With 2025 Computex Taipei focusing on the three major themes of "AI & Robotics", "Next-Gen Tech" and "Future Mobility", global technology giants have gathered to display their AI technology prowess, focusing on the core concept of "AI Next". The rapid deployment of AI applications has also accelerated urgent demand for high-efficiency storage technologies across various application scenarios. As the global leader of NAND Flash controllers, Silicon Motion plays a key role in AI ecosystem development. Meeting Diverse Storage Requirements, from Low Latency and Power Efficiency to High Data Throughput, to Support Edge AI Growth"The emergence of DeepSeek has greatly lowered the threshold for AI applications," pointed out Mr. Kou, President and CEO of Silicon Motion. As an open source technology, DeepSeek has been able to reduce the cost of language model training. It has gradually subverted the industry's traditional views on AI and led to the accelerating popularization of edge applications. He emphasizes that a wave of AI adoption has already begun for devices from smartphones and laptops to wearable devices, and that storage technologies are crucial in supporting this revolution.In his analysis of AI storage architecture, Mr. Kou remarked that the storage system requirements for each stage of the implementation process differ when implementing AI applications in various scenarios, from initial data ingestion to the preparation, training, and inference stages. For instance, data ingestion requires import of a large amount of data, meaning that high write throughput is required. On the other hand, low latency performance and support for a wide variety of I/O sizes has greater importance in the model training stage. Although these requirements vary, the overall architecture must still possess five core characteristics: high data throughput, low latency, low power, scalability, and high reliability, in order to meet the needs of AI applications.In response to the massive data demands of AI applications, Silicon Motion leads innovation in storage technologies by upgrading NAND controller technology. Mr. Kou said that data application processes can be effectively optimized through hierarchical management and smart identification mechanisms. Flexible data placement (FDP) technology can also serve to improve efficiency and durability, while also offering the advantages of being low latency and low cost. For data security and reliability, the product also adopts advanced encryption standards and a tamper-proof hardware design. In combination with end-to-end data path protection mechanisms and Silicon Motion's proprietary NANDXtend™ technology, this enhances data integrity and prolongs the SSD's lifespan. In addition, Silicon Motion supports 2Tb QLC NAND and 6/8-Plane NAND, combining smart power management controllers (PMC) with advanced process technology to effectively reduce energy consumption while improving storage density.Not only that, it can also be paired with Silicon Motion's unique PerformaShape technology, which utilizes a multi-stage architecture algorithm to help optimize SSD performance based on user-defined QoS sets. Together, FDP and PerformaShape can not only help users effectively manage data and reduce latency, but also significantly improve overall performance by approximately 20-30%. These technologies are specifically suited for AI data pipelines in multi-tenant environments, including key stages such as the data ingestion, data preparation, model training, and inference processes.Creating Comprehensive Solutions to Realize Customer AI Applications Across Cloud and Edge ComputingIn response to data center and cloud storage needs, Silicon Motion has launched the world's first 128TB QLC PCIe Gen5 enterprise SSD reference design kit. By adopting the MonTitan SSD development platform, which comes equipped with an SM8366 controller, it is able to support PCIe Gen5 x4, NVMe 2.0, and OCP 2.5 standards. With a continuous read speed of over 14 Gb/s and a random access performance of over 3.3 million IOPS, it boasts a performance improvement of over 25%. This design is able to speed up training of large language models (LLM) and graph neural networks (GNN) while also reducing AI GPU energy consumption, allowing it to meet high-speed data processing demands.For edge storage solutions, Mr. Kou stated that the number of edge devices with AI capabilities will grow rapidly. He forecast: "The AI humanoid robot market will see explosive growth in the next 5 to 10 years." Systems at different levels have different storage requirements. For example, at the sensor level, data needs to be processed and filtered in real time to ensure accurate data sensing, while decision-making relies on multi-modal fusion reasoning, which entails more demanding storage performance and data integration capabilities. Meanwhile, at the execution level, various calibration parameters must be stored to enable the robot to act and think more similarly to humans. In response, Silicon Motion has actively deployed NVMe SSD, UFS, eMMC, and BGA SSD storage solutions, and values greater cross-industry collaboration to build a shared eco-system, in order to promote the further evolution of smart terminal storage technologies.Additionally, Silicon Motion has launched a variety of high-efficiency, low-power controller to meet the AI application needs of edge devices: The SM2508 PCIe Gen5 controller is designed for AI laptops and gaming consoles, featuring up to 50% lower power consumption compared to similar products. The SM2324 supports USB 4.0 high-speed portable storage devices up to 16TB in size. The SM2756 UFS 4.1 controller has a 65% higher power efficiency compared to UFS 3.1, providing an excellent storage experience for AI smartphones. In response to the urgent need for high-speed and high-capacity storage required for self-driving cars, Silicon Motion has also joined hands with global NAND manufacturers and module makers to jointly create storage solutions for smart automobiles."Storage technology undoubtedly acts as a core link in the AI ecosystem," emphasized Mr. Kou. Taiwan has a complete and highly integrated semiconductor and information and communications industry chain. It is capable not only of building AI servers, but also possesses great potential for promoting the development of AI applications. He believes that more practical AI edge computing devices and groundbreaking applications will be launched at a rapid pace in the future, and that storage solutions will face increasingly demanding requirements due to challenges in processing massive amounts of data. Silicon Motion will continue to use technological innovation as a driving force to actively support AI development.Mr. Kou expressed that the fast-paced development of generative AI has led to lower barriers to adoption for related applications. Silicon Motion aims to satisfy the market's needs through offering a diverse range of high-efficiency, low-power storage solutions.Photo: Silicon Motion Technology

Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip solutions. Founded in 2004, the company is headquartered in Shanghai, with operations and partnerships spanning key international markets. The company focuses on DRAM memory modules and data processing solutions for cloud computing and data center markets, addressing the soaring demand for high-bandwidth and large-capacity memory driven by artificial intelligence (AI) and enterprise workloads. Its product portfolio includes Memory Interface chips, Memory Module Controller ICs, PCIe Retimer chips, and more.Driven by the increasing demand for generative AI, machine learning, big data analytics, datacenter construction, one of the recent product development trends of Montage Technology is aiming the Compute Express Link® (CXL®) technology, which enables high-speed interconnect between CPUs and DRAM memory, addressing memory challenges by enhancing system performance, scalability, and cost-efficiency. Built on the PCIe physical layer, CXL introduces innovative capabilities such as DRAM memory expansion, sharing, pooling, and dynamic configuration, effectively eliminating traditional data processing bottlenecks in data-intensive systems and data center servers.In this interview, Geof Findley, World Wide VP of Sales & Business Development at Montage Technology, discusses the recent advancements in memory technologies