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Thursday 2 April 2026
Copper price surge drives quarterly lead frame price hikes
Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply,...
Thursday 2 April 2026
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET...
Thursday 2 April 2026
Precious metal surge drives price hikes for frequency components at TXC and Tai-Saw
Rising global economic uncertainty has fueled safe-haven demand alongside strong industrial consumption, pushing precious metal prices higher. In response, Taiwan's leading quartz...
Thursday 2 April 2026
Taiwan car market shows structural shifts, with Tesla deliveries surging
Taiwan's auto market showed strong momentum in March 2026, with total vehicle registrations reaching 39,318 units — a sharp 78.4% jump from February — signaling a broad...
Thursday 2 April 2026
South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn
South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East...
Thursday 2 April 2026
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo,...
Thursday 2 April 2026
France backs Taiwan's ProLogium with EUR1.5B subsidy to build solid-state battery factory
The French government will provide about EUR1.5 billion (US$1.7 billion) in subsidies to support Taiwanese startup ProLogium Technology's new factory construction in France. According...
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026
TSMC's US expansion held ransom as JASM takes flight
TSMC is winning quietly in Japan and losing loudly in Washington — and the reason may have nothing to do with chips.
Thursday 2 April 2026
South Korea's market volatility hands Taiwan a rare edge in AI
During a lecture hosted by the Chinese National Association of Industry and Commerce (CNAIC), DIGITIMES Chairman Colley Hwang analyzed the East Asian industrial landscape...
Thursday 2 April 2026
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies...
Thursday 2 April 2026
Denso targets US$54 billion revenue, Rohm deal faces Toshiba-Mitsubishi alliance hurdle
Japan's auto parts supplier Denso on March 31 unveiled a mid-term business plan through March 2031, targeting revenue of JPY8 trillion (approx. US$54 billion) and a return on equity...
Thursday 2 April 2026
Interview: How Europe's two-year AI lag is becoming a security liability
While North America and Asia race to deploy "physics-bending" AI hardware, Europe has opted for a "wait-and-see" approach, shielded by thick layers of regulation. In a DIGITIMES...
Thursday 2 April 2026
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...