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News tagged SEMICON Taiwan 2013
  • Last update: Friday 6 September 2013 [7 news items]

3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials

Sep 6, 12:11

With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...

Erix Yu, president of Applied Materials Taiwan

SEMICON Taiwan 2013: Scientech showcases in-house developed equipment

Sep 5, 15:53

Semiconductor equipment distributor and wafer reclamation service provider Scientech is currently showcasing its in-house developed wet-process equipment for 12-inch fabs at the SEMICON...

Fabless-foundry model remains major trend, says Qualcomm executive

Sep 5, 12:02

The fabless-foundry business model is still a major trend in the semiconductor industry, whereas the IDM model that achieves efficiency through vertical integration has proven it...

Qualcomm

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

Globalfoundries growing its 28nm customer base, says CEO

Sep 4, 12:39

At least more than 12 companies have adopted 28nm chips manufactured by Globalfoundries, said company CEO Ajit Manocha on September 3.

Globalfoundries CEO Ajit Manocha

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...

TSMC

SEMICON Taiwan 2013: Forums draw TSMC, Globalfoundries

Sep 2, 10:50

A series of technology forums will be held at SEMICON Taiwan 2013, which takes palce from September 4-6, to discuss industry trends, challenges and technologies for future semiconductor...

Realtime news
  • Gigabyte Communications to ship 2G feature phones

    Mobile + telecom | 11h 39min ago

  • Panel makers look to vehicle industry as handset panel shipments remain conservative

    Displays | 11h 45min ago

  • Automated production lines still not yet efficient for back-end assembly players

    Before Going to Press | 11h 25min ago

  • Apple cuts iPad mini prices; non-Apple vendors may follow suit

    Before Going to Press | 12h 6min ago

  • Digitimes Research: DRAM shipments to drop 20% on year in 2014 due to weak PC demand

    Before Going to Press | 12h 7min ago

  • LED demand turns weak in 3Q14, says Epistar chairman

    Before Going to Press | 12h 25min ago

  • Digitimes Research: Kickstarter wearables expand their presences in sleep sensing industry

    Before Going to Press | 12h 26min ago

  • Three flexible PCB makers raise funds to address growing business operations

    Before Going to Press | 12h 31min ago

  • Apple iWatch still under EVT despite components already in production

    Before Going to Press | 12h 33min ago

  • Taiwan market: HTC to launch HTC Butterfly 2 through cooperation with Chunghwa Telecom

    Before Going to Press | 12h 35min ago

  • Trend and technologies at Touch Taiwan 2014

    Before Going to Press | 12h 36min ago

  • Asustek readies new 2-in-1 products for competition

    Before Going to Press | 12h 37min ago

  • Demand for 8-inch wafer foundry heating up

    Before Going to Press | 12h 37min ago

  • New mobile products to benefit component suppliers until end of 2014

    Before Going to Press | 12h 38min ago

  • Acer becomes top PC and projector vendor in Philippines

    Before Going to Press | 12h 40min ago

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