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Tuesday 27 October 2026
India sets October 2028 target for homegrown smartphone brand
India's electronics and IT minister, Ashwini Vaishnaw, has set October 23, 2028, as the date by which the country will have mobile phones that are designed, manufactured, and branded...
Tuesday 27 October 2026
Cadence raises 2026 outlook as AI design demand drives record backlog
Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying...
Monday 26 October 2026
Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware
In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...
Sunday 25 October 2026
Nvidia unveils OOI CPO prototype for post-2028 AI needs
Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from...
Saturday 24 October 2026
Mitsubishi Electric, ABB form joint venture for power distribution business
Mitsubishi Electric has announced plans to carve out its distribution panel components business for factories and commercial buildings into a joint venture (JV) with Swiss power and...
Friday 23 October 2026
Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry
Japan's Leading-edge Semiconductor Technology Center (LSTC), Hokkaido University, Fujifilm Corporation, GE HealthCare Japan, and imec announced a joint initiative in Tokyo on October...
Friday 23 October 2026
Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions
Israeli security firm Lava identified 32 Nvidia Blackwell Ultra B300 GPUs through monitoring endpoints linked to China Telecom, a state-owned carrier. The chips are barred from sale...
Friday 23 October 2026
Apple reportedly taps BOE for LCD iMac development, keeps OLED timetable in question
Apple has reportedly asked BOE Technology and other panel makers for technical information on LCD panels for a future iMac, raising questions about the pace of its OLED transition...
Friday 23 October 2026
Chinese phone brands beat Samsung, Apple to high-refresh OLED
Chinese smartphone brands have brought high-refresh-rate OLED displays to market ahead of Samsung Electronics and Apple, with Visionox and BOE supplying 185Hz panels for the iQOO Neo...
Friday 23 October 2026
FCC grants Intel a waiver to foreign robot ban to prevent chip disruptions
The US Federal Communications Commission (FCC) granted Intel a waiver to its ban on foreign-made mobile robots, which will allow it to update its fleet of autonomous guided vehicles...
Friday 23 October 2026
Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks
Huawei Technologies has secured a seven-year, CNY15 billion (approx. US$2.3 billion) offshore yuan loan from six Chinese banks, as rising research spending and memory costs weigh on...
Friday 23 October 2026
Analysis: Nvidia's DSX POD reshapes AI factory supply chains
As AI data centers accelerate construction, supply-chain competition is expanding beyond servers and fully integrated racks to the integrated delivery of computing modules and site...
Friday 23 October 2026
AI cuts chip R&D cycles to 9 months, says Etron chair
AI-driven growth will push the semiconductor industry past the US$1.6 trillion mark in 2026, while accelerating chip development cycles to one new product every nine months, Etron...
Friday 23 October 2026
LG Display returns to profit as OLED mix offsets chipflation drag
LG Display (LGD) returned to an operating profit in the third quarter of 2026, showing how far its OLED shift now drives earnings, and how little room it leaves when currency and component...
Friday 23 October 2026
Interview: TI sees liquid cooling shift to tray-level control in AI data centers
Liquid cooling in AI data centers is moving toward more granular control architectures. Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), told...