Taipei, Monday, November 20, 2017 08:06 (GMT+8)
cloudy
Taipei
19°C
News tagged SEMICON Taiwan 2013
  • Last update: Friday 6 September 2013 [7 news items]

3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials

Sep 6, 12:11

With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...

Erix Yu, president of Applied Materials Taiwan

SEMICON Taiwan 2013: Scientech showcases in-house developed equipment

Sep 5, 15:53

Semiconductor equipment distributor and wafer reclamation service provider Scientech is currently showcasing its in-house developed wet-process equipment for 12-inch fabs at the SEMICON...

Fabless-foundry model remains major trend, says Qualcomm executive

Sep 5, 12:02

The fabless-foundry business model is still a major trend in the semiconductor industry, whereas the IDM model that achieves efficiency through vertical integration has proven it...

Qualcomm

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

Globalfoundries growing its 28nm customer base, says CEO

Sep 4, 12:39

At least more than 12 companies have adopted 28nm chips manufactured by Globalfoundries, said company CEO Ajit Manocha on September 3.

Globalfoundries CEO Ajit Manocha

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

SEMICON Taiwan 2013: Forums draw TSMC, Globalfoundries

Sep 2, 10:50

A series of technology forums will be held at SEMICON Taiwan 2013, which takes palce from September 4-6, to discuss industry trends, challenges and technologies for future semiconductor...

Innodisk
China AMOLED panel capacity expansion forecast, 2016-2020

17-Nov-2017 markets closed

 LastChange

TAIEX (TSE)10701.64+76.60+0.72% 

TSE electronic461.89+4.86+1.06% 

GTSM (OTC)147.98+1.12+0.76% 

OTC electronic224.17+2.52+1.14% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.