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News tagged IC manufacturing
  • Last update: Monday 26 September 2016 [11700 news items]

China HLMC to build new 12-inch fab

Sep 26, 15:38

Shanghai Huali Microelectronics (HLMC) is expected to announce by the end of 2016 the construction of its second 12-inch plant, which will directly enter 28nm production, according...

Cadence, TSMC advance 7nm FinFET designs for mobile and HPC platforms

Sep 26, 15:00

Cadence Design Systems has announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platf...

Value of semiconductor industry M&A agreements already over US$50 billion, says IC Insights

Sep 23, 15:29

After an historic surge in semiconductor merger and acquisition agreements in 2015, the torrid pace of transactions has eased (until recently), but 2016 is already the second-largest...

Cadence delivers integrated system design solution for TSMC InFO packaging technology

Sep 23, 10:55

Cadence Design Systems has announced the immediate availability of an integrated system design solution for TSMC's advanced wafer-level integrated fan-out (InFO) packaging technology,...

Taiwan sees increased August export order value, says MOEA

Sep 22, 22:16

Taiwan received export orders worth US$37.93 billion in total in August 2016, increasing 8.3% on month and on year, according to statistics released by the Ministry of Economic Affairs...

Taiwan August unemployment rate up, says DGBAS

Sep 22, 14:41

Taiwan had 480,000 jobless citizens in august 2016, equivalent to an unemployment rate of 4.08%, rising 0.06pp on month and 0.18pp on year, according to statistics released by the...

MediaTek likely to roll out 2 10nm chip versions, says report

Newswatch - Sep 22, 10:47

MediaTek is considering rolling out two versions of its 10nm chips, the Helio X30 for high-end smartphones and the X35 for the lower-end segment, according to a Chinese-language Economic...

M31 partnering with TSMC to offer MIPI PHY solutions

Sep 22, 10:38

Silicon IP provider M31 has announced the development of its new MIPI M-PHY Gear3 IP on TSMC's 40LP and 28nm HPC+ process nodes. The 40LP M-PHY has been widely adopted by customers...

Backend firms seeing tight supply

Sep 22, 10:33

IC backend houses have recently seen their supply fall short of demand as their delivery times have extended to more than two weeks, up from 4-7 days, according to industry sources...

China SITRI 8-inch fab ready for MEMS manufacturing

Sep 21, 15:06

The government-sponsored Shanghai Industrial Technology Research Institute (SITRI) has its 8-inch wafer fab targeted specifically at the manufacture of MEMS parts with volume production...

iPhone 7 materials costs higher than previous versions, IHS says

Sep 21, 14:47

The bill of materials (BOM) for an iPhone 7 equipped with 32GB of NAND flash memory carries US$219.80 in bill of materials costs, according to a preliminary estimate from IHS Marki...

Chipbond 3Q16 gross margin to reach 26%, says report

Sep 21, 14:06

Chipbond Technology is expected to see its third-quarter gross margin reach the highest quarterly level since 2015, buoyed by strong shipments for high-margin power amplifiers, according...

Taiwan attracts foreign direct investment of over US$6.6 billion in January-August

Sep 21, 10:55

Taiwan's Ministry of Economic Affairs (MOEA) approved 2,273 foreign direct investment projects (except from China) totaling US$6.627 billion in January-August 2016, respectively decreasing...

Taiwan Photon Source inaugurated

Sep 20, 12:14

Taiwan's National Synchrotron Radiation Research Center (NSRRC) on September 19 held a ceremony for starting operation of Taiwan Photon Source (TPS), a synchrotron radiation facility...

Part of Taiwan Photon Source under National Synchrotron Radiation Research Center

Applied Materials, IME to advance R&D in fan-out wafer-level packaging

Sep 20, 00:46

Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...

ASE a major SiP backend provider for Apple, say sources

Sep 20, 00:44

Advanced Semiconductor Engineering (ASE), through its Shanghai-based subsidiary Universal Scientific Industrial (USI), has obtained SiP (system-in-package) backend orders for Wi-Fi,...

Globalfoundries unveils plan for 7nm FinFET manufacturing

Sep 19, 15:10

Globalfoundries has announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology, which provides more processing power for data centers, networking, premium mobile...

US fab-tool book-to-bill ratio stays above parity, says SEMI

Sep 19, 14:55

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.03 in August 2016, having been above parity for nine months in a row, according to the...

Global 2Q16 semiconductor equipment billings increase 26%, says SEMI

Sep 14, 14:57

Worldwide semiconductor manufacturing equipment billings reached US$10.5 billion in the second quarter of 2016, according to SEMI. The billings figure was 26% higher than the prior...

CWTC listed on Taiwan OTC

Sep 14, 14:55

Chang Wah Technology (CWTC), which manufactures LED leadframe packaging materials, started trading on Taiwan's over-the-counter (OTC) stock market at an initial price of NT$102 (US$3.22)...

Entegris optimistic about equipment demand from Taiwan foundries

Sep 13, 21:23

Taiwan-based IC foundries including TSMC and UMC will continue to build additional capacity and advance their technologies for a larger pie of the foundry space, which will further...

Bertrand Loy, CEO for Entegris

Focusing on silicon technologies will be the future road for Taiwan, says Stan Shih

Sep 13, 14:06

Commenting on Taiwan IT industry's next step, Acer co-founder Stan Shih at a forum hosted by Taiwan's Industrial Technology Research Institute (ITRI) on September 12, said the country...

