The Biden administration plans to impose export controls on critical technologies including quantum computing and semiconductor goods, seeking to align key allies in a US-led push to thwart advancements in China and other adversarial nations.
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
According to the Semiconductor Industry Association (SIA), global semiconductor industry sales increased 18.7% year-on-year in July 2024, with sales in the Americas jumping by 40.1%.
At Semicon Taiwan 2024, a group of Dutch companies showcased technologies quietly revolutionizing semiconductor manufacturing and related industries. These firms, many clustered around the high-tech hub of Eindhoven, are playing crucial roles in advancing chip production, power electronics, and specialized materials processing.
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the possibility of establishing a semiconductor packaging and testing plant in Europe.
PCIM Asia 2024 recently kicked off in Shenzhen, China, gathering a diverse array of international and Chinese firms focused on power semiconductors. The event prominently featured advancements in silicon carbide (SiC) technologies.
As SEMICON India 2024 approaches, SEMI CEO Ajit Manocha has called on India to invest in building more semiconductor fabs. With global investors increasingly interested in India, Manocha emphasizes the need to enhance the country's semiconductor supply chain resilience to meet rising demand.
Taiwan's semiconductor industry chain has become a global focal point, and the scale of SEMICON Taiwan 2024 continues to expand. To highlight Taiwan's close collaboration with 56 countries, the exhibition features 12 national pavilions, including the US, Germany, Japan, the Netherlands, the Czech Republic, the UK, France, the Philippines, and more.
Taiwan's semiconductor industry, a linchpin of the global tech supply chain, is grappling with an existential challenge: how to maintain growth while dramatically reducing its environmental footprint. At Semicon Taiwan 2024, industry leaders laid out ambitious plans to tackle climate change, presenting a vision of a greener future for chip manufacturing.
Recent reports suggest that Chinese GPU startup Xiangdixian Computing Technology has collapsed due to funding issues and dismissed its entire workforce. However, the company later issued a statement clarifying that it is undergoing organizational restructuring and has not commenced dissolution or liquidation.
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared for commercial manufacture by 2025 to 2026.
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian Technologies, are making significant strides into high-end packaging technologies while capitalizing on economic opportunities.
Taiwan's Kenmec Mechanical Engineering has evolved from virtual simulations to real-world implementations, offering tailored software and hardware solutions for factory automation, according to company president Jonas Ko. As a member of the Nvidia Omniverse platform, Kenmec is capitalizing on advanced technologies to enhance its offerings.
In the past six months, China's leading GaN compound semiconductor firm Innoscience has faced patent infringement lawsuits in Germany and the US, from power component manufacturers Infineon and EPC respectively. According to supply chain sources, this is primarily due to Innoscience offering price quotes that are only about half of what other global GaN companies charge, prompting them to take proactive measures to prevent a price-slashing avalanche spreading out from China.
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
The power semiconductor industry is experiencing a surge in the development of compound semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC). These advancements come as companies make significant inroads into applications dominated by traditional silicon-based semiconductors, while positioning themselves for future developments in emerging industries, including 5G networking, AIoT, new energy, and new energy vehicles.
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Demand for AI chips should spur growth for the semiconductor industry over the next few years, the CEO of a major supplier to Taiwan Semiconductor Manufacturing Co. said, dismissing concerns that investors had misjudged the pace and extent of spending on artificial intelligence.
Indian Prime Minister Narendra Modi visited Singapore, where he met with his counterpart and signed a series of Memorandums of Understanding (MoUs), including one focused on semiconductor cooperation. This makes Singapore the fourth country, following the US, Japan, and Malaysia, to establish a semiconductor partnership with India.
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in a row.
Intel has been dealing with ongoing losses and is reportedly exploring various cost-cutting measures and monetization strategies for its foundry services. Meanwhile, SMIC, which also emphasizes local chip manufacturing, is poised to reap the rewards of its past investments.
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024 and throughout 2025.
Wahlee Industrial, which distributes photoresist and CMP slurries, and other front-end process manufacturing materials, expects robust demand for CoWoS packaging to drive significant revenue growth in 2025.
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
