As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market is experiencing strong growth. This momentum is expected to continue as advanced semiconductor technologies drive increasingly sophisticated testing requirements.Chroma ATE Inc., a company with more than two decades of experience in automated test equipment (ATE), recently held its Semiconductor Test Equipment User Conference in Hsinchu, Taiwan. Registration quickly reached capacity, reflecting the company's growing prominence in the semiconductor testing market. In 2025, Chroma reported consolidated revenue of US$943 million and grew its global workforce to nearly 4,000 employees.Credit: ChromaGeorge Chang, President of Chroma's Semiconductor Test Equipment Business Unit (STE BU), emphasized that Chroma is one of the few ATE suppliers with the in-house capability to develop  application-specific integrated circuits (ASICs) for its own test systems. This capability creates a "technology moat" that reinforces Chroma's competitive advantage.To address the diverse needs of the semiconductor testing market, Chroma has built its portfolio around three specialized test platforms. The Chroma 3680 is designed for advanced devices used in AI, HPC, microcontroller unit (MCU), and mixed-signal applications, the Chroma 3650 addresses power devices and systems-on-chip (SoCs), and the Chroma 3380 targets mainstream MCUs, Internet of Things (IoT) devices, and other chips manufactured on mature process nodes. Combined shipments across the three platforms have exceeded 4,000 systems. This year, Chroma also introduced the compact Chroma 3650-S2C platform for high-power devices, responding to increasingly rapid product cycles across the semiconductor industry.Credit: ChromaProprietary PINF ASIC Enables Seamless Migration for Complex SoC TestingAs AI and HPC drive more complicated chip designs, testing is becoming more diverse and technically more demanding. At the same time, the industry is facing growing pressure to reduce costs and shorter test development schedules. Spancer Lee, Senior Manager of product marketing at Chroma's STE BU, explained that the Chroma 3680 integrates Chroma's next-generation, self-developed PINF ASIC with a range of specialized system boards, each supporting different test functions. This architecture enables comprehensive coverage across four major testing domains: digital, analog, mixed-signal, and RF devices. Chroma plans to continue expanding the platform's capabilities, leveraging the flexibility of its in-house hardware development to support high-precision testing of increasingly complex and high-frequency SoC devices. To accommodate the intensive data transfer and processing requirements involved with testing advanced semiconductor devices, the Chroma 3680 employs an 8-lane, 20 Gbps parallel high-speed data architecture. Optimized firmware enables high-speed transfer and more efficient processing of complex test data. The architecture also minimizes synchronization latency between digital and analog resources, improving resource integration for highly complex SoC test programs.The Chroma 3680 architecture is also compatible with certain probe card models used on competitor platforms. This allows customers to retain existing load boards and test programs without modifying their hardware, reducing migration costs while maximizing ROI and helping chipmakers gain a competitive edge in the market.Credit: ChromaChroma 3650-S2C Delivers High-Voltage Capability in a Compact FootprintWith NVIDIA signaling a transition toward direct 800V DC power delivery for server racks, semiconductor manufacturers face growing demand for high-voltage testing. To address this need, Chroma developed the 3650-S2C, a new test platform optimized for high-power semiconductor devices including silicon carbide (SiC) and gallium nitride (GaN). Through extensive engineering refinement, the platform's slot count was reduced to six, optimized for the requirements of intermediate-level testing. Chroma also substantially streamlined the external high-voltage power rack by integrating it directly into the test head. The 3650-S2C cuts the system footprint by half, enabling seamless integration with mainstream turret handlers for volume production while helping OSAT partners save valuable factory space and infrastructure costs.Aaron Chuang, Senior Manager of Advanced Technology Development at Chroma's STE BU, highlighted two key characteristics of the Chroma 3650-S2C: powerful high-voltage capability and a compact footprint. Building on the proven Chroma 3650-S2 platform, the solution integrates a high-voltage source-measurement unit (HVSMU) board to deliver a comprehensive, one-stop solution for five critical test parameters. It enables customers to safely and accurately overcome the 4 kV test threshold while maintaining production throughput, providing a powerful foundation for next-generation high-voltage power semiconductors to advance into mass production.Credit: Chroma？？？？？？？