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Friday 21 August 2026
China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving...
Friday 21 August 2026
Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
Friday 21 August 2026
Ubtech expands humanoid push as Nvidia executives quietly visit WRC booth

As the first publicly listed humanoid robot company, Ubtech Robotics is often referred to in China as the sector's "first humanoid robot...

Friday 21 August 2026
Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...
Friday 21 August 2026
Huawei, China power giant Huaneng explore AI compute-power coordination
China Huaneng Group said on August 20 that chairman Wen Shugang and president Zhong Guodong recently visited Huawei in Shenzhen, where they met Huawei founder Ren Zhengfei to discuss...
Friday 21 August 2026
SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement...

Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
Friday 21 August 2026
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

Friday 21 August 2026
AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand
At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES, industry experts highlighted that the massive volume of tokens consumed by AI services has become a growing...
Friday 21 August 2026
Iris Optronics upgrades solar-powered ChLCD e-paper series, expands outdoor and indoor displays
Iris Optronics, a manufacturer of cholesteric liquid crystal display (ChLCD) e-paper, announced upgrades to its Infinity solar-powered ChLCD e-paper series, including a mass-producible...
Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
Friday 21 August 2026
Goertek reports higher revenue and profit in 1H26
Chinese electronics manufacturer Goertek reported higher revenue and profit for the first half of 2026, supported by growth in its smart acoustic products and continued investment...
Friday 21 August 2026
Chinese robots pivot to AI models as Unitree, UBTECH shift hardware focus to 'brains'

The battlefield for Chinese humanoid robotics is shifting from motors, joints, and mechanical structures toward AI large models. As embodied...