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Monday 12 January 2026
HP seeks Chinese memory suppliers as DRAM shortage bites
HP is reportedly evaluating Chinese memory suppliers as a global shortage of DRAM tightens supply for consumer devices, according to analyst commentary citing discussions with Bank...
Monday 12 January 2026
Flytech posts 9.3% revenue growth in 2025, eyes resilient operations in 2026
Despite facing dual challenges from currency fluctuations and rising supply chain costs throughout the year, industrial PC maker Flytech Technology demonstrated strong market adaptability...
Monday 12 January 2026
Tariffs and AI reshape Taiwan SMEs' foreign trade strategies
Given shifting tariff policies and ongoing supply chain restructuring, Taiwan's small and medium-sized enterprises (SMEs) are undergoing a structural transformation in their foreign...
Monday 12 January 2026
South Korea accelerates SiC and GaN power chip production with new policy push
South Korea is stepping up policy support for next-generation power semiconductors as part of a broader push to strengthen domestic chip manufacturing and reduce reliance on overseas...
Monday 12 January 2026
Weekly news roundup: AI memory effects in DRAM, HBM4, and TSMC's global expansion
Below are the most-read DIGITIMES Asia stories of the first full week of 2026: January 5-11.
Monday 12 January 2026
Taiwan semiconductor manufacturing split in 2025: memory rebounds, AI anchors foundry growth
Taiwan's semiconductor manufacturing side turned in a distinctly split performance in December 2025. The month can be summed up as: AI keeping advanced logic and advanced packaging...
Monday 12 January 2026
Beijing pulls out rare earth card against Japan; Murata says production unaffected so far
On January 6, 2026, China's Ministry of Commerce (MOFCOM) announced that, to safeguard national security and interests, it would strengthen export controls on dual-use items to Japan...
Monday 12 January 2026
Samsung eyes BOE OLED panels for Galaxy S series
Samsung Electronics is reportedly evaluating whether to source OLED display panels from China's BOE Technology Group for its flagship Galaxy S smartphone lineup, as it looks to rein...
Monday 12 January 2026
Samsung reportedly lands US$550 million state loan for chipmaking equipment
Samsung Electronics has reportedly secured KRW800 billion (US$550 million) through a low-interest loan program from the Korea Development Bank, according to sources cited by Korean...
Monday 12 January 2026
Taiwan, Europe expand tech cooperation with MediaTek and Innolux leading projects
Taiwan and Europe will continue to strengthen collaboration in advanced fields such as drones, robotics, and low Earth orbit (LEO) satellites in 2026, according to Chao-chung Kuo,...
Monday 12 January 2026
TEL expands AI memory capex, targets etching equipment market share
Japanese semiconductor equipment maker TEL is ramping up investments to capitalize on a supercycle in memory demand driven by artificial intelligence (AI) servers. With DRAM and other...
Monday 12 January 2026
Column: Decoding Jensen Huang's CES 2026 keynote and the AI infrastructure reset
At the opening of his keynote, Nvidia CEO Jensen Huang delivered a stark message: the world's US$10 trillion computing infrastructure is entering a fundamental modernization phase,...
Monday 12 January 2026
Taiwan pushes semiconductor supply autonomy by tackling materials and equipment gaps
Geopolitical shifts are reshaping the global semiconductor landscape, prompting countries to build autonomous supply chains. While Taiwan leads globally in manufacturing, it remains...
Sunday 11 January 2026
Seeking independence from Starlink, Japan backs homegrown satellites

Japan has formally committed to building its own low-Earth-orbit (LEO) satellite constellation, marking a significant shift in how the...

Sunday 11 January 2026
Taiwan's Yield Microelectronics rakes in IP royalties, stands as semiconductor outlier
Yield Microelectronics Corp., a Taiwanese designer of embedded nonvolatile memory (eNVM) silicon intellectual property, has quietly established itself as a leader in multi-time programmable...