Integrated High-Density RF Technology Addresses Next-Generation Ultra-High-Frequency Wireless TestingThe rapid adoption of AI, edge computing, and intelligent connected devices continues to drive growth across Wi-Fi, Bluetooth, GNSS, IoT, mobile, and wearable applications. At the same time, wireless communication chipsets are undergoing a significant generational upgrade.To address these evolving requirements, Chroma has integrated its new HDRF3 (high-density radio frequency) test module into the Chroma 3680 platform. The solution is designed to support the increasing bandwidth, advanced modulation schemes, and multi-antenna architectures required by next-generation wireless technologies. This positions the company to capture the high-performance networking and AIoT chip packaging and testing markets.According to Jackson Hsu, associate director of application engineering at ADIVIC, a Chroma-affiliated company, Wi-Fi 7 expands channel bandwidth from 160 MHz to 320 MHz while increasing modulation density to 4096-QAM. These advances place exacting demands on RF performance and noise characteristics in test instrumentation. The HDRF3 test module was specifically developed to meet these requirements, extending operating frequencies up to 8 GHz and providing full coverage for Wi-Fi 7 as well as future Wi-Fi 8 implementations.ADIVIC also plans to launch an extension model, the 35809, featuring a simplified 16-port design while maintaining complete software compatibility with the production-oriented HDRF3 platform. The solution is targeted at applications requiring RF IC testing only. Chroma's in-house ASIC expertise allows the company to adapt the hardware architecture of its Chroma 3680, 3650, and 3380 platforms to distinct market requirements. From the space-efficient Chroma 3650-S2C to the high-density HDRF3 module, each development addresses emerging technical challenges across the semiconductor industry.Credit: ChromaThrough a combination of flexibility, high return on investment, and seamless platform migration strategies, Chroma helps customers accelerate adoption while reducing operational barriers. As AI, advanced computing, wireless connectivity, and power semiconductors continue to reshape the industry, Chroma is positioning itself as a long-term strategic partner for the world's leading semiconductor manufacturers.

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026. Delivering thermal conductivity exceeding 8 W/m-K, the new material is designed to help semiconductor manufacturers overcome rising thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) applications.As AI, HPC, and next-generation communications drive higher chip frequencies, greater thermal design power, and more complex package architectures, efficient heat dissipation and stress control have become critical to device performance and reliability. Loctite ABLESTIK CDF900 addresses these challenges by combining high thermal conductivity with the precision and process consistency of a film-based die attach format.Technical Breakthrough for High-Performance AI Packaging"Henkel is a global leader in conductive die attach film, with technology widely adopted in Wi-Fi communications, automotive electronics, and power devices. Today, Loctite ABLESTIK CDF900 pushes thermal performance to new heights while expanding applications into large-die packaging scenarios such as processors and AI chips. This offers customers broader design flexibility and superior thermal management solutions," said Kaihua Zhou, Head of Market Strategy for Semiconductor at Henkel Adhesive Technologies Electronics.The core breakthrough of Loctite ABLESTIK CDF900 lies in its proprietary thermal filler technology, which substantially increases thermal conductivity to more than 8 W/m-K. This enables high-power components in mobile phones, processors, and Wi-Fi equipment to dissipate heat efficiently and maintain stable performance in demanding operating environments.Compared with competing liquid die attach adhesives, Loctite ABLESTIK CDF900's film-based format helps eliminate the risks of material bleed-out and non-uniform bondline thickness. This enables chip designers to achieve smaller, more precise die footprints within constrained spaces while enhancing overall package reliability and robustness.Complete Material Solutions to Address Stress Challenges in AI Advanced PackagingTo address warpage during processing and component stress issues inherent in large-die advanced packaging, Henkel continues to expand its material portfolio. The company has developed high-thermal-conductivity liquid molding compounds, high-performance capillary underfills, and diverse packaging material platforms to meet requirements for efficient heat dissipation, high reliability, and process flexibility. By reinforcing structural strength, toughness, and adhesion, Henkel's materials help mitigate stress imbalances while meeting the stringent reliability and high-volume manufacturing stability requirements of high-end AI packaging.At SEMICON Taiwan 2026, Henkel will present its complete portfolio for critical advanced packaging applications, including underfill, conductive die attach film, liquid molded underfill, and non-conductive liquid adhesive technologies.Kevin Becker, Senior Vice President of Product Development and Engineering, added, "These solutions support board-level to wafer-level packaging, low to high thermal conductivity applications, and small to large die footprints. Leveraging its comprehensive product portfolio, global R&D resources, and localized technical support, Henkel empowers customers to improve thermal performance, package reliability, and mass-production readiness in advanced package designs, while providing vital material support for the next generation of AI development."Global Footprint and Multi-Site Support Deliver Supply Chain ResilienceAmid geopolitical shifts and global