldable smartphone panel shipments fall 13% in 1H26 as market shifts to in-fold designs

Global foldable smartphone panel shipments declined 13% year-over-year in the first half of 2026, with the contraction concentrated in clamshell products, according to Counterpoint...

Friday 18 September 2026

Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs

The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied...

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