ASML's latest financial results revealed that some chipmakers have slowed their investments. Analysts speculate that Intel and Samsung may be the ones cutting back, potentially easing...

TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...

TSMC will hold an investor meeting on October 17 to review the company's business and market projections, as well as updates on its capital expenditure strategy for the current yea...

Similar to Abenomics' three arrows over a decade ago, Japan is now introducing three initiatives aimed at reversing the decline in its semiconductor industry. Professor Kuroda Tadayoshi...

TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...

MediaTek has officially launched its Dimensity 9400 flagship smartphone platform, leveraging TSMC's second-generation 3nm process technology. This new platform boasts substantial...

TSMC's September 2024 revenue reached NT$251.873 billion (around US$7.75 billion), fueled by high demand for next-generation smartphone, AI, and PC chips from key clients such as...

TSMC's Fab 21 in Arizona has not yet fully commenced its first phase of mass production, but it is already producing Apple's A16 chip. Additionally, AMD may become the second major...

Taiwan Semiconductor Manufacturing Company (TSMC) announced on October 8 to subscribe to a NT$3.74 billion cash capital increase (approximately US$116 million) for Vanguard International...

Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...

SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...

TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver...

After five years of development, Intel's Core Ultra 200V processor family, codenamed Lunar Lake, has been confirmed for manufacturing on TSMC's 3nm process, ushering in a shift in...