expansion, semiconductor supply chain resilience has become a priority in international procurement decisions. Henkel has established a robust multi-site support network and operates manufacturing facilities across North America, Europe, and Asia, with established production and technical support hubs in Taiwan, South Korea, China, Japan, and Southeast Asia. Flexible backup production sites enable localized, real-time support to meet global customers’ capacity expansion and procurement flexibility needs.Sustainability Commitment: Advancing Circularity in Semiconductor MaterialsSustainability is a core value at Henkel. In material R&D, the company has pioneered the integration of eco-friendly product design methodologies. For example, Henkel is collaborating with partners to advance circular economy practices, including the use of silver powder from recycled silver, a precious metal widely used in semiconductor packaging. Henkel is committed to working hand in hand with industry partners to reduce carbon emissions and minimize resource waste.Visit Henkel at SEMICON Taiwan 2026During SEMICON Taiwan in September, Henkel will present its full suite of material solutions for advanced packaging and high-performance semiconductor applications in Room 404, Hall 1 of the Taipei Nangang Exhibition Center. The company will showcase its technical capabilities across AI infrastructure, HPC, next-generation communications, and Edge AI.The hospitality suite will feature a variety of interactive experiences, creating opportunities for customers and industry partners to engage directly with Henkel's technical experts. Together, participants will explore innovative solutions for advanced packaging, including thermal management, reliability enhancement, stress mitigation, and readiness for high-volume manufacturing. Through collaboration and knowledge exchange, Henkel continues to support the semiconductor industry's progress toward higher performance, greater reliability, and enhanced resilience.Details about Henkel consumer electronics materials are available here, and information about its semiconductor solutions can be found here.LOCTITE is a registered trademark of Henkel and/or its affiliates in the USA, Germany and elsewhere.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its Board of Directors has approved a resolution to repurchase and fully cancel 40 trillion won worth of its own shares. The Company also revealed plans to return "over 50% of cumulative Free Cash Flow (FCF)" generated during the program period (2025-2027), adopting a framework centered on the parallel execution of share repurchases and cancellations alongside cash dividends.Following the Board meeting held earlier today, the Company formally disclosed the share repurchase and cancellation resolution along with the shareholder return plan via a regulatory filing.The decision stems from the assessment that the Company's intrinsic value—underpinned by its business competitiveness, robust cash generation capability, and mid-to-long-term growth potential—is not fully reflected in its current stock price.SK hynix continues to record record-breaking financial performance, maintaining its leadership in the AI memory market. As of the end of the second quarter of this year, the Company's net cash stood at approximately 69 trillion won, demonstrating significantly improved cash generation capability.The total planned amount for the share repurchase is 40 trillion won. Based on the closing stock price of 1,662,000 won on the day prior to the Board resolution, this represents approximately 24.07 million shares, or about 3.3% of total issued shares (730,492,365 shares). The repurchase period is scheduled to run for approximately three months starting August 20, with all repurchased shares set to be cancelled upon completion of the acquisition.This initiative accelerates the execution of the existing shareholder return program ahead of schedule. In November 2024, SK hynix announced a program to execute shareholder returns within the range of 50% of its three-year (2025-2027) cumulative FCF, noting that it would consider early execution prior to the program's expiration if FCF increased meaningfully due to improved operational performance.The 40 trillion won program marks the largest treasury share cancellation ever conducted by a South Korean listed company. The Company noted that progress toward its financial health targets remains on track, affirming its commitment to maintaining a stable financial structure while delivering sustained shareholder value.Through today's regulatory filing, SK hynix announced plans to pursue an expansion of its total shareholder return target from the previous "within 50% of cumulative FCF" to "over 50% of cumulative FCF". Under the framework, shareholder returns will be executed through a dual-track approach running share repurchases/cancellations alongside cash dividends, while options to expand payouts—including the existing fixed dividends and special dividends—are also under consideration.SK hynix emphasized that it intends to pursue additional shareholder returns within the program period through the parallel execution of share repurchases/cancellations and dividends, by taking into account cash flows, market conditions, and distributable profits, adding that specific details regarding scale and execution will be announced following Board approval at the time of its third-quarter earnings release.

