ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global DRAM prices and a sharp increase in the value of its chip inventory reversed years of losses. The turnaround followed an extended period of heavy capital spending and came as accelerating demand for artificial intelligence infrastructure tightened global memory supply

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically