Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications...
Ultraband Technologies, an emerging IC design startup, announced today the official signing of a Memorandum of Understanding (MOU) with NTT ADVANCED TECHNOLOGY CORPORATION (NTT-AT), a subsidiary of Japan's NTT Group...
The global semiconductor landscape is undergoing a fundamental shift, moving from a focus on raw training power to the practical complexities of large-scale deployment. In an in-depth interview, Wallace Kou, President and CEO of Silicon Motion, detailed how the generative AI has evolved beyond its initial stages...
With demand for AI edge computing continuing to grow, Retronix announced that its Sparrow Hawk AI edge computing platform has officially entered mass production and is now available to the global market. The platform is powered by the automotive-grade SoC R-Car V4H from Renesas Electronics, delivering up to 30 TOPS (Dense) AI inference performance...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium.
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect...
Taiwan Mobile today held a Mac launch event to announce that Mac products are now officially available. Centered around the theme "Small Bite. Big Possible.", Taiwan Mobile has integrated MacBook Neo, M5-powered MacBook Air and MacBook Pro, as well as Mac mini, becoming the first telecom operator in Taiwan to deliver a full-scale Apple ecosystem.
Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology at the Partner Pavilion of the TSMC 2026 North America Technology Symposium...
The "Mini SSD Strategic Seminar" convened recently to strengthen collaboration and accelerate ecosystem development following the successful "Mini SSD Ecosystem Application Seminar" held in Shenzhen on January 26.