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News tagged SEMICON Taiwan 2013
  • Last update: Friday 6 September 2013 [7 news items]

3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials

Sep 6, 12:11

With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...

Erix Yu, president of Applied Materials Taiwan

SEMICON Taiwan 2013: Scientech showcases in-house developed equipment

Sep 5, 15:53

Semiconductor equipment distributor and wafer reclamation service provider Scientech is currently showcasing its in-house developed wet-process equipment for 12-inch fabs at the SEMICON...

Fabless-foundry model remains major trend, says Qualcomm executive

Sep 5, 12:02

The fabless-foundry business model is still a major trend in the semiconductor industry, whereas the IDM model that achieves efficiency through vertical integration has proven it...

Qualcomm

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

Globalfoundries growing its 28nm customer base, says CEO

Sep 4, 12:39

At least more than 12 companies have adopted 28nm chips manufactured by Globalfoundries, said company CEO Ajit Manocha on September 3.

Globalfoundries CEO Ajit Manocha

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

SEMICON Taiwan 2013: Forums draw TSMC, Globalfoundries

Sep 2, 10:50

A series of technology forums will be held at SEMICON Taiwan 2013, which takes palce from September 4-6, to discuss industry trends, challenges and technologies for future semiconductor...

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