Dixon's joint venture with Taiwan-based Inventec is expected to operate after April 2026, as the Indian EMS major reports surging sales thanks to handset manufacturing business.
Huawei Cloud CEO Zhang Ping'an and several top executives were recently demoted and had their salaries reduced, officially due to "performance falsification." The punishment, however, reflects a broader shift in the AI era: the inseparable link between large models, AI applications, and AI infrastructure. ByteDance's Volcengine has emerged as a key disruptor representing this integrated vision in China's cloud ecosystem.
Electronic component distributor WFE Technology is set to list on the Taipei Exchange (TPEx) in mid-to-late November 2025, positioning itself to benefit from rising cybersecurity and environmental monitoring standards for data centers and AI servers.
In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy that combines time compression and accumulation. The "compression" of time refers to AI and digital transformation, while the "accumulation" of time refers to differentiated technology and patents.
After a three-year hiatus, LINE Taiwan held LINE CONVERGE 2025 on October 22 to outline upcoming operational priorities and outlook. With all industries slowly adopting AI, AI agents are anticipated to be the next major focus following generative AI. LINE, with 22 million users in Taiwan, has the potential to leverage its ecosystem to secure a spot in the AI agent market.
Taiwan currently shines on the global stage with three standout industries: its healthcare system, electronics manufacturing services (EMS), and semiconductors. Though each sector's competitive edge stems from unique factors, they all share one crucial—and arguably most important—common denominator: the sustained, multi-generational commitment of the nation's social elites. This commitment is measured not in years, but in cycles of sixty years, known as a jiazi in the traditional Chinese calendar.
The Ethernet for Scale-Up Networking (ESUN) Alliance officially launched at the 2025 Open Compute Project (OCP) Global Summit, uniting North America's AI heavyweights, including OpenAI, Meta, AMD, Nvidia, Microsoft, and Broadcom. Its goal is to create an open Ethernet interconnect standard to address AI chip connectivity fragmentation and redefine global AI infrastructure. The collaboration marks a rare alignment across major rivals in pursuit of interoperability.
The global AI wave is driving a "golden decade" for the printed circuit board (PCB) industry, sparking revolutionary innovations in design, manufacturing, and materials that accelerate its integration with advanced semiconductor sectors. This trend has not only exposed upstream capacity pressures but also intensified geopolitical risks, profoundly reshaping global PCB investment strategies.
Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers.
As global demand for AI computing power skyrockets, the data center landscape is undergoing a significant transformation — shifting away from standalone server performance and toward system-level, rack-based upgrades. At the OCP Global Summit 2025, the industry spotlight moved beyond individual servers to full racks designed with 800V direct current (DC) power, liquid cooling, and high-bandwidth network integration.
Taiwan's offshore wind maritime engineering firm Dong Fang Offshore (DFO) is set to transition from the over-the-counter (OTC) market to the Taiwan Stock Exchange mainboard in mid-November 2025. The company is rapidly expanding its fleet to capture strong growth opportunities in AI-fueled undersea communication cable demand.
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