Global supply chain: Key components

Key components news coverage

IN THE NEWS

Friday 17 April 2026

Interview: Semidynamics expands from SoC to rack-level solutions, targeting memory-intensive AI inference

Spain-based AI chip startup Semidynamics has recently seen a wave of positive developments. Its first chip, fabricated on TSMC's 3nm process, has successfully completed tape-out, and...

Friday 17 April 2026

Visionox starts 8.6G AMOLED tool install, pushes FMM-free OLED

China-based display maker Visionox is stepping up its push into next-generation AMOLED manufacturing, announcing on April 15 a key milestone at its 8.6-generation production line in...

Friday 17 April 2026

SK Hynix invests in RISC-V chip designer Semidynamics

SK Hynix has invested in Semidynamics, a Spanish fabless chip designer, as part of a push to expand its presence in the artificial intelligence...

Friday 17 April 2026

EU Chips Act 2.0 expected by late May, with stronger domestic focus

Since early 2025, the European Union (EU) has been actively shaping its next-generation semiconductor strategy. Recent reports indicate that the EU Chips Act 2.0 is set to be officially...

Thursday 16 April 2026

MCU demand pull-in lifts first-quarter sales, inflation risk clouds outlook

The traditional off-season for consumer electronics showed unexpected strength in the first quarter of 2026, with microcontroller (MCU)...

Thursday 16 April 2026

Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

Major OSAT providers accelerate 2.5D/3D advanced packaging deployments in US, Japan, South Korea, and Malaysia with non-Taiwan capacity footprint to expand.

Thursday 16 April 2026

China's homegrown GPU startups gain ground in global AI chip race

China's domestic GPU industry is entering a new phase of rapid commercialization, as leading startups post strong revenue growth while...

Thursday 16 April 2026

Tesla AI5 tape-out signals dual sourcing with Samsung, TSMC

Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon...

Thursday 16 April 2026

Cadence, Nvidia deepen AI partnership to reshape chip design and robotics

Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure,...

Thursday 16 April 2026

Samsung System LSI talent exits raise risks for Exynos and image sensors

A wave of departures among core engineers at Samsung Electronics' System LSI division is raising concerns over a potential leadership gap at its non-memory chip unit, particularly...

Thursday 16 April 2026

TSMC says Applied Materials and JSR form top-tier chipmaking team

Japanese materials giant JSR has established an advanced planarization process solution joint research center in Taiwan, with JSR representative director and CEO Hank Hori personally...

Thursday 16 April 2026

Analysis: Nvidia links RISC-V to NVLink with SiFive investment

Agentic AI is pulling CPUs back to the center of the AI stack, turning them into a renewed battleground for chipmakers. After Arm moved...

Thursday 16 April 2026

Falling margins and memory crisis causing spec downgrades on TV panels

Since the fourth quarter of 2025, memory prices have risen rapidly, driving up overall storage costs and placing significant pressure on TV manufacturers. Sharp changes in cost structures...

Thursday 16 April 2026

Rockchip reports record results, scales AIoT chips across industries

China-based chip designer Fuzhou Rockchip Electronics posted record full-year 2025 results, with AIoT processors driving growth across automotive, robotics, and industrial markets.

Thursday 16 April 2026

SkyeChip IPO signals Malaysia's push into high-value chip design

Malaysia-based semiconductor design firm SkyeChip has appointed Maybank Investment Bank and CIMB Investment Bank as underwriters for its planned Main Market listing, according to a...

1/1982 pages