aimed at increasing datacenter performance. Montage delivers versatile memory solutions that unlock next-gen memory bandwidth and performance, specifically tailored for AI and data-intensive workloads. These solutions are already in use by major global DRAM manufacturers and electronics OEMs/ODMs, underscoring strong partnerships with companies such as SK hynix, Samsung Electronics and Micron Technology.Credit: Montage TechnologySpecialty memory buffers and MRDIMM modulesWith more than 20 years of experience in memory products, the company maintains stable profits and proven track records. According to Findley, there are three key product lines driving growth for Montage, the first being specialty DRAM buffers. Montage started to develop its DRAM module buffer technologies very early. Given the buffer chip's critical role between the processor and DRAM memory, Montage collaborates with major CPU giants such as Intel and AMD, leading silicon IP vendors, as well as the world's top three memory manufacturers -- Micron, Samsung and SK hynix.Currently, Montage attributes its strong growth to the rapidly increasing demand for DDR5 memory used in data centers. Shipments of its DDR5 Registering Clock Driver (RCD) chips have grown substantially. Its 4th-gen DDR5 RCD chips deliver data rates of up to 7200 MT/s, a 50% increase over the 1st-gen products. Alongside its RCD portfolio, the company also provides DDR5 Data Buffers (DB) and other essential DDR5 module supporting chips like SPD EEPROM with Hubs, Temperature Sensors, and Power Management ICs.Considering the high throughput and low latency data processing use cases, MRDIMM (Multiplexed Rank Dual In-Line Memory Modules) are particularly useful to handle larger datasets such as large-scale databases, virtualization, and real-time analytic operations. In January 2025, Montage has successfully sampled its Gen2 Multiplexed Rank Registering Clock Driver (MRCD) and Multiplexed Rank Data Buffer (MDB) chipset to global leading memory manufacturers in South Korea, Japan and North America. These series IC solutions ensure interoperability and system-level performance for customers seeking to leverage the DDR5 MRDIMM Gen2 standard in high-throughput data-intensive applications. Montage's MRCD and MDB chips are fundamental to MRDIMM operationCredit: Montage TechnologyCXL adoption in data centers has moved from crawling to toddlingThe second product focus for Montage is CXL memory. CXL memory expansion is particularly valuable in scenarios where high DRAM capacity is required with only one DIMM per channel, or when servers lack available DIMM slots. Montage delivers the CXL Memory eXpander Controller (MXC) chips supporting the CXL 1.0, 2.0 and 3.1 specifications. These MXC chips comply with JEDEC specifications for both DDR4 and DDR5 memory. The mass-produced MXC Gen1 chips support CXL 2.0 with DDR4-3200/DDR5-5600, while the MXC Gen2 chips support CXL 2.0 and are compatible with DDR5-6400 memory.The development of CXL controllers is closely tied to PCIe interface technology. Current CXL 1.0 and 2.0 specifications primarily align with PCIe 5.0, while future CXL 3.x specifications are expected to align with PCIe 6.x to support even higher-speed memory channels. As memory pooling becomes more ambitious and widely adopted, the industry anticipates a surge in CXL deployment and volume scaling starting in 2026.The MXC product line is designed for use in Add-in Cards (AICs), backplanes or EDSFF memory modules to enable significant scalability in both memory capacity and bandwidth. Montage's MXC controllers are currently deployed by the world's top 3 memory manufacturers in E3.S form factor CXL memory modules. In parallel, Montage has launched several new product development projects in collaboration with Taiwan OEM/ODM partners. One such project involves working with a Taiwanese memory module manufacturer to develop CXL expansion card solutions. Another involves co-designing CXL memory AICs with major Taiwanese motherboard and server manufacturers, targeting OEM/ODM opportunities with global cloud data center providers.Credit: Montage TechnologyAs the second largest PCIe 5.0 and PCIe 4.0 Retimer supplierThe third product line for Montage is its Retimer chips, originally designed to enhance connectivity performance between GPUs, AI accelerators, CPUs, and other components within server systems. Retimer chips regenerate high-speed digital signals to extend reach and improve signal integrity in high-speed data processing systems. Currently, a typical AI server – often equipped with 8 GPUs -- requires 8 or even 16 PCIe 5.0 Retimer chips.Montage started delivering its PCIe 5.0/CXL 2.0 Retimer chips in January 2023, putting massive effort to extensive interoperability testing with a variety of compute, storage and networking components, such as CPUs, PCIe switches, SSDs, GPUs and NICs. As a result, Montage is now the second-largest PCIe 5.0 and PCIe 4.0 Retimer supplier globally and is dominating the market in China.Montage's Retimer chips are integrated into a variety of systems, including AI accelerator baseboards, server motherboards and riser cards. Montage is now providing the customer samples of its 16-lane PCIe 6.x/CXL 3.x Retimer chips as part of its new product roadmap.Activities in COMPUTEX Taipei 2025Montage has a global team of over 700 employees. During the trade show season and COMPUTEX Taipei 2025, Montage and its Taiwan partners will showcase a series of silicon products in a hotel suite showroom at the Place Taipei Hotel in the Nangang district. Findley describes this initiative as a strategic marketing campaign focused on highlighting the company's latest products -- including Retimer chips -- and introducing Montage brand to attract new customers from Taiwan's electronics supply chain and server manufacturing sector. In addition, the company will host advanced product training sessions to capture new business opportunities.AI applications are rapidly increasing in computational demands, doubling every few months, and now represent the primary driver of the PCIe roadmap–making PCIe Gen 6 a key requirement for the next generation of data centers. Meanwhile, CXL technology is reshaping the industry with its innovative memory architecture. Montage looks forward to working with Taiwan-based electronics OEMs/ODMs, server manufacturers and ecosystem partners to unlock the transformative potential of CXL technology and drive future success.

As Computex 2025 draws global attention to Taipei, IEI Integration Corp., in collaboration with QNAP Systems, Inc., will host its annual technology showcase, IEI Insight Days, from May 21 to 23 at POPOP Taipei. Designed for industry professionals, this three-day event focuses on actionable solutions in Industrial AI, resilient network infrastructure, and smart healthcare applications—bringing together real-world use cases, expert insights, and emerging technologies that address the evolving needs of edge computing and system integration.Hosted alongside Computex, this exclusive event by IEI and QNAP invites industry professionals to explore edge innovations in a relaxed and focused environment at POPOP Taipei.A Dedicated Experience Beyond the Show FloorLocated just one MRT stop from the Computex exhibition hall, POPOP Taipei offers a refreshing alternative to traditional trade show venues. Combining historical charm with modern design, the event space provides an ideal setting for relaxed yet focused dialogue. Whether you're exploring partnership opportunities, seeking insights on deployment strategies, or simply taking a break from the busy show floor, IEI Insight Days offers a curated environment to connect, learn, and exchange ideas.Event Highlights🔹 Focus Areas: Edge AI / Network Integration / AI-powered Healthcare 🔹 Showcase Solutions:  • Redundancy-enabled and Recovery-Ready Edge Platform  • Enterprise-grade networking infrastructure  • AI healthcare computing with real-time image processing and voice command capabilities 🔹 Networking Space: Open demo zones and seating areas designed for spontaneous technical conversations and business engagementIEI Insight Days is more than a product showcase — it's a hub for collaboration and conversation. We warmly welcome Computex attendees, industry partners, and decision-makers to stop by and engage with us. Dive into the latest trends in edge computing, network infrastructure, and medical AI.

