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Thursday 28 May 2026
FuriosaAI and Broadcom partner on AI inference platform for agentic computing era
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as...
Thursday 28 May 2026
Huawei chip chief says post-Moore race is no longer just about nanometers
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission...
Thursday 28 May 2026
Apple's entry-level push puts pressure on Windows notebook makers
Apple's introduction of the MacBook Neo has intensified competition in the low-end notebook market, putting pressure on Windows-based manufacturers across both education and consumer...
Thursday 28 May 2026
Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering...

Thursday 28 May 2026
Nvidia's Rubin CPX plans clouded as Groq gains bigger inference role
Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the...
Thursday 28 May 2026
Commentary: China's AI chip certification becomes new market gatekeeper
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something...
Thursday 28 May 2026
Synopsys flags mixed regional trends as China growth contrasts with weaker Western demand
Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor...
Thursday 28 May 2026
Huawei Tau Law series 3: Global chip experts split over China's post-Moore push
Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...
Thursday 28 May 2026
Synopsys sees agentic AI and Ansys integration expanding long-term growth opportunities
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation...
Thursday 28 May 2026
Wonik IPS secures Visionox XR display etcher order for Kunshan OLED line
Chinese display maker Visionox is moving ahead with a major extended reality display production project in Kunshan, strengthening China's push into high-pixel-density OLED panels for...
Thursday 28 May 2026
Qualcomm wins ASIC customers beyond ByteDance
Qualcomm has reportedly landed more than one ASIC customer, with a separate project for a US cloud service provider also taking shape, according to industry sources. The development...
Thursday 28 May 2026
Synopsys sees hyperscaler chip ambitions fueling AI-related demand
Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design...
Thursday 28 May 2026
Marvell raises multi-year outlook as AI data center demand drives accelerating growth
On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure,...
Thursday 28 May 2026
Marvell eyes XPU and attach wins as pillars of custom silicon growth
Marvell Technology has said its custom silicon business and data center solutions are emerging as central pillars of its long-term growth strategy, driven by rising demand from hyperscale...
Thursday 28 May 2026
Marvell expands silicon photonics, switching, and interconnect roadmap
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that...