Displays are the last mile for communication between human and machine. In recent years, a wave of smart digitization has taken global industries by storm, as companies in the vehicle, retail, manufacturing, and medical industries have implemented all types of equipment to meet demands in their respective fields. However, specifications of displays used in existing terminal sectors may not match backend computing equipment.
The LEC-RB5 SMARC is a high-performance module, built with the Qualcomm® QRB5165 processor, allowing on-device AI and 5G connectivity capabilities for consumer, enterprise, and industrial robots. It features a high-performance NPU, an Octa-Core (8x ARM Cortex-A77) CPU, low power consumption, and support for up to six cameras. The Qualcomm QRB5165 processor, customized for robotics applications, is designed for running complex AI, deep learning workloads, and on-device edge inference efficiently while using low power.
ADLINK EGX-MXM-A1000, EGX-MXM-A2000 and EGX-MXM-A4500 are the first modules to use NVIDIA's embedded GPUs based on NVIDIA Ampere architecture. ADLINK embedded MXM graphics modules offers high performance GPU acceleration in the compact, power-efficient MXM form factor, bringing edge computing and embedded AI to numerous vertical markets in healthcare, manufacturing, transportation, and more. Rugged design built for severe temperature extremes, shock and vibration, and corrosion in harsh conditions.
Self-driving cars have been listed as an important focus for development by global car and technology companies. The successful development of the technologies will not only depend on the sensor and recognition technologies for the vehicles, it will also require digitized systems in the surrounding environments on the road. ADLINK has been working in this area for many years. Henry Hu, Global Business Development Director, Networking Communication and Public Sector Business Unit, ADLINK, stated that besides the high quality and high performance edge computing hardware understood by the industry, the software technology has also been completed in recent years. Through the integration of hardware and software, ADLINK can provide complete solutions for system integration companies and end users.
5G has become one of the most anticipated technologies for manufacturers in the two recent years. This technology is regarded as being especially crucial for the coming era of enterprise private networks and is also considered to be a key factor for the next-generation manufacturing systems. Chia-Wei Yang, director of the IoT Solution & Technology Business Unit at ADLINK Technology, said that manufacturing systems will take on a variety of additional functions by integrating existing smart infrastructure with enterprise private networks. This will help companies reduce costs, enhance their efficiency, and increase the safety of manufacturing.
ADLINK Technology Inc, global leader in edge computing, launched the NEON-2000-JNX series, the industry's first industrial AI smart camera that integrates the new NVIDIA Jetson Xavier NX module. The new camera's high performance, small form factor and ease of development open the door for innovative AI vision solutions in manufacturing, logistics, retail, service, agriculture, smart city, healthcare and life sciences, and other edge applications. The camera is an all-in-one solution, eliminating the traditional need for complex integration of the image sensor module, cables, and AI box PC.
ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.
Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons, and space technology, etc. We can't help but wonder, how do semiconductor plants produce chips with such a large variety of functions out of large silicon wafers? The entire procedure involves an extremely important back-end packaging process known as "die bonding," which is to remove the die from the silicon wafer, and then attaching the die to the IC substrate using a conductive medium such as epoxy or gold wire (with epoxy the most common).
The recent global shortage of automotive chips has brought Taiwan's semiconductor industry into the focus of worldwide attention. The real cause of why Taiwan's semiconductor chips are in such great demand is due to their trusted, unwavering quality that's supported and assured by a series of rigorous verification procedures. The electrical measurement performed before integrated circuit packaging is one of the most important steps of verification. To complete this task, the engineering probe station system must be used in conjunction with a variety of test instruments, automatic test equipment and specially designed engineering verification system.