In an era demanding ever-smaller, more efficient, and higher-performing light sources, particularly in the short-wave infrared (SWIR) spectrum crucial for telecom and advanced sensing, a quiet revolution is underway in integrated photonics. CoreOptics is at the forefront, pioneering a new generation of surface-emitting lasers at 1310nm that promise to overcome the limitations of traditional edge-emitting counterparts.For years, integrating lasers onto photonic integrated circuits (PICs) has been a complex dance of alignment and interconnection. Now, CoreOptics is changing the steps with its innovative SWIR high-power Continuous Wave (CW) surface-emitting laser. The secret? Its inherent surface emission capability, tailor-made for direct flip-chip integration. This seemingly simple shift unlocks a cascade of benefits, streamlining manufacturing and paving the way for unprecedented integration efficiency.Beyond the Edge: The Power of Surface EmissionThe limitations of conventional edge-emitting lasers in integrated systems are becoming increasingly apparent. CoreOptics is embracing a different paradigm: Horizontal Cavity Surface Emitting Lasers (HCSELs). Imagine an edge-emitting laser cleverly engineered with a turning mirror, redirecting its light output perpendicular to the semiconductor wafer's surface. This ingenious design allows for packaging reminiscent of familiar Vertical Cavity Surface Emitting Lasers (VCSELs) or LEDs, but with distinct advantages.HCSELs offer a compelling alternative, most notably enabling wafer-scale testing. This fundamental shift in manufacturing allows for rigorous quality control at an early stage, translating to lower production costs and significantly higher throughput.But the benefits don't stop there. Surface emission inherently delivers:• Superior Grating Coupling: Resulting in significantly better grating coupling efficiency into the PIC.• Ultra-Compact Footprint: A crucial factor in the relentless drive towards miniaturization of integrated systems, allowing for denser and more powerful PICs.• Untapped Potential: Opening doors to the creation of higher power and more complex integrated light sources, pushing the boundaries of what's possible on a chip.CoreOptics' Innovation: SWIR PowerhouseAt the heart of CoreOptics' advancement lies its novel 1310nm (FP/DFB)high-power CW surface-emitting laser design. Leveraging advanced InP-based alloys and a meticulously optimized layered epitaxial structure, this laser is engineered for peak performance in the SWIR region.Key to its integration prowess are its innovative design features, including:• AR/HR Wafer-Level Coating: Enhancing optical performance and simplifying the manufacturing process.• Etched Facet (Mirror) and 45-Degree Reflector: Precisely engineered for efficient light extraction and surface emission. These features streamline production and contribute directly to the laser's superior performance and seamless integration capabilities.Flip the Chip, Transform the IntegrationThe true magic unfolds with direct flip-chip integration onto PICs. This technique involves attaching the laser die directly onto the PIC substrate, "face down." It's a seemingly small change with profound implications.By embracing flip-chip bonding, CoreOptics is effectively bypassing the complexities of traditional wire bonding and intricate packaging steps, leading to a new era of integration efficiency characterized by:• Lightning-Fast Electrical Paths: Shorter pathways translate directly to higher speed operation and pristine signal integrity – critical for high-bandwidth applications.• Unprecedented Compactness: The elimination of bulky interconnects results in a significantly smaller overall footprint for the integrated laser-PIC module, paving the way for truly miniaturized devices.• Pinpoint Optical Alignment: The direct and meticulously controlled bonding process ensures precise and stable optical grating coupling between the laser and the PIC waveguide, maximizing efficiency and reliability.SWIR HCSELs: SWIR Horizontal Cavity Surface Emitting Lasers Credit: CoreOpticsSimplifying the package: Less is moreThe elegance of flip-chip integration extends to packaging. By directly bonding the laser, CoreOptics is drastically reducing the need for intermediate components and connections for both electrical and optical interfacing. This simplification translates to:• Fewer Interconnects, Higher Reliability: Eliminating potential points of failure leads to more robust and dependable integrated devices.• Streamlined Assembly: The direct bonding process simplifies the manufacturing flow, potentially lowering assembly costs and boosting overall reliability.• Smaller and Lighter Packages: A crucial advantage for applications where size and weight are at a premium, such as portable sensing devices and wearable technology.A Spectrum of Possibilities: Applications UnleashedThe unique advantages of CoreOptics' integrated SWIR HCSEL laser solution are poised to revolutionize a wide array of applications, including:• High-Speed Optical Communication: Enabling next-generation on-chip interconnects and ultra-compact silicon photonics transceivers.• Advanced Sensing: Powering integrated LiDAR systems for autonomous vehicles and robotics, as well as compact gas sensing platforms.• The Smart Revolution: Enabling under-display proximity sensing in smartphones and other consumer electronics.• Miniature Analytical Instruments: Facilitating the development of compact spectroscopy devices for on-the-go analysis.• Next-Gen Medical Diagnostics: Enabling the creation of sophisticated lab-on-a-chip devices for SWIR imaging and advanced biosensing.Expanding the Horizon: 1460nm and BeyondCoreOptics isn't stopping at 1310nm. Their development of surface-emitting SWIR lasers at 1460nm further expands their reach. This wavelength offers its own set of compelling advantages, including low water absorption for long-distance fiber optic communication and high modulation capability for advanced data transmission and sensing. Potential applications span telecommunications, cutting-edge medical sensing and imaging (think non-invasive skin and glucose sensors), and precision industrial and environmental monitoring.Illuminating New Paths: Resolight RCLEDsComplementing their laser portfolio, CoreOptics also offers Resolight Resonant-Cavity Light-Emitting Diodes (RCLEDs) across a broad spectrum from 400nm to 1550nm. These aren't your average LEDs. Their resonant cavity structure dramatically enhances optical confinement, resulting in:• Highly Directional Emission: Focusing light along a specific axis, unlike the omnidirectional output of standard LEDs.• Small Divergence Angle: Enabling excellent beam collimation, minimizing light spread.• Exceptional Color Purity: The resonant cavity acts as a filter, suppressing unwanted spectral leakage for a purer monochromatic output.• Narrow Spectral Width: Achieving Full-Width at Half Maximum (FWHM) values between 10-20nm, significantly narrower than conventional LEDs.• Robust Operation: Withstanding a wide temperature range of -40 to 85 degrees Celsius.These enhanced characteristics make Resolight RCLEDs ideal for applications ranging from short-reach optical communication and high-resolution displays to the burgeoning field of visible light communication (VLC), precise optical sensing and scanning, and advanced medical and cosmetic devices.Tailored Solutions: Design Flexibility at its CoreRecognizing the diverse needs of their clientele, CoreOptics leverages its unique HCSEL platform to offer customized solutions. By precisely engineering the reflector angle based on the specific grating angles of the PIC, they can optimize performance for individual customer requirements.CoreOptics' the feature product lines, encompassing a wide range of Horizontal Cavity Surface Emitting Lasers (HCSELs) and high-performance Resonant Cavity LEDs (ResoLight), position them as a key innovator in the rapidly evolving landscape of integrated photonics.As the demand for compact, efficient, and high-performance light sources continues to surge, CoreOptics' pioneering work in surface-emitting lasers and their seamless integration onto PICs is poised to revolutionize industries and unlock a new era of photonic innovation.

