Global supply chain: Key components

Key components news coverage

IN THE NEWS

Wednesday 2 September 2026

Taiwan's semiconductor ecosystem has the UK taking notes

The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry...

Wednesday 2 September 2026

Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand

Exhibiting in the AI Technology Zone at Semicon Taiwan 2026, Zhen Ding Technology (ZDT) Group highlights two core product lines: 800G, 1.6T, XPO, and NPO high-end optical transceiver...

Wednesday 2 September 2026

Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation...

Wednesday 2 September 2026

MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments

Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...

Wednesday 2 September 2026

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...

Wednesday 2 September 2026

Apple's M6 and M5 Ultra break rule tying process to chip strength

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...

Wednesday 2 September 2026

Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%

Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...

Wednesday 2 September 2026

Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

Wednesday 2 September 2026

Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference

China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...

Wednesday 2 September 2026

Global quantum industry accelerates as Taiwan eyes Asia hub

As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international...

Wednesday 2 September 2026

Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese

Saeed Amidi has been in Taiwan for about 20 hours, and he has been asking everyone the same question.

Tuesday 1 September 2026

Imec CEO: AI era pushes broader ties between chip, model and CSP players

Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond...

Tuesday 1 September 2026

ASE CEO describes AI resource squeeze as a short-term problem

AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...

Tuesday 1 September 2026

Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers

Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...

Tuesday 1 September 2026

Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan

As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...

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