Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now,...

Toyota plans to transition its entire lineup of approximately 50 vehicle models to software-defined vehicles (SDVs) by 2030, equipping them with advanced software capabilities that...

German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...

Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese...

Taiwan has launched its first proof-of-concept project for shifting renewable electricity through energy storage, a move that could give companies worldwide a model for managing mismatches...

Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates...

SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...

Taiwan's Ministry of Economic Affairs plans to add 25 gas-fired power units with a combined capacity of 26GW to meet rising electricity demand from the semiconductor industry and AI...

South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...

AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor...

South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...

US defense companies are increasingly setting up partnerships in Taiwan, moving beyond component procurement to joint development, system integration, local manufacturing, maintenance...

The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing...

Academia Sinica academician Chenming Hu has published an autobiography titled Find the Solutions, taken from the words on a crystal plaque presented to him by then TSMC chairman...

This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...