MSI, a global leader in gaming and high-performance computing, announces the launch of its comprehensive AIoT solution lineup at COMPUTEX 2025, featuring AI servers, AI supercomputers, smart energy, industrial PCs, and intelligent transportation systems. The showcase extends beyond core AI computing to system integration, hardware innovation, and cross-domain applications—demonstrating MSI's leadership as a provider of AI-driven and high-performance technologies for next-generation industries."AI is no longer just a trend—it is a critical engine driving industrial intelligence," said Sam Chern, MSI Vice President of Marketing."With deep hardware R&D capabilities and a strong focus on high-performance and AI-integrated systems, MSI is expanding its reach from data centers to the edge, from energy management to smart manufacturing. Through this showcase, we hope to present our vision for a smarter, cross-domain technology future.Product Highlights�UAI Servers × Cloud InfrastructureFull-Rack IntegrationMSI presents turnkey rack-level infrastructure, including 19" EIA, 21" OCP ORv3, and NVIDIA MGX AI racks.• The EIA rack targets dense compute environments such as private clouds and virtualization.• The OCP ORv3 rack features an open 21" chassis with 48V power delivery and OpenBMC support for hyperscale data centers.• The AI rack, aligned with NVIDIA's reference architecture, supports MGX modular systems and NVIDIA Spectrum™-X networking, enabling multi-node GPU scaling for AI training and inference. All racks are deployment-ready and thermally optimized.Core and Open Compute ServersMSI expands its DC-MHS modular server lineup with AMD-based CD270-S4051-X4/X2, CD281-S4051-X2 (compliance with the ORv3 standard) and Intel-based CD270-S3061-X4/X2, CD270-S3071-X2. All systems feature 2U4N or 2U2N form factors, PCIe Gen5, DDR5, and support up to 12 NVMe drives and 16 DIMM slots per node—designed for modular, high-density, and I/O-optimized cloud workloads.Credit: MSIAI Platforms & DGX StationMSI introduces MGX GPU servers for AI workloads:• CG480-S5063 (Intel) and CG480-S6053 (AMD) support 8 FHFL dual-width PCIe 5.0 GPUs, 32 DDR5 DIMMs, and up to 20 E1.S NVMe bays (Intel).• The CG290-S3063 (2U) supports 4 FHFL dual-width GPU and 16 DDR5 DIMMs slots in a compact design, ideal for edge inferencing and lightweight AI training.• The CT60-S8060 DGX Station, based on NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip, delivers up to 20 PFLOPS of AI performance, 784GB of unified memory, and up to 800Gb/s networking—tailored for on-prem training, distributed inference, and collaborative R&D.Enterprise PlatformsMSI delivers complete solutions across DC-MHS and standard architectures:• DC-MHS platforms include CX270, CX171, CX271 series servers and HPMs such as D3066, D4056.• General-purpose systems include the S2206 (dual-socket AMD EPYC) and CS280-S3065 (Intel Xeon 6, 2U 24-bay storage).• Standard motherboards span ATX and uATX form factors, supporting Intel Xeon 6 and AMD EPYC 9005/8004/4005 processors—designed for scalable cloud, virtualization, and storage deployments.Credit: MSIIndustrial PCs × Rugged TabletsMSI debuts the EdgeXpert MS-C931, a desktop AI supercomputer built on the NVIDIA DGXTM Spark platform.Powered by the NVIDIA GB10 Grace Blackwell Superchip, it delivers 1000 AI TOPS FP4, 128GB unified memory, and ConnectX-7 networking—ideal for developers in education, finance, and healthcare sectors.Also introduced are three software tools:• MSI SysLink: Remote device management• MSI ScreenLink: EDID Lock for digital signage• MSI AI SmartLink: Seamless integration with large language modelsThese tools complement MSI's full line of Box PCs and embedded boards, designed for next-generation AI and industrial automation.MSI debuts two new rugged tablet models—the NB41 and NE21—designed to meet the demanding requirements of field workers and industrial environments.• NB41 features an 8-inch display and is equipped with an Intel Alder Lake-N processor. It is MIL-STD 810G validated, drop-tested to 1.5 meters, and rated IP65 for dust and water resistance. It supports Wi-Fi 6E, Bluetooth 5.3, and offers a 7-hour battery life with hot-swappable capability, ensuring continuous operation in mission-critical scenarios.• NE21 is an 11.6-inch model powered by a 13th Gen Intel Raptor Lake Core i processor. It features an 800-nit sunlight-readable LCD, IP65 water/dust protection, MIL-STD 810G test criteria, and 4G LTE support. With a 7.5-hour battery, it is ideal for field deployments requiring extended mobile connectivity.Both tablets support a range of accessories, including shoulder straps, hand grips, styluses, and tablet stands—providing ergonomic flexibility and operational durability for warehouse, logistics, manufacturing, and utility applications.EV Charging × Smart EnergyMSI EZgo Portable EV ChargerMSI EZgo supports up to 11kW output and features a lightweight and portable design, and IP66 waterproof/dustproof housing, which is ideal for convenient charging during travel and at home. Replaceable adapters support international standards (US/EU/TW/JP/KR/AU/Industrial), and it is UL2263 and UL817 certified. Built-in 1.8" display and Bluetooth app enhance user control. It withstands up to 2-ton enclosure weight and 20-ton cable crush force, and includes warranty and insurance support.MSI Hyper 80 DualDesigned for commercial locations with 1–2 hour parking durations, such as shopping malls, restaurants, and cinemas, the ultra-slim 80kW dual-gun DC fast charger measures just 30cm thick. With ISO 15118 and DIN 70121 support, Plug & Charge, and dynamic power distribution, it is optimized for urban and commercial charging environments. Its overhead cable management system reduces wear and extends service life.MSI EV/Eco Series & eConnect System (EMS)These residential/commercial units feature solar-ready integration, 13kW (single-phase) or 22kW (three-phase) output, and AI license plate recognition. The eConnect system (EMS) offers real-time visibility, remote control, dynamic load balancing, and multi-user billing via a user-friendly interface—recipient of the iF Design Award.Autonomous Mobile Robots (AMRs) × Smart ManufacturingMSI will highlight its latest AI-powered Autonomous Mobile Robots (AMRs) built for smart manufacturing and warehouse automation. Built on NVIDIA Jetson Orin Nano system-on-modules, NVIDIA Isaac robotics platform, and NVIDIA Omniverse, MSI AMRs enable real-time navigation, intelligent fleet coordination, and digital twin simulation.MSI will showcase two flagship AMR models, each tailored for different smart factory needs:• AMR-AI-Cobot Pro: Robotic arm with AI vision for precise material handling and assembly• AMR-AI-Base Robot: Intelligent delivery and sorting solution for automated warehouse operationsBoth models integrate advanced features such as LiDAR-based SLAM, AI-driven motion planning, and energy-efficient battery management—helping factories improve efficiency, reduce costs, and scale operations.MSI unveils its latest AMRs powered by NVIDIA Jetson Orin Nano, Isaac robotics platform, and NVIDIA Omniverse.Smart Transportation – Fleet Management SolutionsMSI is expanding into smart transportation with a diverse range of fleet management products. The product line includes fleet management tablets, telematic boxes with license plate and object recognition function, and smart rearview mirrors. Powered by edge computing and AI-driven image analysis, MSI helps logistics and commercial fleets enhance operational efficiency and safety on the road.Smart Office – AI Video Conference SystemMSI's new Smart Office solution features an all-in-one AI-powered video conference bar with 4K video, auto-tracking, voice enhancement, ANC, and AGC for clear communication. Paired with a 360-degree conference camera and control panel, it enables seamless collaboration across meeting room setups and remote teams.Exhibition InfoLocation: Booth J0506, Hall 1, Taipei Nangang Exhibition Center📅 Dates: May 20–23, 2025MSI AIoT: https://www.msi.com/to/aiotMSI AIoT Facebook: https://www.facebook.com/MSIAIoTMSI AIoT LinkedIn: https://www.linkedin.com/showcase/msi-aiotMSI Global YouTube: https://www.youtube.com/user/MSISubscribe to MSI RSS Feeds via https://www.msi.com/rss for real-time news and more product info.About MSI AIoTMSI integrated server in conformity to the cloud idea, satisfy the needs of customers in industrial computers, introduced robots for AI living and realized automotive electronics with human technology to provide the optimum solution of AIoT. It is also a leading brand in AI, business, and IoT market. For more product information, please go to https://www.msi.com/to/aiot

