Recent market developments—such as Nvidia's capital infusion into Intel and AMD's approach to Intel for packaging deals—have yet to rock the current PC processor market. But they're already expanding the contours of what's possible.
As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging, a surprising development is reshaping the conversation. A Chinese startup has reportedly discovered a high-value application for large-diameter SiC substrates—one that directly aligns with the supply chain of tech giant Meta's AI-powered smart glasses.
