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SEMICON Taiwan 2013
  • SEMICON Taiwan 2013 will takes palce from September 4-6. It will feature more than 650 exhibitors, and more than 110 speakers from technology companies and research organizations.

    Last update: Friday 6 September 2013 [9 news items]

3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials

Sep 6, 12:11

With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...

Erix Yu, president of Applied Materials Taiwan

SEMICON Taiwan 2013: Scientech showcases in-house developed equipment

Sep 5, 15:53

Semiconductor equipment distributor and wafer reclamation service provider Scientech is currently showcasing its in-house developed wet-process equipment for 12-inch fabs at the SEMICON...

Fabless-foundry model remains major trend, says Qualcomm executive

Sep 5, 12:02

The fabless-foundry business model is still a major trend in the semiconductor industry, whereas the IDM model that achieves efficiency through vertical integration has proven it...

Qualcomm

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

Globalfoundries growing its 28nm customer base, says CEO

Sep 4, 12:39

At least more than 12 companies have adopted 28nm chips manufactured by Globalfoundries, said company CEO Ajit Manocha on September 3.

Globalfoundries CEO Ajit Manocha

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

SEMICON Taiwan 2013: Forums draw TSMC, Globalfoundries

Sep 2, 10:50

A series of technology forums will be held at SEMICON Taiwan 2013, which takes palce from September 4-6, to discuss industry trends, challenges and technologies for future semiconductor...

Foundries to use part of 28nm equipment for 20nm chip production

Aug 29, 11:40

Foundry chipmakers plan to use part of their 28nm production equipment for the manufacture of 20nm chips, as they are aware of a potential oversupply of 28nm chips, according to industry...

TSMC board approves US$1.9 billion for advanced process capacity expansion

Aug 14, 11:10

The board of Taiwan Semiconductor Manufacturing Company (TSMC) on August 13 approved a capital appropriation in the amount of US$1.925 billion for the purpose of installing, expanding...

Realtime news
  • SMIC reportedly hires former TSMC R&D exec

    Bits + chips | 5h 23min ago

  • Magellan, Samsung America to partner on ELD products

    Before Going to Press | 5h 13min ago

  • Vivotek works with partners to integrate H.265 technology into software

    Before Going to Press | 5h 15min ago

  • Digitimes Research: LCD monitor shipments see around 6-7% drop in 1Q17; will continue to decline in 2Q17

    Before Going to Press | 5h 58min ago

  • Cree to set up LED packaging joint venture with Sanan Optoelectronics

    Before Going to Press | 6h ago

  • LG Display 1Q17 net operating profit hits record

    Before Going to Press | 6h 3min ago

  • Elan sees earnings, EPS improve on year in 1Q17

    Before Going to Press | 6h 6min ago

  • SMIC reportedly hires former TSMC R&D exec

    Before Going to Press | 6h 7min ago

  • Taiwan market: Garmin launches new smart bracelets for sport activities, children

    Before Going to Press | 6h 8min ago

  • UMC expects flat performance in 2Q17

    Before Going to Press | 6h 16min ago

  • CyberLink nets NT$0.39 per share for 1Q17

    Before Going to Press | 6h 21min ago

  • Taiwan market: More China vendors to follow Oppo to expand share in local smartphone market

    Before Going to Press | 6h 23min ago

  • Nanya to ramp 20m process output

    Before Going to Press | 6h 24min ago

  • SPIL posts profit drop in 1Q17

    Before Going to Press | 6h 26min ago

  • UMC to roll out 22nm process in 2018

    Before Going to Press | 6h 27min ago

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Global notebook shipment forecast, 2017 and beyond
Wireless broadband developments in Southeast Asia markets

26-Apr-2017 markets closed

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Analysis of China revised domestic semiconductor industry goals
  • The 10nm competition

    TSMC and Samsung have been competing for clients for the 10nm node.

  • Memory price rally

    DRAM prices have been rising amid tight supply.

  • ASE-SPIL merger

    A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) has yet to receive approval from the US...

  • Japan earthquake

    Earthquakes in Japan often cause huge damage. They have had strong impacts on the country's electronics industry.

  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.