Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry
Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030
Apple's updated Vision Pro headset, launching this week, may not bring sweeping new features, but the packaging reveals a quietly significant shift: it's assembled in Vietnam
