As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications. Through this collaboration, Nuvoton will combine its tethered XR Glass–optimized SoCs with Snapdragon XR platforms, and its software ecosystem to accelerate the development and deployment of tethered XR Glass applications and to support industry expansion.XR glasses are increasingly being adopted, particularly in industrial and enterprise fields, for use cases such as operational support, remote assistance, and information visualization. At the same time, achieving compact and lightweight designs, long battery life, and comfortable user experience remains a key challenge for broader market adoption.Nuvoton has been providing SoCs that balance the processing performance and low power consumption required for tethered XR Glass applications. Through this collaboration with Qualcomm Technologies, Nuvoton aims to create an environment that enables more device manufacturers and developers to more easily enter the tethered XR Glass industry.Qualcomm Technologies'newest XR platform, Snapdragon Reality Elite, combined with Nuvoton's SoC, enables a practical and scalable tethered optical see-through (OST) architecture that balances performance, power efficiency, and system flexibility. This configuration allows computing intensive XR workloads to remain on the tethered device while delivering high quality, low latency display and sensor data to lightweight glasses. Together, Snapdragon Reality Elite and Nuvoton’s SoC form a strong foundation for OEMs to accelerate time-to-market for tethered OST designs while maintaining a clear path for future system evolution.Key Collaboration AreasEvaluation of optimized tethered XR Glass configurations by combining Nuvoton's SoCs with Qualcomm Technologies' XR platforms and related technologies.Nuvoton positions its SoC as a key enabler of AI-driven tethered XR platforms. The SoC provides a scalable architecture that decouples application processors from display and sensor subsystems, including cameras and microphones.By abstracting complex interfaces, it helps device manufacturers accelerate time-to-market, reuse designs across product generations, and optimize system performance and power efficiency, particularly for smart glasses.In addition to tethered XR Glass applications, the SoC supports emerging use cases such as agentic AI experiences by simplifying system integration and enabling flexible system architectures. Within the XR ecosystem, Nuvoton works with Qualcomm Technologies, OEMs, and partners at a platform level, supporting the evolution of XR as a next-generation AI computing platform.Value Proposition and BenefitsThrough this collaboration, the adoption of Nuvoton's XR Glass SoCs is expected to deliver the following benefits:1.A comfortable user experience enabled by high-performance, low-power designs optimized for tethered XR Glass use cases. 2.Superior connectivity and access to a rich software ecosystem through compatibility with Qualcomm Technologies platforms. 3.Reduced development effort and shortened time-to-market. 4.Support for a wide range of applications, from industrial to enterprise use cases."This collaboration with Qualcomm Technologies represents an important step in expanding the applicability of our SoC solutions for tethered XR Glass and emerging AI-driven XR platforms." said Ken Su, Vice President of Cloud Security Business Group at Nuvoton Technology Corporation."By working together within the ecosystem, we aim to support our customers in bringing innovative smart glasses and next-generation devices to market more efficiently.""By working with Nuvoton to pair Snapdragon XR platforms with their optimized SoC, we aim to support lightweight optical see-through designs that balance performance, power efficiency and system flexibility. This collaboration builds toward the next phase of the XR ecosystem." Sahil Bansal, Senior Director, Product Management at Qualcomm Technologies remarked.For more information.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers."The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK hynix, adding that "We will work closely with partners for mass production in a timely manner." The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models. These enhancements improve data processing capabilities for AI training and inference.The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments. This enables customers to increase efficiency in processing data for AI datacenters and large-scale computing systems. SK hynix utilizes Advanced MR-MUF technology for HBM4E products to achieve a 48GB capacity in a 12-layer stack while ensuring structural stability. In particular, the company has also improved heat resistance by 17 percent, compared to the preceding HBM4, enabling stable operation of memory chips in high-performance computing environments.SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4. Leveraging its market-proven product reliability and supply capabilities, the company will support the development of next-generation infrastructure while helping address AI system bottlenecks. "SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise," said Ahn Hyun, President and Chief Development Officer, adding, "Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator."Credit: SK hynix

Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material and Celeritas HM001 is a near-zero CTE material. Used together in a single stackup, they bring board CTE below 10 ppm/°C while simultaneously delivering Tier 9 electrical performance.Every hyperscaler building AI infrastructure is confronting the same pair of converging constraints. As AI accelerators scale beyond reticle limits, thermomechanical mismatch between silicon (2–4 ppm/°C) and standard PCB materials (~18 ppm/°C) produces catastrophic reflow warpage, package bow, and solder joint fatigue. Simultaneously, the explosive growth in data rates, driven by HBM, UCIe, and chip-to-chip interconnect operating at 100+ Gbps, is pushing signal integrity requirements beyond what standard PCB dielectrics can support. The industry has been searching for two separate solutions to two separate problems. ACCM has built one material family that addresses both.The industry's leading proposed fix of solid glass substrates remains positive in CTE and does not address the electrical side at all. ACCM today announced Celeritas HM50 and Celeritas HM001, which together solve both problems simultaneously. Programs can start today.Celeritas HM50 FEA – Standard PCB at 18 ppm/°C (left) vs. PCB with HM50 at 10 ppm/°C (right). FR4 PCB baseline fails JEDEC qualification, while the PCB with HM50 shows >100× improvement. Warpage and Package Bow are reduced by 64%, and 81%, respectively. Combined HM50+HM001 stackups achieve even lower effective CTE.Keshav Amla, COO of Advanced Chip & Circuit Materials, said,"Rather than incrementally tuning stackups, we are applying a breakthrough materials innovation to remove a fundamental limitation that has constrained system scaling. HM50, with its negative CTE of -8 PPM/°C, drives the effective CTE of the board down. Even with heavy copper designs, you could tune a board down to 12, 10, 8 PPM/°C or lower. And where next-generation data rates demand extreme loss performance, HM001 replaces those layers with a Tier 9 loss material that has a near-zero CTE. Together, they give designers headroom they simply have not had before."The HM Class of materials matches each layer type in an AI accelerator stackup with a material purpose-built for it: HM50 for the power planes, HM001 for the signal layers. As AI accelerators grow in scale, the industry has long struggled with two separate problems — boards warping under thermal stress, and signal loss at extreme data rates. ACCM's Celeritas material family tackles both within a single solution. Celeritas HM50 counteracts the thermal expansion mismatch that causes warpage and solder joint failures, enabling designs that previously failed industry qualification to now meet it with significant margin. Celeritas HM001 addresses the signal integrity side, supporting the data rate demands of next-generation AI interconnects while also contributing to thermal stability. Together, the two materials give chip and board designers headroom that standard PCB materials have not been able to provide. For more details, please visit here.Credit: Advanced Chip and Circuit Materials