Pegatron Corporation, a global leader in design and manufacturing services (DMS), today announces its inaugural appearance at Computex 2025. The event will be held from May 20 to 23 at the Taipei Nangang Exhibition Center. Presenting its vision as a "TECH MAKER," Pegatron will demonstrate its unwavering commitment to technological research and development (R&D) and leading innovation.At this year's exhibition, Pegatron will feature four major thematic zones under the "TECH" banner, comprehensively showcasing the company's latest achievements and solutions in high-performance AI computing, E-mobility, next-generation communication, beauty technology, and living assistance. These displays will further underscore Pegatron's vision and strength as a "TECH MAKER."High-performance AI computingPegatron is proud to unveil its next-generation, ultra-high-density rack solutions, meticulously engineered to support the most demanding AI, HPC, and data center workloads. Featuring a flexible architecture, these platforms now feature support for the latest NVIDIA GB300 NVL72, NVIDIA HGX™ B300, and AMD Instinct™ Series GPUs, delivering exceptional compute density and scalability. This architecture empowers enterprises to accelerate AI model training and inference while maintaining optimal performance across diverse and evolving workloads.Expanding compute flexibility, Pegatron introduces the AI GPU server AS205-2T1 and general-purpose server GS202-2T1, featuring Intel® Xeon® 6 processors and support with SMART Modular Technologies add-in cards (AIC) for CXL (Compute Express Link) memory expansion to enable enhanced bandwidth and dynamic memory pooling.To effectively manage the heat generated by these high-performance components, Pegatron offers a range of advanced liquid cooling solutions. These include in-rack Coolant Distribution Units (CDUs), Rear Door Heat Exchangers (RDHx), and full immersion tank cooling—each designed to optimize thermal efficiency, reduce energy consumption, and enable sustained performance in high-density environments.Pegatron's layout in the AI field extends beyond hardware, encompassing its self-developed digital twin platform, PEGAVERSE, and AI platform, PEGAAi. Through these two platforms, enterprises can enhance their autonomous operation capabilities and respond more agilely to industry changes. PEGAVERSE assists companies in building digital twin models to simulate and predict real-world behaviors, while PEGAAi provides powerful AI capabilities to help businesses make more informed decisions.By integrating innovative technologies, enterprises can achieve more efficient operations and better decision-making. The combination of digital twins and artificial intelligence helps companies maintain a competitive edge, especially in rapidly changing business environments. Pegatron enables businesses to establish a more agile and efficient operational system, thereby maintaining a leading position in the ever-changing world.E-mobility & Car computingPegatron Automotive Electronics anchors its strategy in the development and integration of advanced automotive electronics, delivering extensive end-to-end solutions to its automotive customers through robust manufacturing capabilities and agile supply chain management.Amid the rapid industry shift toward intelligent, electrified, and software-defined vehicles, Pegatron is re-architecting its Electrical/Electronic Architecture (EEA) to establish a platform that is highly integrated, modular, and scalable. The company's latest vehicle EEA solutions—including zonal controllers and a scalable central computing rack (SCCR)—reinforce its engineering leadership and readiness for next-generation automotive innovation.Telecommunication & network solutionsPegatron's Communication Products Business Group is set to showcase a comprehensive portfolio of networking solutions, engineered to bolster enterprise digital resilience. A key highlight will be the "Exhibition Hall Rapid Deployment Business Model," an innovative 5G private network solution that integrates O-RAN architecture with Fixed Wireless Access (FWA) devices. This system facilitates high-speed, flexible deployment and real-time live streaming, concurrently supporting crowd analytics and content broadcasting to optimize exhibition effectiveness.Further demonstrating its leadership in connectivity, Pegatron will present the BE19000 tri-band Wi-Fi 7 router. This advanced router supports Multi-Link Operation (MLO) technology, delivering total data rates of up to 19Gbps, and is adeptly designed for 8K streaming and robust multiple device connections. In addition, an AI-integrated 5G smart surveillance solution, featuring the Nura 4K camera and MG54AX router, provides real-time detection of incidents such as falls and unauthorized intrusion, rendering it high suitable for both residential and public area security applications.In the domain of 5G infrastructure, Pegatron will display two all-in-one gNB Small Cells: the outdoor PS2400 and indoor PS1400. These units adeptly integrate Radio Unit (RU), Distributed Unit (DU), and Central Unit (CU) functionalities, thereby simplifying deployment and supporting 128 to 256 user connections. This makes them the ideal solution for Small and Medium-sized Enterprises (SMEs) and diverse edge computing scenarios.The PR1450 series, specifically designed for seamless indoor 5G connectivity, will also be prominently featured. This 5G FR1 4T4R O-RU is compliant with 3GPP Rel-16. It delivers ultra-reliable low-latency communications (URLLC) micro-slot, provides optimized bandwidth utilization, ensures lower power consumption, and operates effectively across a wide temperature range. These advanced capabilities make the PR1450 series exceptionally well-suited for demanding environments, such as warehouses, showcasing Pegatron's strong steadfast commitment to providing its customers with leading-edge technology and applications within the 5G landscape.Consumer, aesthetic & assisted livingResponding to the burgeoning global beauty technology market, Pegatron is set to introduce the "PRIIö" home beauty device, underscoring its robust R&D and manufacturing capabilities and its strategic initiative to penetrate the high-potential skincare market.Leveraging its leading position in electronic product manufacturing and precision assembly, Pegatron integrates advanced technologies such as Elastic RF, Lifting Microcurrent (EMS), Ion Import/Export (ION), Enrichment Pulse (E-Pulse), Fine Light Therapy (LED MATRIX), and Rapid Cooling into the PRIIö product. This integration offers users a professional-grade skincare experience at home. The launch of PRIIö will not only strengthen Pegatron's presence in smart living and health technology but will also provide consumers with efficient, safe, and user-friendly home beauty solutions.In response to the escalating consumer appetite for premium home beauty solutions, Pegatron will further bolster its investment in R&D resources, driving innovation in beauty technology and aiming to become a key force in shaping future beauty tech trends.Pegatron has also actively expanded into the health assistance sector, demonstrating its commitment to technological innovation and social responsibility. In 2024, the company initiated its ''retinal projection device project,'' aiming to leverage cutting-edge technology to improve the quality of life for individuals with low vision, empowering them to rediscover the visual world. This initiative extends beyond a mere technological breakthrough—it embodies a profound commitment to social responsibility. Through close collaboration with experts and end-users, the design team is dedicated to creating a product that genuinely transforms the lives of individuals with visual impairments. Pegatron firmly believes that the true value of technology lies in its capacity to instill hope and drive positive change for everyone.As part of its ongoing ESG commitment, Pegatron aspires to be a leader in socially responsible innovation, ensuring that its technology serves as a force for compassion and inclusivity. The realization of this retinal projection device marks not only a milestone in technological innovation but also a powerful promise to equality and care.Pegatron cordially invites all sectors to visit us at Computex 2025, Booth L0118, to experience its latest achievements in technological innovation and explore the infinite possibilities of future technology together.Pegatron Corporation Website: https://www.pegatroncorp.com/Pegatron SVR Website: https://svr.pegatroncorp.com/Pegatron 5G Website: https://5g.pegatroncorp.com/

The global leading brand of standard power supplies, MEAN WELL, has over 40 years of experience in the power industry and has accumulated five core values including brand, distribution channels, computerization, innovation, and global certification. During Computex 2025, the company showcased its leading position in global power solutions with the theme of "Multi-Industry, One Stop Shopping". Frank Chen, the Product Manager at the Product Strategy Center, stated that MEAN WELL combined offline physical exhibitions with virtual EXPO model selection tools this year to create a platform that integrated virtual and physical experiences, providing smooth and convenient product integration experiences.Creating Seamless Integration from Model Selection to Application through the Integration of Virtual and Physical Experiences on the EXPO PlatformMEAN WELL's online EXPO divided the product lines into 12 major exhibition halls to provide diverse selections and quick model selection. Halls A1~B4 covered various power supplies from 0.5W to 285KW that can meet the different power and installation needs. Halls C1~C4 provided components and accessories, batteries, cabinets, MPPT controllers, microinverters, and products related to green energy, energy-saving, and energy storage, combined with certification and technical services to provide comprehensive one-stop system power and energy storage system solutions. Exhibits of actual machines such as microinverters, portable energy storage, smart lighting, and solar power systems were specially arranged at the COMPUTEX exhibition booth and were combined with