Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 16 June 2026

TSMC A16 takes center stage at VLSI 2026 as mass production targets 4Q26 ramp

Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...

Tuesday 16 June 2026

Qualcomm weighs Tenstorrent deal that could reach US$10 billion

Qualcomm has been in talks to acquire Tenstorrent, an AI chip startup, The Information reported, citing a person with direct...

Tuesday 16 June 2026

China AI chip hopeful Enflame nears IPO with fast revenue growth, heavy losses, and Tencent risk

Shanghai Enflame Technology is nearing a STAR Market listing, bringing another Chinese AI chipmaker closer to public markets while...

Tuesday 16 June 2026

AMD to acquire MEXT to expand AI memory optimization tools

AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance,...

Tuesday 16 June 2026

South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors

South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according...

Tuesday 16 June 2026

Nvidia reportedly tightens grip on AI inference market despite growing competition

Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible...

Tuesday 16 June 2026

3Q26 LCD TV panel market cools as small sizes lead decline

Global LCD TV panel prices have entered a new round of adjustment after the FIFA World Cup and China's 618 Shopping Festival stocking...

Tuesday 16 June 2026

AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity

Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as...

Tuesday 16 June 2026

Apple leans on Google Cloud and Nvidia GPUs in a pragmatic AI reset

After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that...

Monday 15 June 2026

Taiwan's IC design sector posts sharpest gains in years; May data hints at further acceleration into 2H26

Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading...

Monday 15 June 2026

Wus Printed Circuit sees turnaround on high-end PCB demand

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward...

Monday 15 June 2026

Visionox pushes ViP OLED commercialization as China's flexible OLED utilization slumps

Chinese OLED panel maker Visionox is accelerating the commercialization of its proprietary Visionox intelligent Pixelization (ViP) technology...

Monday 15 June 2026

Google's TPU diversification challenges MediaTek and other ASIC partners

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports...

Monday 15 June 2026

Samsung's Exynos 2600 doubles on-device AI performance in MLPerf benchmarks

Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results...

Monday 15 June 2026

ACCM Solves AI Chip Warpage and Signal Loss with Celeritas

Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package...

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