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News tagged IC manufacturing
  • Last update: Monday 27 March 2017 [12129 news items]

Robust GPP diode shipments to boost Lite-On Semi revenues

Mar 27, 14:49

Lite-On Semiconductor, a maker of discrete and analog IC components, has landed GPP (glass passivated package) diode orders from China-based smartphone vendors such as Oppo and Vivo,...

Topco posts record profits in 2016

Newswatch - Mar 27, 14:46

Wafer and IC distributor Topco Scientific has reported net profits of NT$1.203 billion (US$39.71 million) on revenues of NT$22.629 billion in 2016. Both figures were the company's...

ChipMOS Shanghai becomes JV between ChipMOS and Tsinghua Unigroup

Mar 27, 14:16

ChipMOS Technologies has announced the completion of its previously-disclosed equity interest transfer to a group of investors led by Tsinghua Unigroup.

TSMC to begin volume production of A11 chips in April, says paper

Newswatch - Mar 27, 14:08

Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of Apple's A11 chips in April and will prepare a capacity for production of 50 million units of the...

Ardentec to complete acquisition of Giga Solution in 3Q17

Mar 24, 16:01

Taiwan-based Ardentec, which holds a 63.84% stake in RFIC testing specialist Giga Solution Tech, is buying Giga Solution's remaining shares with the acquisition scheduled to complete...

Taiwan February manufacturing production index down on month, up on year, says MOEA

Mar 24, 10:38

Taiwan recorded a manufacturing production index (2011 as base year) of 98.15 for February 2017, decreasing 7.21% on month but increasing 13.97% on year, according to statistics released...

SPIL to pay NT$1.75 cash dividend for 2016

Mar 24, 10:35

IC packager Siliconware Precision Industries (SPIL) has decided to distribute a cash dividend of NT$1.75 (US$0.06) for 2016, according to a resolution passed by the company's board...

TSMC to start installing equipment at Nanjing fab in 2H17

Mar 24, 10:31

Equipment move-in will take place at Taiwan Semiconductor Manufacturing Company's (TSMC) Nanjing plant in the second half of 2017, according to Roger Luo, president for TSMC Nanjing...

tsmc

Win Semi to deal out cash dividend of NT$4.50 for 2016

Mar 24, 10:29

Win Semiconductors' board of directors has adopted a proposal recommending the distribution of a NT$4.50 (US$0.15) cash dividend per share for 2016, when the company generated a record...

Samsung, eSilicon tape out 14nm network processor with Rambus 28G SerDes solution

Mar 23, 21:14

Samsung Electronics has announced a successful network processor tape-out based on Samsung's 14LPP (Low-Power Plus) process technology in collaboration with eSilicon and Rambus. This...

ASE says no plan to set up local site in US for packaging services

Mar 23, 21:09

Advanced Semiconductor Engineering (ASE) has a site in the US for IC testing, and has no plans to expand the site or build another locally for packaging services, according to company...

ase

Qualcomm, ASE, Brazil government sign MOU to build IC testing/packaging plant in Brazil, says paper

Newswatch - Mar 23, 16:08

Advanced Semiconductor Engineering (ASE), Qualcomm and the Brazil government reportedly have signed a MOU to jointly invest US$200 million initially to establish an IC testing/packaging...

Taiwan science parks post 2016 total revenues of NT$ 2.376 trillion, says MOST

Mar 23, 15:57

Government-run Hsinchu Science Park (HSP), Southern Taiwan Science Park (STSP) and Central Taiwan Science Park (CTSP) generated combined revenues of NT$2.376 trillion (US$74.97 billion)...

Sputtering equipment supplier UVAT to slash capex

Mar 22, 20:41

Taiwan-based UVAT Technology, which specializes in the manufacture of vacuum sputtering equipment and provides coating OEM services, has disclosed plans to reduce paid-in capital...

Taiwan February unemployment rate up on month, down on year, says DGBAS

Mar 22, 13:37

Taiwan had 453,000 jobless citizens in February 2017, equivalent to an unemployment rate of 3.85% which rose 0.07pp on month but dropped 0.10pp on year, according to statistics released...

UMC Xiamen fab gearing up for 28nm chip production

Stockwatch - Mar 22, 11:13

United Microelectronics' 12-inch foundry subsidiary in Xiamen, China will be ready for 28nm chip production in the second quarter of 2017 vying for orders from China's local handset...

Micron to establish backend site for DRAM in Taiwan

Mar 21, 21:03

Micron Technology has announced that on March 14 it successfully won the auction for Cando assets, which will be utilized in establishing a back-end site for Micron Taiwan. Micron...

China semi equipment industry working hard to play catch-up

Mar 21, 14:09

It is hard for China-based semiconductor equipment suppliers to catch up with their bigger international peers in terms of technology, according to Zhao Jinrong, CEO for Naura Technology...

Taiwan February export order value down on month, up on year, says MOEA

Mar 20, 22:39

Taiwan received export orders worth US$33.75 billion in total in February 2017, decreasing 6.2% on month but increasing 22.0% on year, according to statistics released by the Ministry...

