Global supply chain: Key components

Key components news coverage

IN THE NEWS

Thursday 18 June 2026

Elon Musk aims for record maximum usable compute per wafer for AI6 chip

Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6...

Thursday 18 June 2026

FOPLP race heats up as Innolux reportedly teams with TSMC

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...

Thursday 18 June 2026

Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026

SK Hynix scraps degree rules to court AI chip talent

SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks...

Thursday 18 June 2026

WUS and its subsidiary keep complementary AI partnership

A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in...

Wednesday 17 June 2026

Li Auto's new automotive chip and what it says about China's EV market

Li Auto announced details of its new Mach M100 chip, a self-developed 5nm chip focused on autonomous driving, on June 15. This development...

Wednesday 17 June 2026

China PCB maker DSBJ bets US$1.2 billion on AI optical modules

Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing...

Wednesday 17 June 2026

InnoScience wins GaN patent battle against Infineon in China

InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power...

Wednesday 17 June 2026

PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors

Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate...

Wednesday 17 June 2026

Nvidia highlights role of optical networking as Coherent breaks ground on Texas AI chip facility

AI infrastructure is increasingly dependent on light, and more of that technology is being built in Texas. Coherent's new Sherman expansion, backed by public and private funding, could...

Wednesday 17 June 2026

Huawei raises end-consumer product prices from July

Huawei has notified partners and channel distributors that it will raise end-customer prices across its Intelligent Collaboration product line from July 1 this year, as the AI computing...

Tuesday 16 June 2026

Nvidia sells US$25 billion in bonds as investors seek foothold in AI boom

Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This...

Tuesday 16 June 2026

TSMC eyes A16 mass production in 4Q26 and Intel refines 18A roadmap with 18A-P

Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...

Tuesday 16 June 2026

Qualcomm weighs Tenstorrent deal that could reach US$10 billion

Qualcomm has been in talks to acquire Tenstorrent, an AI chip startup, The Information reported, citing a person with direct...

Tuesday 16 June 2026

China AI chip hopeful Enflame nears IPO with fast revenue growth, heavy losses, and Tencent risk

Shanghai Enflame Technology is nearing a STAR Market listing, bringing another Chinese AI chipmaker closer to public markets while...

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