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Friday 24 July 2026
AMD says AI shift to inference and agents will reshape data centers
AMD said the artificial intelligence boom is entering a new phase that will force a major redesign of data centers, as demand shifts from model training toward inference, AI agents,...
Friday 24 July 2026
Taiwan, Czech chamber ink MOU to fuel Eastern Europe drone hub

Taiwan's Commerce Development Research Institute (CDRI) signed a memorandum of understanding (MOU) with the Taiwan Chamber of Commerce...

Friday 24 July 2026
US moves to curb Chinese humanoid robots, opening a new front in the AI rivalry

Washington is opening a new front in its technology contest with China, moving beyond chips and artificial intelligence models to target...

Friday 24 July 2026
TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
Friday 24 July 2026
AI-driven DRAM surge hits EV costs, forcing Chinese automakers to rethink pricing

Surging AI server demand is reshaping supply and demand across the global memory market. With DRAM prices rising sharply over the past year,...

Friday 24 July 2026
China's Xi'an Eswin tops 1 million monthly 12-inch wafer sales and output, targets 1.8 million capacity

China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon...

Friday 24 July 2026
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
Friday 24 July 2026
AMD sees AI demand broadening beyond chips, as Helios ramps toward shipment
AMD CEO Lisa Su said demand from cloud service providers and enterprise customers continued to climb rapidly, reinforcing AMD's view that the artificial intelligence (AI) market still...
Friday 24 July 2026
AMD unveils Helios rack-scale AI platform to target hyperscale buildouts
AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...
Friday 24 July 2026
Nvidia 800V HVDC enters production in 1Q27, Delta set for 2Q ramp
SemiAnalysis recently forecast that large-scale deployment of Nvidia's native single-ended 800V high-voltage direct current power architecture could slip from the market's previous...
Friday 24 July 2026
Kimi K3 under fire, part 3: China's AI industry questions success story
Chinese officials have embraced Kimi K3 as evidence of indigenous innovation and a maturing open-model ecosystem. Some Chinese developers and technology commentators are far less c...
Friday 24 July 2026
Realme exits China smartphone market, Oppo hands domestic focus to OnePlus

Realme has stopped producing smartphones for China and will launch no new models there, ending its domestic expansion as parent company...

Friday 24 July 2026
China's AI chip share tops 50%, but Nvidia still rules frontier training

China's AI infrastructure build-out is rapidly lifting demand for domestic accelerators, giving Huawei, Alibaba's T-Head Semiconductor,...

Friday 24 July 2026
DeepSeek's Liang Wenfeng says China trails US AI by up to 18 months, with compute the decisive gap
DeepSeek founder Liang Wenfeng says China's AI industry trails the US by six to 18 months mainly because of limited computing power, not talent.
Friday 24 July 2026
German automakers reset strategy with AI, powertrain, and alliances

Volkswagen, BMW, and Mercedes-Benz are reshaping their growth strategies as the global auto market enters a low-growth era, with profitability...