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REALTIME NEWS
Lenovo mounts AI comeback with Nvidia Vera Rubin NVL72 deliveries and US plant expansion
ICT
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 23 September 2026
The Robot in the Supply Chain
Beijing's second annual World Humanoid Robot Games offered a vivid preview of where this technology race is headed. Over five days, more than 2,000 humanoid robots competed across 51 events and over 1,000 individual matches including running, table tennis, soccer participated in an Olympics-style spectacle that doubled as a statement of intent. As the technology race with the U.S...
Tuesday 22 September 2026
AT&S Unveils Strategy to Drive AI Growth
Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering key insights into the company's strategic positioning under China's evolving economic framework...
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
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SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
DeepSeek reportedly raises US$15B as IPO plans gather pace
India's CleanMax partners with Apple, Meta to supply green power for AI data centers
Why is TSMC suddenly looking at Texas?
Interview: TI sees liquid cooling shift to tray-level control in AI data centers
Anthropic launches Claude Duet to automate cross-app tasks
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