the localized application demonstration cases created by the dealer to realize "visualizable" and "implementable" application scenarios. Frank Chen stated that MEAN WELL emphasized planned production and adequate inventory management in particular, and products can be quickly supplied even if ordered in small quantities to meet the customer's spot needs. This exhibition mode of integrating virtual and physical experiences not only improves experiences, but can also shorten the conversion time from product model selection to actual application. It also allows customers who cannot personally arrive at the exhibition site to grasp the latest product dynamics and quickly select models through the official website or mobile APP, fully demonstrating the core value of "One Stop Shopping".XDR/XTR Series DIN Rail Power Supply - A New Benchmark in Industrial Control Standards: Cost-Effective, Ultra-Slim, and MiniaturizedThe XDR-E/XDR/XTR series DIN rail power supply is one of the key new products featured in the exhibition this time. Its biggest highlight is the innovative technologies in high efficiency and miniaturization. The three major series cover power ranges from 75W ~ 960W, meeting diverse application needs. Two levels are planned for the single-phase input: The XDR-E series is balanced in performance and price and has an input range of 85~264Vac, and its conversion efficiency is as high as 96%. Not only does it solve the problem of high internal temperature, but its case size is also reduced significantly by 23% ~ 45% (varies according to the model) due to its efficient circuitry, effectively saving installation space on the system side. The XDR-E series can even integrate the previous generations of SDR, NDR, and EDR into one model to simplify the product model number, and help customers select models quickly.As for the high-end flagship XDR series, it is based on the XDR-E series and further upgraded. It is targeted to customers with the need for a wider input voltage range from 85~305VAC, supports high instantaneous load capacities up to 200% power and 600% current, MODBus communication function, -40~+85�J ultra-wide operating temperature, explosion-proof/ship class/semiconductor equipment certification and 5-year long-term warranty, etc. In addition, in response to the application needs of three-phase 320~600Vac input voltage, we also launched the new next-generation XTR series 240W ~ 960W. In terms of positioning and specification functions, it is at the same level as the high-end flagship XDR series and also provides excellent performance and the 5-year long-term warranty that is rare on the market, providing more durable, safe, and secure selections for industrial equipment!LOP Series Board-Mounted Power Supply with Four-in-One Regulatory Compliance, Multiple Global Certifications and Simplified System Development Processes to Accelerate Time-to-MarketThe LOP series is the latest ultra-low-profile board-mounted power supply launched by MEAN WELL. It adopts two standard size designs of 4"x2" and 5"x3", with energy efficiency up to 95%. Its standout feature is that it has passed the four-in-one regulatory compliance that is very rare in the market. One unit can cover a wide range of application fields including information, industrial, home appliance and lighting, and it is certified in multiple countries. It can reduce development and verification costs of the system, and simplifies system development processes significantly. Another big highlight is its 150% instantaneous high-load capability, allowing motors or inductive loads to operate smoothly as soon as they start up, improving system stability effectively. In addition, various output voltage selections are also planned for this product family, including 12V, 15V, 18V, 24V, 27V, 36V, 48V and 54V, able to meet the needs of various equipment. Other features include an ultra-slim design of 1" to 1.3" (depending on the model), a wide operation temperature range from -30~+80�J, and the ability to function at altitudes of 5,000 meters. It is suitable for all parts of the world and various environmental conditions. Common applications include: medical testing equipment, projectors, industrial instruments, foot massage machines and coffee machines, and more.The NGE Series Crosses into the Consumer Market: From Industrial Power to Mobile Quick-ChargeThe NGE series power adapter and quick-charge product is MEAN WELL's strategic layout of crossing into the consumer market from industrial power. It aims to build a second growth curve through this and form joint ventures and alliances with upstream and downstream manufacturers to build an industrial value market. This series includes two major production lines, NGE30 and NGE100, that cover complete power ranges from 12W to 90W. The NGE30 series continues the professional genes of MEAN WELL, and is designed for industrial and professional applications. It supports use under rigorous environments from -30~+70�J, and has four major safety certifications including information and communication, medical, home appliance and industry. It also provides plug versions for many countries including US, EU, UK and AU, and a three-year warranty to ensure safe usage. The NGE100 series, on the other hand, is MEAN WELL's first masterpiece for entering the consumer market. It is a 100W dual USB-C PD quick-charge designed specifically for mobile devices that is equipped with the USB PD 3.1 protocol, supports a maximum of 100W output on a single port, uses environmentally friendly all-paper packaging to echo the concept of sustainability, and has been proactively prepared for EU's unified USB-C specification policy set to take effect by the end of 2024.The NTN-5K Off-Grid Inverter is an All-in-One Unit with Bidirectional Functions for Both Charging and InversionNTN-5K is the latest off-grid industrial inverter launched by MEAN WELL; it integrates AC-DC charging and DC-AC inversion bidirectional functions into a single device. It is designed with the standard 2U rack-mount chassis so that it can be quickly assembled and connected when installed in standard 19-inch cabinets. The product supports multi-unit parallel output, and the AC output can be expanded from a single unit of 5KW to 30KW, with three units forming a three-phase four-wire power system. This series supports the optional CMU2E and CM2E-R multi-industry smart controller that can be seamlessly integrated into solar power management systems or energy management platforms. The entire unit is designed and made in Taiwan, and is equipped with UPS, steady output and intelligent switching functions to ensure reliable operation for long periods of time. Typical application scenarios include power supply in fields such as remote mountain areas, off-grid locations, or offshore construction sites; residential and commercial backup power during disasters such as earthquakes and typhoons; complete ESS systems when used in conjunction with solar panels and batteries; as well as mobile power vehicles for disaster prevention and emergency rescue. MEAN WELL is currently developing the "off-grid + on-grid all-in-one hybrid system" NTG-7K5/20K series that have higher power and more advanced functions. It can cover an even broader range of applications, especially in fields such as residential energy storage and industrial/commercial energy storage, and it can also be used with solar-powered renewable energy systems to realize diverse applications such as self-generation and self-consumption, peak shaving, electricity price shifting, and feed excessive power back into the grid for electricity sales.In the future, it will be integrated with production lines such as BIC and NTS to build complete industrial-grade energy-saving and carbon-reduction power solutions to further deepen the integration of renewable energy, and help users realize the "Three Energy" goal of energy-saving, energy creation,n and smart management.Meeting ESG Practices and Energy Transformation: Comprehensive Layout from Carbon Footprint to Green Energy SystemsThe Section Manager of the Technical Service Center, Tony Hsieh, stated that MEAN WELL had officially launched the carbon footprint platform in December of 2023, and is working towards the goal of carbon neutrality along with its supply chain partners. Its product development strategies focus on four major aspects: the integration of high efficiency and low power consumption, miniaturized carbon reduction, environmentally friendly packaging, and power recycling functions. The company also launched the "distributor demonstration site program" and built localized energy application demonstrations all over Taiwan to cultivate a system-integrated ecosystem, allowing customers to understand the integration and application of our products intuitively through on-site scenario navigation. Looking into the future, MEAN WELL will continue to deepen its product layout, promote cloud-based model selection and the virtual/physical integrated one-stop shopping experience, and use the locally designed and manufactured advantage to build an international power system brand in the green energy transformation trend, and actively strive to become a century-old benchmark enterprise in the global standard power supply industry.MEAN WELL showcased compact and high-efficiency power products integrated with the "Multi-Industry x One Stop Shopping" strategy to meet AI and ESG power requirements comprehensively.