Taiwan attracts foreign direct investment of over US$571 million in January-February, says MOEA

Mar 20, 22:16

Taiwan's Ministry of Economic Affairs (MOEA) approved 453 foreign direct investment projects (except from China) with a total value of US$571.57 million in January-February 2017,...

Gudeng seeing robust 12-inch fab equipment orders from China

Mar 20, 21:44

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...

TSMC enlisted US as potential site for 3nm chip production, says paper

Newswatch - Mar 20, 15:44

Taiwan Semiconductor Manufacturing Company (TSMC) has officially enlisted the US as an optional location to build a new manufacturing fab for production of 3nm chips, according to...

MOSFET chip supply to fall short of demand in 2H17

Mar 20, 15:33

The global supply of MOSFET chips is set to fall short of demand in the second half of 2017 as a result of a growing number of MOSFETs for new CPU platforms coupled with sluggish...

North American semiconductor equipment industry posts US$1.97 billion in Feb billings

Mar 17, 14:06

North America-based manufacturers of semiconductor equipment posted US$1.97 billion in billings worldwide in February 2017 (three-month average basis), according to SEMI.

AMD to launch Ryzen 5-series CPUs in April

Mar 17, 12:40

Having just released its Ryzen 7 processors, AMD is planning to launch Ryzen 5 desktop-use CPUs on April 11, including 6-core 12-threads 1600X and 1600 and quad-core 8-threads 1500X...

AMD to launch Ryzne 5 processors in April

Semicon China: Chipmakers talk about Moore's Law and China's fast-growing IC industry

Mar 17, 11:17

At Semicon China 2017, executives at chip giant Intel, IC packager Advanced Semiconductor Engineering, equipment vendors ASML, Lam Research and Tokyo Electron (TEL), and nano-electronics...

Mentor Graphics announces further certification of design tools for TSMC 12FFC and 7nm processes

Mar 17, 11:01

TSMC has certified its Calibre Platform (Calibre nmDRC, Calibre Multi-Patterning, Calibre nmLVS, Calibre YieldEnhancer with SmartFill, and Calibre xACT tools), as well as the Analog...

Zhaoxin to roll out 16nm CPU in 2018

Mar 17, 10:49

Shanghai Zhaoxin Semiconductor plans to introduce a 16nm 8-core 3GHz PC processor series in 2018, according to company vice president Cheng Fu.

ASML strikes deal with China equipment maker

Mar 16, 14:25

ASML has signed an MoU with Shanghai Micro Electronics Equipment (SMEE), under which ASML and SME will initially explore the potential sourcing of certain modules for ASML lithography...

Samsung on track for 10nm FinFET process production ramp-up

Mar 16, 14:06

Samsung Electronics has announced its production ramp-up of the 10nm FinFET process technology is on track with steady high yield to meet customer needs on schedule.

MediaTek to roll out 12nm product in 2H17

Mar 16, 14:04

MediaTek plans to roll out a new mobile SoC solution built by Taiwan Semiconductor Manufacturing Company (TSMC) using the foundry's 12nm process technology in the second half of 2017,...

SMIC signs license agreement for Invensas DBI technology

Mar 15, 20:01

Semiconductor Manufacturing International (SMIC) has executed a technology transfer and license agreement for Invensas' Direct Bond Interconnect (DBI) technology, according to the...

CPU IP provider Andes sees shares soar on TSE debut

Newswatch - Mar 15, 19:58

Taiwan-based CPU IP provider Andes Technology, of which MediaTek holds a 15% stake, saw its share price soar by 191.09% to close at NT$189.50 (US$6.14) from the initial price of NT$65.10...

HLMC 12-inch fab running at full capacity, says company VP

Mar 15, 15:41

China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...

HLMC VP Jack Shu

UMC-Synopsys collaboration speeds 14nm custom design

Mar 15, 09:56

Synopsys and United Microelectronics (UMC) have worked together to enable Synopsys Custom Compiler and Laker custom design tools to be used with UMC's 14nm FinFET process, according...

12129 items [1/347]
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  • Samsung+14nm+Exynos+chips

    Samsung 14nm Exynos chips

    Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone...

    Photo: Company, Aug 31.

  • Panasonic+GaN+power+transistors

    Panasonic GaN power transistors

    Panasonic has announced that it will launch the industry's smallest enhancement-mode gallium nitride (GaN) power transistors (X-GaN) package. The GaN is encapsulated into 8x8 dual-flat...

    Photo: Company, May 20.

  • Samsung+Exynos+7+Octa

    Samsung Exynos 7 Octa

    Samsung Electronics has begun mass production of mobile application processors built using 14nm FinFET process technology. Samsung's 14nm FinFET process will be adopted by its Exynos...

    Photo: Company, Feb 24.

  • New+EVG+roll%2Dto%2Droll+system

    New EVG roll-to-roll system

    EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has introduced the EVG570R2R, which the company claims...

    Photo: Company, Oct 11.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • Foundry overview - Sep 2006

    Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility in memory pricing...

  • Foundry industry overview - Jan 2005

    Foundry service providers primarily produce chips based on their customers’ or third-party firms’ intellectual property (IP). Some foundry firms also provide other types...

China smartphone touch-panel industry 2016 forecast
Global AP demand forecast, 2017-2020

28-Mar-2017 12:45 (GMT+8)

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