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REALTIME NEWS
Niche memory specialists upbeat about network device upgrades
Tomorrow's Headlines
6h 13min ago
Lead times for Nvidia chips shortened
Tomorrow's Headlines
6h 17min ago
IPC maker Aplex sees AI-driven IoT potential
Tomorrow's Headlines
6h 21min ago
IC distributors upbeat about datacenter demand
Tomorrow's Headlines
6h 38min ago
Wi-Fi 7 core chip shipment trend encouraging
Tomorrow's Headlines
7h 13min ago
Demand divided for handset specs in 2024; flagship models to stand out
Tomorrow's Headlines
7h 34min ago
Server assemblers to demo latest AI solutions at upcoming Computex
Tomorrow's Headlines
7h 40min ago
Naura benefits most from China's chipmaking equipment self-sufficiency
Tomorrow's Headlines
7h 47min ago
Polarizer supplier CMMT sees manufacturing utilization rise
Tomorrow's Headlines
8h ago
Astera Labs steps up investment in Taiwan
Tomorrow's Headlines
8h 7min ago
Samsung next-gen flagship smartphone unlikely to use own processor, say sources
Tomorrow's Headlines
8h 49min ago
Memory module firms stockpile in anticipation of chip price rally
Tomorrow's Headlines
9h 5min ago
May sees mobile AMOLED panel prices rise while LCD prices fall
Tomorrow's Headlines
9h 6min ago
NEWS TAGGED EEBUS
Thursday 6 October 2022
Infineon becomes first chipmaker to join IoT open standard EEBus
Germany-based chip supplier Infineon Techologies has become the first chipmaker to join the EEBus consortium, according to the company.
BIZ FOCUS
May 20, 10:28
Havbeat Technology's all-in-one online course platform Havppen drives enterprise digital transformation
Tuesday 14 May 2024
TPCA teams up with Taiwanese industry association to bolster talent and supply chains in Thai electronics manufacturing expansion
Thursday 9 May 2024
Power suppliers and BLDC motor drivers from Mean Well in time
Thursday 9 May 2024
SK Hynix develops next-generation mobile NAND solution ZUFS 4.0
TOP STORIES
7 DAYS NEWS
Huawei chip development receives all-out support from Chinese semiconductor firms
Speculation arises about Huawei developing Kirin PC chips
Apple said to have signed pact with Samsung Display for foldable devices
Intel steps up equipment and material orders for advanced packaging
Samsung HBM3E reportedly unable to pass Nvidia verification due to TSMC's standard
Weekly news roundup: Chinese semiconductor companies rally in full force to boost Huawei chips
Japanese initiative helps semiconductor material startups cross Death Valley
SK Hynix plans to shorten HBM4E development process by 1 year
Samsung establishes new organization aiming to increase value of refurbished devices
Sharp to close world's first 10G LCD panel fab by September, spurring major customers to reassess supply partnerships
Full list
RESEARCH INSIGHTS
Fuel cell is pivotal for Taiwan's hydrogen industry, according to DIGITIMES Research
Silicon shield doesn't guarantee military deterrence for Taiwan, says DIGITIMES Research
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
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