Bits + chips
SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including 3D IC & substrate technology and advanced packaging and te...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.