In his "Liberation Day" speech on April 2, former U.S. President Donald Trump singled out key players in the global tech and trade landscape — including TSMC, its chairman C.C. Wei, Taiwan, South Korea, Japan, and notably China's President Xi Jinping — as he unveiled a sweeping reciprocal tariff plan aimed at bringing manufacturing back to America.

The White House has announced a significant shift in US trade policy, asserting that access to the American market is "a privilege, not a right." The Trump administration emphasized a move away from what they described as past trade deals that yielded "empty promises" and a firm stance on reciprocal tariffs.

For the first 45 years after Intel's founding, from its first CEO Robert Noyce to its fifth, Paul Otellini, the company focused on perfecting the IDM (integrated device manufacturing) model. The "Intel Inside" campaign became a global success, cementing Intel's position at the top of the semiconductor industry. It wasn't until 2013 when Brian Krzanich became Intel's sixth CEO that the company made its first tentative steps into foundry services.

The demand for telecom chips is one of the relatively stable applications driving recovery momentum in 2025. So far, Taiwanese chip manufacturers maintain a positive outlook for the market conditions in 2025, particularly due to the apparent upgrade demands for telecom specifications in Europe and the US.

Jabil has introduced advanced transceivers capable of transmitting data at speeds reaching 1.6 Terabits per second, aimed at addressing the increasing demand from sectors such as artificial intelligence and machine learning workloads, high-performance computing, and data center connectivity. These transceivers, utilizing Intel Silicon Photonics technology, support data transmission of 200 Gigabits per lane across both electrical and optical interfaces. They are available in three variants—DR8, DR8+, and 2xFR4—allowing data centers to double their bandwidth capacity without needing infrastructure changes, while also maintaining low energy consumption.

During China's peak prosperity, Taiwan managed to survive under significant pressure. Now, freed from direct Chinese constraints, Taiwan continues to navigate challenges alongside global powers. Within the G2 dynamic, Taiwan grapples with internal limitations such as energy, talent, and land. Even the goal of maintaining the status quo poses an increasingly daunting challenge, with US policy toward Taiwan—especially under the Trump administration—remaining a critical factor.

Sharp Corporation announced on March 31 that it has agreed to sell an idle LCD panel factory in Mie Prefecture, Japan, to local electronics component maker Aoi Electronics. Known as Mie Plant 1, the facility spans roughly 60,000 square meters (approx. 14.83 acres) and has been inactive since 2015, when Sharp halted small- and medium-size LCD production there.

Between 2019 and 2024, global GDP rose by about US$21 trillion. During this time, companies like AWS, Microsoft, Meta, Google, and Tesla saw their market values exceed US$1 trillion. These tech giants have not only focused on their main business areas but have also significantly invested in developing in-house chips.

On April 1, 2025, TSMC's Japanese subsidiary, JASM, hosted its annual new employee enrollment ceremony, a tradition for many Japanese companies, at its headquarters in Kikuyo Town, Kumamoto Prefecture, Kyushu. Despite delays in the installation of some equipment at JASM's first wafer plant and a postponed construction schedule for the second plant, the company saw a significant increase in the number of new hires this year.

Chinese distributors of Nvidia's H20 GPU are facing severe supply constraints as demand surges for AI computing power in the market. According to a notice from Chinese tech firm H3C to its customers on March 25, international supply chain uncertainties have nearly depleted current inventory, with the next shipment expected mid-April.

Rapidus officially launched its IIM-1 semiconductor fab in Chitose City, Hokkaido, on April 1, marking a major milestone in Japan's ambition to produce cutting-edge 2nm chips. However, company executives caution that improving yield rates and securing future customers remain key challenges, reports Nikkei and Bloomberg.

Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts in South Korea say the joint trip is highly unusual and likely points to a strategic pivot in Samsung Group's China operations.

Rapidus, a Japanese company focused on semiconductor innovation, officially opened its first facility, IIM-1, in Chitose City, Hokkaido, on April 1, 2025. Aiming to advance in the production of next-generation semiconductors, the company has commenced operations on a trial production line dedicated to 2nm chips.

Amid growing concerns over semiconductor supply chain resilience and geopolitical tensions, industry speculation has emerged about potential consolidation in the global foundry sector. Nikkei Asia recently reported that Taiwan's United Microelectronics Corporation (UMC) and US-based GlobalFoundries are considering a merger that would significantly expand their combined presence across Asia, the US, and Europe. Such a move would potentially strengthen US access to legacy chips – critical components in numerous industries – amid increasing concerns over Taiwan Strait tensions.

Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting April 1. This marks the company's first price hike for TCB equipment, according to reports from South Korean media outlets ET News and Money Today.

China's electronic product trade-in initiative is driving stronger electronics sales in the first half of 2025, with the smartphone sector showing particular strength. Industry sources report that Chinese smartphone sales are growing compared to the same period in 2024, with flagship models capturing an increased market share.

Commerce Secretary Howard Lutnick has signaled he could withhold promised Chips Act grants as he pushes companies in line for federal semiconductor subsidies to substantially expand their US projects, according to eight people familiar with the matter.

Taiwan's semiconductor manufacturers continue to confront challenging market conditions for mature process technologies, with reports that TSMC may slow expansion plans at its Kumamoto facility. Industry sources indicate that ASE Technology and Intel have also delayed capacity growth in Malaysia, despite maintaining public optimism about future demand.

On April 1, UMC announced the opening ceremony for its expanded facility in Singapore. The first phase of this new plant is scheduled to commence production in 2026, which is expected to increase the total capacity of UMC's Singapore Fab 12i to over one million 12-inch wafers annually.

On April 1, Rapidus inaugurated its first semiconductor fabrication facility, IIM-1, in Chitose City, Hokkaido, marking a pivotal step in Japan's leap from 40nm technology to the cutting-edge 2nm process. Rapidus is spearheading Japan's ambition to restore its semiconductor manufacturing autonomy. The consortium includes elite talent from Renesas, Tokyo Electron (TEL), and international firms like United Microelectronics Corporation (UMC), ensuring technological advancements and yield rates align with expectations.

Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth memory (HBM) equipment—vital for powering generative AI—will continue to grow. However, he anticipates that sales of front-end semiconductor manufacturing processes in 2025 will likely remain on par with 2024 levels.

SEMICON China 2025 opened at the Shanghai New International Expo Centre to large crowds and packed booths, a full display of China's forward momentum for its semiconductor industry. Beneath the prestige, however, domestic chip equipment makers are embroiled in a brutal price war, with some reportedly cutting prices to just 40% of list value in a scramble for market share.

Taiwan Semiconductor Manufacturing Company (TSMC) is poised to commence mass production of its 2-nanometer (nm) chips in the second half of 2025 as scheduled, with customer demand showing no signs of abating. By year-end, monthly capacity is expected to reach 30,000 wafers, and industry sources suggest foundry quotes could climb to US$30,000 per wafer.

A senior executive from Kaynes Semicon revealed plans for the company to become the first in India to package chips by July, noting the delay in Micron's ATMP project.