COMPUTEX Taipei 2025 will be held from May 20th to 23rd at the Taipei Nangang Exhibition Center. KIOXIA Taiwan will showcase its latest flash memory technologies and solid-state drive (SSD) solutions at booth X0001 on the 3rd floor of Hall 2 in the Semiconductor & Hospitality Suites.The exhibit will feature not only KIOXIA products and solutions but also collaborative solutions to show KIOXIA's prominent position in the industry and the AI-driven era. Visitors can expect a range of exciting breakthroughs and technologies.Memory Solution FrontierAs the AI Era is moving forward rapidly, and all kinds of applications are being deployed, more and more data will be generated, and flash memory is playing an increasingly critical role.KIOXIA, with a comprehensive portfolio of flash memory products and SSD solutions, the development of its flash memory technology has become more significant. KIOXIA's progressing flash memory technology will be brought to the visitors' eyes, including the innovative CMOS directly Bonded to Array (CBA) architecture featured in BiCS FLASHTM generation 8.Business SSD SolutionsData generation and preservation are now essential across a wide range of applications since it is the foundation of any kind of application and scenario. KIOXIA's SSD continues to evolve to meet the demands. KIOXIA will present visitors with the latest development* in the Flagship Enterprise Grade SSD product line – the KIOXIA LC9 Series SSD.*It is still under development.KIOXIA LC9 Series SSD is a 122.88 terabyte (TB) NVMe SSD in a 2.5-inch form factor and the first SSD built with the company's BiCS FLASH generation 8 3D flash memory technology 2 terabit (Tb) QLC die. KIOXIA LC9 Series SSD is designed for generative AI applications as it's built for high capacity and provides an interface designed with PCIe 5.0 technology with dual-port capability for fault tolerance or connectivity to multiple computing systems. The KIOXIA LC9 Series SSD also complements the recently announced KIOXIA AiSAQ technology, which enhances scalable RAG (Retrieval Augmented Generation) performance by storing vector database elements on SSDs instead of DRAM.Nimbus Innovation Award 2025 winner – together with its partners, KIOXIA's broadband SSD with an optical interface (Broadband Optical SSD) will also be showcased at the booth with its latest development of functional operation with the high-speed PCIe 5.0 interface. In next-generation green data centers, as an option besides the electrical wiring, interface using optical and broadband optical SSD significantly increases the physical distance between essential components, e.g., CPU and SSDs, while maintaining energy efficiency and high signal quality. It also contributes to the flexibility and efficiency of data center system design, where digital diversification and the evolution of generative AI require complex, high-volume, high-speed data processing.Personal Memory SolutionsWhile enhancing industry advancements, KIOXIA is also committed to empowering personal users to create unforgettable memories in all aspects of daily life. In the personal internal SSD segment, KIOXIA will show the latest mainstream PCIe Gen5 SSD, the EXCERIA PLUS G4 Series delivering read speeds of up to 10,000MB/s. It strikes a balance between high performance, power efficiency, and affordability — appropriate for consumers upgrading to next-gen platforms.The Red Dot Design Award 2025 and the Good Design Award 2024 winner, the KIOXIA EXCERIA PLUS G2 Portable SSD Series, will also be appearing at the KIOXIA booth. It features a compact, elegant, and portable design that is appropriate for on-the-go users while maintaining performance and efficiency of heat dissipation.Furthermore, for microSD memory card solutions, KIOXIA is currently developing products that support faster data transfer speed modes. EXCERIA G3 and EXCERIA PLUS G3 microSD memory cards are expected to be the first ones to support faster data transfer speed. They significantly reduce data transfer times and are expected to debut alongside new compatible card readers. More information will be revealed onsite.A Collaborative EcosystemAdditionally, several leading ecosystem partners will jointly showcase their systems that are compatible with KIOXIA products at the booth to provide visitors with a comprehensive understanding of the vital role of KIOXIA's advanced technologies in today's AI and large-scale computing demands. As one of the leading manufacturers in the flash memory technology field, KIOXIA remains committed to advancing performance and delivering stable, reliable flash memory solutions.At COMPUTEX 2025, step in and discover KIOXIA's latest product breakthroughs and collaborative innovations designed to meet the demands of the rapidly evolving computing era.Join and witness the sparks of the future — Make It with KIOXIA!Notes*2.5-inch indicates the form factor of the SSD and not its physical size.*Definition of capacity: Kioxia Corporation defines a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.*NVMe and NVMe-MI are registered or unregistered trademarks of NVM Express, Inc. in the United States and other countries.*PCIe is a registered trademark of PCI-SIG.*Other company names, product names, and service names may be trademarks of third-party companies.*Information in this document, including product prices and specifications, content of services, and contact information, is correct on the date of the announcement but is subject to change without prior notice.It's a new beginning with KIOXIAKIOXIA LC9 Series SSD

As wireless communication technology accelerates, Wi-Fi 7 is rapidly entering the consumer market, while the potential of Wi-Fi 8 continues to draw attention. With over 15 years of deep expertise in the networking and telecommunications industry, Lynwave Technology has built a solid foundation in antenna, thermal, and mainboard integration—(Power & Signal integrity, as known as "PI & SI"). Through its proprietary ATM (Antenna, Thermal, Mainboard) solutions, the company delivers high-performance services tailored to global customer demands.In an exclusive interview with DIGITIMES, General Manager Dallas Wu shared insights on emerging technology trends and Lynwave's highlights for the upcoming Computex 2025.Deep Roots in Networking and Trusted by Global Brands"Since our founding in 2009, Lynwave has remained dedicated to wireless communication technologies," said Wu. "Our antenna design solutions have been adopted by leading U.S. brands and major Japanese manufacturers. Each year, we undertake more than 200 ODM projects, with thousands of successful cases under our belt. This wealth of experience makes our solutions highly competitive and reliable."ATM Integration Takes Center Stage at Computex 2025At Computex 2025, Lynwave will spotlight its hallmark ATM solutions—demonstrating how the integration of antennas, thermal systems, and mainboards(PI&SI) can significantly enhance the performance and reliability of networking devices."Our comprehensive services not only improve signal quality but also address thermal management and circuit integration challenges," Wu explained. "This helps clients avoid the coordination hassles often encountered when working with multiple vendors."The company will also unveil its next-generation Wi-Fi 8 intelligent antenna concepts, engineered to meet the high-bandwidth demands of the AI era. From smart manufacturing and smart cities to automotive connectivity, Lynwave's technology is built to maximize customer value across applications.Global Manufacturing Support from VietnamTo further strengthen its global capabilities, Lynwave established a new assembly and testing facility in Vinh Phuc, Vietnam in 2023. Certified with ISO and in the process of obtaining RBA certification, the plant ensures consistent production quality and supply chain stability."Our goal is to help clients around the world gain faster and more efficient access to premium networking solutions," said Wu.Emphasizing Simulation Expertise and Service EfficiencyAt Lynwave, simulation-driven design is a core strength. The company leverages advanced modeling tools and extensive field experience to accelerate product development and ensure optimal antenna performance within real-world constraints. This efficiency not only shortens time-to-market but also helps customers reduce cost and risk during the design phase.Lynwave's responsive business team is always ready to support inquiries and provide tailored technical consultations. Global partners are encouraged to reach out anytime to explore how Lynwave can empower their wireless innovation journey.Looking Ahead: Innovation as the Driving ForceLynwave remains committed to advancing its ATM integration strategy while accelerating the development of Wi-Fi 8 intelligent antennas to meet the demands of next-gen connectivity."Through continuous innovation, we aim to help our clients unlock the full potential of their products and grow together with partners worldwide," Wu concluded.Lynwave invites all international buyers and industry partners to visit its booth at Computex 2025 – Hall 1, J1433. Come to discover how integrated solutions are redefining the wireless future.For more information visit https://www.lynwave.com/enThermal Simulation of Circuit Board Components

