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Mobile components
  • Global 5G smartphone shipments to approach 300 million units next year
    No one could do better than TSMC when it comes to predicting the possible size of next year's 5G smartphone market, as the top foundry house can rely on order visibility from chip clients to support its estimation. Now some industry sources have cited TSMC's internal estimates as expecting global
  • PCL Technologies has reported revenues of NT$233 million for September
    Optical transceiver module maker PCL Technologies has reported revenues of NT$233 million (US$7.6 million) for September, up 25.9% on month and 59.6% on year, driven by increased shipments of 32G transceiver products.
  • Supply of high-end camera lens for smartphones has been tight
    Supply of high-end camera lens for smartphones has been tight thanks to handset vendors rushing to incorporate multi-lens solutions into their new models, indicating bright shipment prospect for major lens makers such as Largan Precision in the fourth quarter of 2019 and beyond, according to industry...
  • PCB suppliers are expected to see their HDI board production lines running at full capacity
    Taiwan-based PCB suppliers are expected to see their HDI board production lines running at full capacity through the end of 2019, bolstered by upgrades in smartphone mainboards, according to industry sources.
  • 5g
    Global shipments of 5G phones could approach 300 million units in 2020, much higher than most market observers expect, according to industry sources, citing an internal estimate at TSMC.
  • TSMC is gaining growth momentum from better-than-expected sales of Apple's iPhone 11 series
    Strong demand from the 5G sector is apparently not the only factor driving TSMC's sales growth. The foundry house is gaining growth momentum from better-than-expected sales of Apple's iPhone 11 series for fourth-quarter 2019, and first-quarter...
  • MediaTek is expected to start shipping its first-generation 5G SoC chips later in 4Q19
    MediaTek is expected to start shipping its first-generation 5G SoC chips later in the fourth quarter of 2019, for which the chipmaker is likely to post a slight drop or flat growth sequentially in revenues, according to media reports.
  • Oppo and Vivo both are reportedly accelerating the developments of 5G smartphones
    China-based handset vendors Oppo and Vivo both are reportedly accelerating the developments of 5G smartphones and are expected to roll out their respective 5G phones at the end of 2019 or in early 2020, which will be about 2-3 months ahead of schedule, according to sources from Taiwan's IC supply ch...
  • Demand for better cooling solutions rise from the smartphone market
    Japan's Furukawa Electric and Taiwan-based Lemtech have teamed up to develop stainless steel-based ultra-thin vapor chamber cooling solutions for smartphones.
  • Compeq Manufacturing has reported record high sales for September
    Compeq Manufacturing has reported record high sales for September, reportedly propelled by increased shipments of PCB products for Apple's iPhone 11 lineup and Huawei's Mate 30 series.
  • Qualcomm has recently joined Taiwan's 5G Alliance
    Qualcomm has recently joined Taiwan's 5G Alliance and will partner with Taiwan's OEM/ODMs and academies to conduct 5G research, according to Alex Orange, senior director of Government Affairs at Qualcomm Southeast Asia&Pacific and Taiwan.
  • China's handset vendors are expected to embrace more aggressive pricing strategies
    China's handset vendors including Huawei, Oppo, Vivo and Xiaomi are expected to embrace more aggressive pricing strategies to enhance the competitiveness of their entry-level models and expand their market shares globally, according to sources from Taiwan's handset supply chain.
  • Notebook ODMs are scrambling to secure supply from Intel for its 14nm CPUs
    Preparations for the year-end shopping season and extra inventory build-ups at clients to avoid extra US tariffs are heaping strong pressure on notebook ODMs who are not receiving sufficient support from Intel. They thought the Intel processor shortfall had eased, only to find out that 14nm...
  • Largan Precision has reported consolidated revenues of NT$6.596 billion for September
    Smartphone lens module maker Largan Precision has reported consolidated revenues of NT$6.596 billion (US$212 million) for September, hitting a monthly record for the second consecutive time and increasing 1.84% sequentially and 19.54% on year.
  • EMC upbeat about 4Q19

    Oct 7, 15:40
    EMC expects significant revenues for fourth-quarter 2019
    Taiwan's leading CCL maker Elite Material (EMC) expects significant revenues for fourth-quarter 2019, bolstered by encouraging sales of iPhone 11, according to industry soruces.
  • China's de-Americanization campaign has emerged as the largest black swan for 5G chips market
    China's de-Americanization campaign, a move aimed at cutting reliance on the US suppliers of crucial semiconductor components and technologies, has emerged as the largest black swan affecting the development of the 5G chips market in 2020, according to industry observers.
  • The optical communication equipment industry is expected to resume growth momentum in 2020
    The optical communication equipment industry is expected to resume growth momentum in 2020 after three years of lackluster demand, as new 5G infrastructure construction projects kicking off in late 2019 are expected to spur upgrades in optical fiber networks, according to Taiwan-based Ezconn, a supplier...
  • TSMC with its competitive 7nm process technology has obtained orders for made-for-AI chip processors
    It is not just application processors vendors that have been scrambling to secure production capacity for making their 5G offerings at TSMC's 7nm node, which is also catering to AI processors developers, such as Nvidia, Xilinx and Bitmain...
  • HannStar Board chairman elected as a director of Career
    Flexible PCB (FPCB) maker Career Technology has elected a new member to its board of directors - HannStar Board's chairman Anthony Chiao, a move signaling a strategic partnership between the two firms.
  • Global demand for 5G chips supporting the sub-6 GHz standards is likely to gain momentum
    Global demand for 5G chips supporting the sub-6 GHz standards is likely to gain momentum as telecom operators in China, which has the potential to become the world's largest market for 5G phones, have given the priority to the development of related sub-6 GHz technology instead of mmWave one, according...
  • MediaTek is set to roll out more 5G SoCs next year
    Device pricing is expected to be a major factor determining the pace of growth in China's 5G smartphone market next year, and Chinese vendors are keen to make sure that their phones are affordable. Naturally they are demanding their componets...
  • HannsTouch has reported revenues of NT$362 million for September
    AMOLED touch sensor provider HannsTouch Solution has reported revenues of NT$362 million (US$11.66 million) for September, down 17.32% but up 160.26% on year.
  • Handset component suppliers are facing increasing pressure from China's handset vendors
    Handset component suppliers, particularly those for camera modules, displays and acoustic devices, are facing increasing pressure from China's handset vendors to lower their quotes for components for 5G-enabled phones as Chinese vendors are aiming at reducing 5G phone prices significantly in 2020,...
  • MediaTek is scheduled to roll out the company's first 5G SoC for sub-6GHz networks in early 2020
    MediaTek is scheduled to roll out the company's first 5G SoC for sub-6GHz networks in early 2020, with plans to launch its second 5G mobile chip that will also support sub-6GHz in the first half of next year, according to industry sources.
  • The semiconductor supply chain is eyeing the robust demand from 5G commercialization
    The semiconductor supply chain is eyeing the robust demand from 5G commercialization. IC designers are designing chips supporting 5G, and in turn their backend partners are also gearing up development of AiP packaging process to suppor...

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