Amidst the reality of global oil prices continuously skyrocketing due to war, the global market is facing the formidable challenges posed by the turbulence impacting the global economy in 2026. Major Taiwanese electronics manufacturers and supply chains are pivoting to review comprehensive AI strategies. They are adopting a particularly aggressive stance in their strategic deployment of cloud server systems and AI infrastructure, aiming to achieve an operational breakthrough where the market outlook remains far from optimistic

Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

Technology news, product launches and show highlights from the event attendees available for download (PDF).

ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges of next-generation AI and high-performance computing data centers.ASUS Optimized Liquid-Cooling Solutions for next-generation AI compute densityAs AI and HPC workloads push compute density and power consumption beyond the capabilities of traditional air cooling, optimized liquid-cooling solutions by ASUS will provide the critical thermal management required for the next-generation NVIDIA Vera Rubin NVL72 system based data centers. By efficiently dissipating heat from high-performance CPUs, GPUs, and accelerator-dense racks, ASUS significantly reduces energy consumption, lowers PUE, and optimizes TCO while supporting unprecedented rack density.ASUS Optimized Liquid-Cooling Solutions offer a comprehensive portfolio spanning direct-to-chip (D2C), in-row CDU–based cooling, and hybrid configurations, enabled through collaboration with global infrastructure leaders. Leveraging a strategic framework of partners – including Schneider Electric and Vertiv, alongside precision components from Auras Technology, Cooler Master, and other industry leaders – ASUS provides purpose-built cooling solutions that ensure optimal stability and performance at scale. With 2,156 No. 1 SPEC CPU records and 248 No. 1 MLPerf results, ASUS continues to demonstrate leadership in real-world compute density and AI performance.Real-world deployment: ASUS powers liquid-cooled AI supercomputer at NCHCA flagship example of liquid-cooling expertise by ASUS is its recent deployment for the National Center for High-performance Computing (NCHC) in Taiwan. The system features a dual-compute architecture, including the Nano4 NVIDIA HGX H200 cluster and NVIDIA GB200 NVL72 system  -  Taiwan's first fully liquid-cooled AI supercomputer deployment of this architecture.Designed and engineered by ASUS from the ground up, the system implements direct liquid-cooling (DLC) technology to achieve an exceptional power-usage effectiveness (PUE) of just 1.18. This deployment seamlessly integrates high performance with sustainable design, demonstrating the strength of ASUS in thermal and energy management for large-scale AI infrastructure.Join ASUS at GTC 2026ASUS announced its participation as a Diamond Sponsor (Booth #421) at NVIDIA GTC 2026 from March 16–19 in San Jose, USA. Under the theme Trusted AI, Total Flexibility, ASUS is collaborating with NVIDIA and global infrastructure giants to showcase a robust, next-generation liquid-cooling ecosystem. Come explore with us and witness the next evolution of AI infrastructure.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.) IP, achieving a data rate of 64 Gbps per lane, the highest speed defined in the UCIe specification. The 64G UCIe IP, supporting UCIe 3.0, delivers an impressive bandwidth density of 21 Tbps per 1 mm of die edge (10.5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P technology and CoWoS advanced packaging, typically leveraged by AI, high-performance computing (HPC), datacenter and networking applications.To ensure seamless system integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power consumption, minimal data transfer latency, and efficient end-to-end flow control – enabling a seamless transition from traditional single-chip Networks-on-Chip (NoC) to chiplet-based architectures. Additionally, the bridges support Dynamic Voltage and Frequency Scaling (DVFS), allowing real-time voltage and frequency adjustments independently for each die withoutinterrupting data flow.GUC's UCIe IP also features advanced reliability capabilities, including UCIe Preventive Monitoring functionality and integrated I/O signal quality monitors from proteanTecs. This technology enables continuous, mission-mode monitoring of signal integrity during data transmission without the need for re-training or disrupting operations. Each signal lane is individually monitored, with real-time detection of power and signal integrity anomalies. Potential defects in bumps and traces are identified early, triggering repair algorithms that replace marginal I/Os with redundant ones to prevent system failures. This proactive approach significantly extends chip lifespan and enhances system reliability."We are fully committed to delivering the highest performance and lowest power 2.5D/3D chiplet and HBM interface IPs on TSMC's advanced process and packaging technologies," said Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging technologies, leveraging HBM3E/4/4E, UCIe-A, and UCIe-3D interfaces, enables the development of highly modular processors that exceed reticle size limitations, paving the way for the next generation of highperformance computing. Our strong collaboration with TSMC and its Open Innovation PlatformR (OIP) ecosystem is enabling our customers to accelerate time-to-market in today's AI-driven competitive market."Click here for more information.GUC UCIe 64G IP Highlights. Credit:Guc

