
Bull, the French computing company, and Foxconn announced Tuesday that they will manufacture systems based on Nvidia's Vera Rubin NVL72 platform in Europe — the first concrete output of a partnership the two companies unveiled just two weeks ago.
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.
China has launched a probe into a Beidou high-precision smart monitoring project in Shandong, after reports of severe construction defects at the base sparked public concern over the quality of new infrastructure projects. The project, with a total investment of nearly CNY300 million (US$44.4 million), has drawn scrutiny after its base structures were described as "easy to tear apart by hand."
China Electric, which sells lighting products under the TOA brand, is aiming for a 2026 turnaround by reversing second-quarter losses, activating assets, and leasing existing factories, while also expanding into retail channels and contract manufacturing in the second half of the year.
AI and smart applications are pushing handheld devices beyond barcode scanning and data entry, transforming them into intelligent terminals that combine edge computing, cloud management and vertical applications.
Snap unveiled its new Specs augmented reality (AR) glasses at the Augmented World Expo on June 16. Its offering comes at a time when electronics and AI companies are delving into the competitive smart wearables market, with some at very affordable price points.

Synopsys celebrated the 35th anniversary of its Taiwan operations and the opening of its new Hsinchu office on June 15. During the event, Synopsys CEO Sassine Ghazi sat down with DIGITIMES to discuss how agentic AI is transforming electronic design automation (EDA), semiconductor development, and the future of engineering work.