VIA Labs, Inc. (VLI), a leading provider of USB4, SuperSpeed USB, USB PD Controllers, and Display Controllers, has unveiled a USB4 gaming dock reference design that meets the latest EU EUP/ERP energy efficiency requirements. The design features VL832, a USB-IF certified USB4 Device Controller; VL109, a USB PD 3.2 certified Power Delivery Controller; and VL605, a DisplayPort to HDMI 2.1 Protocol Converter. VIA Labs will showcase its latest product solution at Computex 2025 from May 20 to 23 at the Nangang Exhibition Center, Hall 1, USB-IF Community – VIA Labs, Inc. (Booth N0313).Since the launch of Nintendo's Switch in 2017, which became a massive hit with its support for both handheld and TV modes, the market has seen the emergence of various gaming handheld consoles. Valve's Steam Deck has attracted significant attention due to its impressive ability to run PC games. Subsequently, gaming handhelds such as ASUS ROG Ally, MSI CLAW, Lenovo Legion Go, and Acer Nitro Blaze series have also been released, rapidly expanding the handheld gaming market. There are even speculations that Xbox and PlayStation will launch handheld gaming consoles in 2027. These gaming handhelds are equipped with powerful and efficient graphics processors, capable of running various AAA game titles while using battery power. They also support VRR (Variable Refresh Rate) technology, which enhances the gaming experience by eliminating screen tearing, reducing input lag, and improving overall game smoothness. Moreover, these handhelds support USB-C connectivity, allowing users to switch from handheld mode to TV mode and enjoy gaming on a television or gaming monitor for a more immersive visual experience. Most of these gaming devices also support USB4 or Intel Thunderbolt, enabling high-speed video, audio, and USB data transmission at up to 40Gbps.Concurrently, within the wider regulatory environment for electronic goods, the EU's EUP (Energy-Using Products) and ERP (Energy-Related Products) regulations are also evolving. These aim to reduce the environmental impact of energy-consuming products and improve energy efficiency. The updated regulation (EU) 2023/826 expands the scope of control and imposes stricter power consumption limits for electronic and electrical equipment in off, standby, and networked standby modes. Starting May 9, 2025, products must comply with the new requirements, with power consumption not exceeding 0.5 watts in standby or off mode. From 2027 onward, the limit will be further reduced to 0.3 watts.In response to emerging trends in the gaming market and the upcoming EU 2027 EUP/ERP regulations, VIA Labs has introduced a USB4 gaming dock reference design that delivers new levels of functionality and performance while meeting these stringent energy efficiency standards. The design features the VL109, a 3-port USB PD 3.2 controller optimized for ultra-low standby power consumption. It supports the USB4 device controller VL832, enabling USB4 40Gbps or legacy DisplayPort Alternate Mode, and also provides USB PD EPR charge-through, delivering up to 140W of power to the host. In standby mode—when the upstream port is not connected to host—the design intelligently manages power to other key components on the board, reducing total power consumption to only 10 milliwatts. This is significantly below the 300 milliwatt limit mandated by the 2027 EUP/ERP standby/off-mode requirements, offering very large margin for developers to implement additional features or functionality.To provide flexible yet cost-effective display options for gamers, this reference design features an HDMI 2.1 port and a USB-C port supporting DisplayPort Alternate Mode. It avoids the cost of a DP MST hub (required for simultaneous dual output) by activating video output on a first-come, first-served basis. Gamers can easily connect to either HDMI Displays or the growing range of USB-C portable monitors. Through VL832's USB4 DP tunneling mode, either interface can deliver high refresh rates of up to 4K@240Hz.Another highlight of this reference design is the VL605, a fully VRR-capable HDMI 2.1 Protocol Converter. The VL605 converts DisplayPort signals from the VL832 into HDMI 2.1 output at up to 8K@60Hz or 4K@240Hz. It preserves VRR capabilities by translating DisplayPort's Adaptive Sync for seamless operation over HDMI 2.1. This ensures seamless VRR functionality is enabled across AMD, Intel, and NVIDIA G-SYNC Compatible platforms. Furthermore, VL605 has passed AMD FreeSync validation testing, and its OUI (Organizationally Unique Identifier) has been incorporated into AMD's latest GPU drivers, enabling FreeSync Premium Pro functionality on compatible AMD platforms as well. Additionally, VL605 supports LPCM and various compressed audio formats. It integrates a DSC decoder and complies with the latest DisplayPort 2.1 standard, supporting both Autonomous Mode and Source-controlled Mode, which provide enhanced control capabilities for the signal source. To safeguard against malicious firmware attacks, VL605 also enables secure firmware updates via built-in ECDSA authentication.Huineng Chang, Director of Product Management Division at VIA Labs, emphasized the potential of VL605 in the gaming market. He stated: "With increasingly powerful handheld game consoles entering the market, mobile chipsets from Apple, Qualcomm, and MediaTek now support hardware-based ray tracing. This marks a shift where gamers are no longer confined to traditional consoles like Xbox or PlayStation, but can enjoy AAA titles on handheld game consoles. On the other hand, many of today's TVs support high refresh rates and Game Mode, while portable monitors have also become more popular and widely adopted. In response to these trends, VIA Labs has introduced this reference design alongside a range of USB Hub and USB PD controllers, enabling VL605 to support USB-C multifunction docks with USB PD charging and compliance with the 2027 EUP/ERP energy regulations. With VRR support across platforms, VL605 empowers handheld game consoles to transform into high-end home gaming consoles, delivering a gaming experience that rivals traditional console systems."VIA Labs VL605: https://www.via-labs.com/product_show.php?id=123VIA Labs VL832: https://www.via-labs.com/product_show.php?id=119VIA Labs Exhibition InformationComputex Taipei 2025Date: 2025/5/20-23Location: Nangang Exhibition Hall, Hall 1, Taipei, TaiwanBooth: VIA Labs, Inc. at USB-IF Community (N0313)About VIA Labs, Inc.VIA Labs, Inc. (VLI) is a leading supplier of USB4, SuperSpeed USB, USB PD Controllers, and Display Controllers. A subsidiary VIA Technologies, Inc., VLI leverages its expertise in analog circuit design, high-speed serial interfaces, and systems integration to create a rich product portfolio that includes USB Host, Hub, and Device controllers in addition to USB PD and charging controllers. VIA Labs, Inc. has demonstrated technology and industry leadership through Standards Development and bringing newly developed USB Technologies to market. www.via-labs.com