While the release of an open-source model by Chinese AI startup DeepSeek has been met with widespread acclaim in China, mainstream US media have responded with cautious scrutiny, raising concerns about potential privacy and national security risks. However, US President Donald Trump unexpectedly has taken a notably different stance on DeepSeek
Taiwan Semiconductor Manufacturing Company (TSMC) strengthens its dominance in advanced semiconductor manufacturing as Apple begins mass production of the M5 chip for MacBook and iPad models. The new chip leverages AI-driven manufacturing enhancements for improved performance
DeepSeek, a Chinese artificial intelligence startup, has disrupted the global AI landscape by launching two open-source models that demonstrate significant innovation and cost efficiency, potentially altering market dynamics amid ongoing geopolitical tensions
Chinese smartphone brands and system-on-chip (SoC) designers are showing increased optimism about demand for premium devices, driven by the country's new consumer electronics subsidy program. This development particularly benefits Qualcomm and MediaTek, which are strengthening their flagship smartphone SoC offerings while their competitor Apple faces growing market challenges in China
Apple is shifting its strategy by scaling back its plans to expand MacBook production in Vietnam, which was expected to ramp up in late 2024. This marks a departure from its earlier aggressive expansion approach and contrasts with its growing manufacturing focus in India, which is becoming more central to Apple's production plans
Thailand is strategically managing the escalating tariff tensions between the US and China. While not directly targeted by US tariff policies, Thai officials are taking preemptive action through overseas visits to secure trade agreements with both nations
BYD Electronics is positioned to become the primary beneficiary of BYD's upcoming intelligent driving expansion, according to a CLSA research report. At its 30th-anniversary event on February 10, 2025, BYD will unveil its comprehensive autonomous driving strategy, supported by a CNY100 billion investment in technology development
As US President Donald Trump threatens to impose tariffs on trading partners, India has lowered its basic customs duties in its latest annual budget and is reportedly reducing the agriculture infrastructure and development cess
Amid concerns over higher tariffs under the Trump administration, TSMC is raising chip prices to offset potential losses, while Samsung Electronics focuses on price competitiveness to gain market share, compensating for its smaller customer base
Baidu has launched its third-generation Kunlun AI chip cluster, marking China's first domestically developed large-scale AI computing deployment. The company's 10,000-GPU Wanka cluster began operations in early 2025, though nearly a year behind schedule. Baidu AI Cloud plans to further expand its computing infrastructure with an upcoming 30,000-GPU cluster deployment
Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design firms amid intensifying US-China trade tensions. Effective January 31, 2025, products using 16/14nm and below technologies must be packaged by a US Bureau of Industry and Security (BIS)-certified third-party OSAT (Outsourced Semiconductor Assembly and Test) provider. Furthermore, TSMC requires an official certification copy from the approved packaging firm before proceeding with shipments, with deliveries halted if documentation is not provided
Materials Analysis Technology (MA-tek) has officially launched a new laboratory in Hokkaido, establishing its third facility in Japan after Nagoya and Kumamoto
Samsung Electronics Chairman Jae-Yong Lee's recent acquittal in a merger and accounting fraud trial marks the end of the company's decade-long "judicial crisis," according to South Korean media. Industry observers expect Lee to revive his "speedy management" style to tackle crucial challenges in decision-making and semiconductor competitiveness
China's cloud service providers (CSPs) have been engaged in fierce price competition since 2024, deploying aggressive cost-cutting strategies to expand market share. This battle is set to intensify in 2025 as major CSPs integrate the low-cost DeepSeek AI model, which blends artificial intelligence (AI) with open-source frameworks on cloud computing platforms. The ongoing price war is expected to drive service fees even lower
Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical enabler for next-generation AI chips and high-performance computing. Industry analysts suggest this strategic move aims to strengthen Samsung Foundry's competitiveness by offering integrated solutions combining cutting-edge packaging, high-bandwidth memory (HBM), and novel substrate technologies
