DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.

Taiwan to head for smart digital economy, says science minister
Taiwan will focus its next wave of technology development on materializing smart healthcare, precision medicine, smart city and digital data governance by leveraging...

AaaS essential to digital transformation of small- to mid-size firms: Q&A with AIMS director Chien Chen-fu
Small- to medium-size manufacturers are important to Taiwan's economy, but most of them lack the human resources and cannot afford the expensive equipment and...

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to...

Promoting trust in AI: Q&A with Intel data-centric tech evangelist Abigail Hing Wen
Abigail Hing Wen is the data-centric tech evangelist and AI podcast host for Intel. Beside her work at Intel, she has multiple identities: a lawyer in venture...

5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are...

IT ecosystem transformation: Q&A with Inventec chairman Tom Cho
The global IT ecosystem is undergoing fundamental changes in the wake of the coronavirus pandemic and US-China trade tensions. Inventec, as one of the major ODMs...

Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support...

Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng
Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain...

Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment...

Disrupting the hiring process with AI: Q&A with Terminal 1 Recruitment CEO Edwin Shao
The coronavirus pandemic is driving more companies to embrace digital transformation, but the biggest pain point in the process for many corporate CTOs is the...

Beyond ruggedized IPCs: Q&A with Getac chairman James Hwang
Taiwan-based ruggedized industrial PC (IPC) maker Getac has been transforming its business and is adopting a business model of a system integrator (SI) to expand...

Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...

Food delivery by robots: Q&A with Kiwi Campus founder Felipe Chavez Cortes
Silicon Valley-based Kiwi Campus is a startup dedicated to operating a semi-autonomous robotic platform for delivering foods, beverages and groceries to consumers...

Digital transformation via AI enablement: Q&A with dTran Smart Consulting executives
A serach for "digital transformation" on Google will come up with more than 350 million results - an indication of the attention it has been drawing. But many...

Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh
As the largest electronics distributor in Asia, WPG Holdings continues to expand and diversify its offerings particularly those for 5G, AI and automotive electronics...

Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...

Enterprise AI to be key growth driver: Q&A with IBM Greater China CTO Dong Xie
IBM has been looking to expand its presence in the cloud computing industry via the releases of its AI+ and the offering of hybrid cloud solutions, and expects...

Taiwan hardware capability is best nutrient for AI development: Q&A with Microsoft Taiwan COO Hedy Ho
Microsoft keeps investing in Taiwan, having set up an IoT innovation center in October 2016, an AI R&D center in January 2018. It alsto introduced an AI 100...

Science minister Chen Liang-gee shows confidence and ambition in promoting Taiwan entrepreneurship
Science minister Chen Liang-gee has been making a lot of efforts grooming Taiwan's startups, a clear example being his ministry's arrangement of a large delegation...

Quanta making AI push, says chairman
AI will usher in the Fourth Industrial Revolution, and Taiwan must manage to develop a solid presence in the AI era that will persist into the next decades, Quanta...

Memory long-term outlook promising: Q&A with Micron EVP Sumit Sadana
The memory-chip market conditions will start to improve later in 2019, followed by several years of prosperity, according to Sumit Sadana, executive VP and chief...

AI-enhanced manufacutring: Q&A with Seagate executive VP Jeffrey Nygaard
Seagate has teamed up with HPE and Nvidia to release an AI-based manufacturing platform, Project Athena, in line with the concepts of Industry 4.0, as artificial...

Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge...

Industry 4.0 brings lucrative opportunities for chipmakers: Q&A with TI manager Matthieu Chervier
Global chipmakers have been racing to develop chip solutions associated with Industry 4.0 applications to tap huge business opportunities arising from smart manufacturing...