Global supply chain: Key components

Key components news coverage

IN THE NEWS

Friday 14 August 2026

Alibaba Cloud launches Zhenwu M890 supernode for commercial use

Alibaba Cloud has begun commercial service for its Zhenwu M890 supernode in Ulanqab, Inner Mongolia, giving global customers an early look at how AI infrastructure is shifting toward...

Friday 14 August 2026

China PCB makers pour billions into AI server, HPC, optical markets

Chinese printed circuit board (PCB) makers are stepping up investment in higher-value markets including AI servers, high-performance computing (HPC) and optical communications. Following...

Friday 14 August 2026

Samsung chip design embraces AI, but loss of control and hallucinations remain a problem

The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...

Friday 14 August 2026

SK Hynix advances Yongin fab construction for 2027 cleanroom launch

SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...

Friday 14 August 2026

Rapidus targets 8-reticle interposers by 2030

Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...

Friday 14 August 2026

PixArt revenue rises on game-console demand as margin pressure grows

PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability...

Friday 14 August 2026

Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure

AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.

Thursday 13 August 2026

China AI chip market nears 90% domestic share in 2026—Huawei on course to eclipse Nvidia

China's high-end AI chip market could become almost entirely domestic in 2026, with local solutions expected to take nearly 90% of...

Thursday 13 August 2026

Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026

Pegatron stocks AI server parts early as shortages spread through supply chain

Pegatron Corp. said in its second-quarter 2026 results that its server business posted strong gains and that it had already begun preparing for demand in the second half of 2026 while...

Thursday 13 August 2026

Zhen Ding targets 50% revenue share from AI servers, optical modules, IC substrates by 2030

Zhen Ding Tech (ZDT), a major PCB supplier, said at its second-quarter 2026 earnings conference on August 11 that rising investment...

Thursday 13 August 2026

OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward

Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.

Thursday 13 August 2026

Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment

Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a...

Thursday 13 August 2026

Siemens EDA unveils AI-Native Design strategy in South Korea

Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The...

Thursday 13 August 2026

Synopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack

Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical...

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