Artificial Intelligence Industry Exhibition (hereinafter, AI EXPO KOREA 2026) - the largest AI exhibition in Asia, presenting a comprehensive view of the present and a blueprint for future industries - will be held for three days from May 6 to 8 at COEX Hall A (entire 1st floor) in Samseong-dong, Seoul.First launched in 2018 to foster the domestic AI ecosystem and promote the development and activation of the AI industry, AI EXPO KOREA 2026 marks its 9th edition this year. The event is jointly organized by the Korea Artificial Intelligence Association, Seoul Messe, and AI Newspaper. Over the years, the exhibition has established itself as a leading platform that diagnoses the current state of AI and presents future directions, functioning as a venue where the latest AI technologies and real-world business applications can be directly experienced while relevant information and insights are actively shared.Scenes from AI EXPO KOREA 2025 held last year. Credit: AI EXPO KOREA 2026In particular, it has firmly positioned itself as a practical forum where companies and institutions across diverse industries plan and design strategies in response to the AI era, playing a pivotal role in shaping the domestic AI ecosystem and advancing industrial development. It is widely recognized as the largest and most authoritative AI event in Asia in both name and substance.At the 8th edition held last year, 322 companies and institutions from 18 countries, including the United States and Canada, participated with a total of 544 booths. Over the three-day event, 43,788 visitors and buyers attended, proving its status as a premier standalone AI exhibition. Building on this success, AI EXPO KOREA 2026 is expected to be held on an even larger scale with more diverse content. The organizers anticipate participation from approximately 350 companies from around 20 countries with a total of 600 booths, setting a new record as the largest edition to date.If 2025 marked the era of "thinking machines" driven by generative AI, we are now entering the era of "moving intelligence," namely the age of Physical AI. The AI industry is expected to experience explosive growth centered on AI Agents capable of autonomously performing personalized tasks, increasingly sophisticated and versatile Large Language Models (LLMs), and the powerful AI infrastructure that supports all of these technologies. Furthermore, as AI expands beyond the digital world to directly interact with the physical world through robots, autonomous driving, smart devices, and industrial automation systems, Physical AI is rapidly reshaping the very structure of industries and daily life. AI EXPO KOREA 2026 will spotlight these key trends and provide visitors with an opportunity to experience the forefront of AI technology.Moving beyond simple chatbots, AI Agent technologies that understand user intent and autonomously plan and execute complex tasks are transforming paradigms across industries. In particular, these AI Agents are no longer confined to software environments but are expanding into Physical AI that acts directly in the real world through integration with robotics and autonomous systems. This exhibition will showcase a wide range of AI Agent solutions and real-world applications across fields such as personal assistants, smart home control, industrial automation, customer service innovation, robotics, and autonomous systems. Visitors will be able to directly observe how AI Agents maximize work efficiency and create entirely new user experiences.Represented by LG EXAONE, Solar, A.X K1, OpenAI's GPT series, Google's Gemini, Meta's LLaMA, Hangzhou DeepSeek, and Qwen, LLMs have evolved into multimodal systems capable of generating not only images but also videos, demonstrating increasingly creative and advanced task execution capabilities. These LLMs go beyond simple content generation and, when combined with robotics, serve as the "brains" of Physical AI by directing and controlling physical actions. At AI EXPO KOREA 2026, the latest LLMs developed by leading domestic and international companies, along with various application services and industry-specialized LLM solutions, will be presented through live demonstrations. In particular, in-depth discussions are expected on the ethical use of LLMs, data security, and technologies for model lightweighting and optimization.Above all, establishing AI strategies requires more than simply selecting a model; it demands solutions that can fine-tune models for specific use cases and efficiently manage the substantial costs associated with AI deployment and operation. Accordingly, this exhibition will introduce comprehensive AI infrastructure technologies and solutions, ranging from AI chips and accelerators to storage, AI servers, various edge devices and computing, HPC, cloud, and data centers. Key discussion topics will include robotics computing for the Physical AI era, real-time sensor processing, on-device AI, and low-latency edge infrastructure. On site, a series of solutions and demonstrations will illustrate practical strategies for how AI infrastructure and on-device AI enable AI to interact with our daily lives, industries, and businesses from the perspective of AI convergence and real-world application.In addition, the exhibition will provide a comprehensive overview of core infrastructure technologies and solutions for AI development and operations, including data collection, processing, and analytics platforms, as well as automation tools for AI model training and deployment. Domestic and international semiconductor companies, data center solution providers, and cloud service companies will present their latest technologies, showcasing hardware and software competitiveness for the AI era.Ultimately, AI EXPO KOREA 2026 will go beyond a simple technology and industry exhibition to serve as a venue that presents concrete answers to the business innovations and industrial transformations driven by AI. Participating companies will showcase their AI technologies and solutions to discover new business partners, while visitors will gain the latest information and valuable insights on strengthening competitiveness through AI adoption and securing future growth engines.Detailed information can be found on the official website.