Stan Shih, Acer co-founder

Qualcomm opens Shanghai facility for semiconductor test manufacturing

Sep 12, 21:51

Qualcomm has announced the opening of Qualcomm Communication Technologies (Shanghai), a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first...

Equipment maker GPM enters technical partnership with SPP

Sep 12, 21:00

Taiwan-based Gallant Precision Machining (GPM), which mainly makes equipment for the manufacture of display panels and semiconductors, has announced the signing of a technical cooperation...

Topco Scientific reports increased revenues for August

Stockwatch - Sep 12, 15:52

Semiconductor material supplier Topco Scientific has reported consolidated revenues of NT$1.846 billion (US$58.12 million) for August, up 5.24% on month and 20.01% on year.

Samsung putting capex focus on OLED could lose major foundry client

Sep 12, 15:52

Qualcomm, a major foundry client of Samsung, has become aware of the risks associated with Samsung putting its capex focus on the OLED panel market, and is considering coming back...

Chipbond reports revenue growth for Agust

Sep 12, 11:03

LCD driver IC packaging specialist Chipbond Technology has reported consolidated revenues of NT$1.55 billion (US$49 million) for August 2016, up 6.1% on year and 3.3% sequentially.

TSMC reports record August revenues

Sep 9, 15:13

Consolidated revenues at Taiwan Semiconductor Manufacturing Company (TSMC) increased 23.5% sequentially and 40.7% from a year ago to NT$94.31 billion (US$3 billion) in August 2016,...

Apple pulls in chip orders for new Apple Watch, say sources

Sep 9, 11:47

Apple has increased chip and component orders for its new Apple Watch Series 2 products with monthly shipment volumes for August and September both surpassing two million units, according...

IC Insights cuts IoT semiconductor market forecast

Sep 9, 10:54

IC Insights has trimmed back its semiconductor forecast for Internet of Things system functions over the next four years by about US$1.9 billion, mostly because of lower sales projections...

MagnaChip begins volume production for Himax PWM ICs

Sep 9, 10:52

MagnaChip Semiconductor has begun volume production for power management chips designed by Himax Technologies using MagnaChip's specialty 0.18-micron BCD process, according to the...

Globalfoundries unveils 12nm FD-SOI process

Sep 9, 10:51

Globalfoundries has unveiled a new 12nm FD-SOI semiconductor technology. Building on the success of its 22FDX offering, the company's next-generation 12FDXplatform is designed for...

Global semiconductor sales rebound in July, says SIA

Sep 9, 10:49

The Semiconductor Industry Association (SIA) has announced worldwide sales of semiconductors reached US$27.1 billion for the month of July 2016, an increase of 2.6% compared to the...

Taiwan sees increased August export value

Sep 8, 15:07

Taiwan recorded total export value of US$24.66 billion for August 2016, increasing 2.2% on month and 1% on year, while the corresponding total import value of US$20.67 billion rose...

Samsung lowering foundry quotes to vie for orders

Sep 8, 14:46

Samsung has cut its foundry quotes to vie for new orders particularly for LCD driver ICs, power management ICs and CMOS image sensors, according to industry sources.

11700 items [1/335]
Realtime news
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    Before Going to Press | 6h 22min ago

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    Before Going to Press | 6h 58min ago

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    Before Going to Press | 6h 59min ago

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    Before Going to Press | 7h 1min ago

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    Before Going to Press | 7h 1min ago

  • Lithium battery makers demand price rise due to shortages

    Before Going to Press | 7h 5min ago

  • Taiwan market: Xiaomi Technology to launch Hong-Mi Note 4

    Before Going to Press | 7h 6min ago

  • Chilisin signs NT$3.5 billion syndicated loan

    Before Going to Press | 7h 7min ago

  • Kenmec secures more than NT$3 billion worth of automation equipment orders, says report

    Before Going to Press | 7h 8min ago

  • Digitimes Research: Global average LTE-based data transfer speed barely rising

    Before Going to Press | 7h 9min ago

  • GE exiting Asia and Latin America angering distributors of local lighting products

    Before Going to Press | 7h 11min ago

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  • Samsung+14nm+Exynos+chips

    Samsung 14nm Exynos chips

    Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone...

    Photo: Company, Aug 31.

  • Panasonic+GaN+power+transistors

    Panasonic GaN power transistors

    Panasonic has announced that it will launch the industry's smallest enhancement-mode gallium nitride (GaN) power transistors (X-GaN) package. The GaN is encapsulated into 8x8 dual-flat...

    Photo: Company, May 20.

  • Samsung+Exynos+7+Octa

    Samsung Exynos 7 Octa

    Samsung Electronics has begun mass production of mobile application processors built using 14nm FinFET process technology. Samsung's 14nm FinFET process will be adopted by its Exynos...

    Photo: Company, Feb 24.

  • New+EVG+roll%2Dto%2Droll+system

    New EVG roll-to-roll system

    EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has introduced the EVG570R2R, which the company claims...

    Photo: Company, Oct 11.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • Foundry overview - Sep 2006

    Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility in memory pricing...

  • Foundry industry overview - Jan 2005

    Foundry service providers primarily produce chips based on their customers’ or third-party firms’ intellectual property (IP). Some foundry firms also provide other types...

Taiwan server shipment forecast and industry analysis, 2016
Display panels for wearable devices

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