The AI industry is entering a new phase centered on inference efficiency and agentic deployment. As AI search, enterprise copilots, autonomous driving, embodied intelligence, AI PCs, AI smartphones, and multi-agent collaboration accelerate, the token has evolved beyond a simple unit for measuring model calls to become a core metric for AI infrastructure efficiency, cost structure, and production capacity. Amid this shift, the value of memory and storage is being redefined.From model loading and KV cache to RAG, vector retrieval, long-context inference, and data accumulation, every critical stage of AI inference and application depends on memory and storage that are high-performance, highly reliable, low-latency, and built to scale sustainably. AI memory and storage are evolving from back-end data repositories into core foundations underpinning token generation, caching, retrieval, scheduling, and data accumulation.At the same time, AI workloads are extending from cloud data centers to edge nodes and end devices, giving rise to a new paradigm of coordinated cloud-edge-device evolution. Breakthroughs in AI-era memory and storage will no longer come from single-point performance gains alone, but from system-level collaboration, ecosystem integration, and supply chain resilience; industry collaboration is moving beyond linear upstream-downstream supply relationships toward a new paradigm of deep alignment and shared growth, built around cloud-edge-device workload demands, joint product definition, scenario validation, supply security, and shared value creation.Against this backdrop, the 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026), themed "The Future Built on AI Memory and Storage," will be held on September 22–23, 2026, in Shenzhen, China. Rooted in the memory and storage supply chain and geared toward new AI infrastructure and cloud-edge-device scenarios, the summit will bring together leading voices across the ecosystem, including players in wafer manufacturing (IDMs), controllers, modules, OSAT, equipment and materials, servers and systems, AI computing, AIDC, cloud services, smart terminals, automotive electronics, and embodied intelligence, along with investment and academia institutions, to explore the trends, demands, and collaborations shaping memory and storage in the AI era.Summit Topics: Exploring New Variables in the Token Economy through the Lens of AI Memory and StorageCentered on the memory and storage industry chain and framed through the lens of the token economy, GMIF 2026 will build a cross-sector exchange platform around AI infrastructure efficiency, cloud-edge-device application expansion, industry ecosystem collaboration, and capital value reassessment.Token Economy: Redefining the Value of Memory and Storage for AI. Examining how memory and storage are evolving beyond capacity resources into critical infrastructure for Token-driven AI, with a focus on AI inference, KV cache, vector retrieval, RAG, long-context inference, and data persistence.Token Economy: Redefining the Value of Memory and Storage for AI. Examining how memory and storage are evolving beyond capacity resources into critical infrastructure for Token-driven AI, with a focus on AI inference, KV cache, vector retrieval, RAG, long-context inference, and data persistence.Cloud-Edge-Device Collaboration: Extending AI Memory and Storage Across New Application Frontiers. Exploring the upgrade of memory architectures and product innovation opportunities driven by diverse AI-demanded scenarios, including AI data centers, edge inference, AI PCs, AI smartphones, AI glasses, intelligent vehicles, embodied intelligence, and multi-agent systems.Global Landscape: Building an Open, Resilient Ecosystem Together. Addressing shifting global industry dynamics and supply chain restructuring, with a focus on data governance, supply diversification, regional collaboration, and long-term sustainability.Industry Capital: Unlocking the Long-Term Value of AI Memory and Storage. Bringing together investment institutions, industry funds, securities firms, listed companies, and innovative enterprises to jointly assess industry cycles, capital logic, and long-term value.Centered on the Memory and Storage Industry Chain, Connecting the New AI Infrastructure EcosystemAs a leading global platform for the memory and storage industry, GMIF connects wafer IDMs, controllers, modules, OSAT, equipment and materials, terminal companies, and channel partners to drive technical exchange and ecosystem collaboration.GMIF connects IDMs, OSAT, controllers, cloud, equipment, & terminals for memory. Credit: SMIAFor 2026, GMIF expands further into compute providers, cloud and AIDC services, large model platforms, the RAG/agent-layer, smart terminals, automotive electronics, and embodied intelligence, strengthening ties between memory & storage and AI infrastructure across cloud, edge, and device.Summit Programs: Keynotes, Rankings, and a Closed-Door Investment ForumThe summit combines keynotes, roundtables, supply-demand matchmaking, product showcases, industry rankings, awards, and global livestreaming.GMIF Innovation Summit (main forum): keynotes from leaders in memory and storage, computing, cloud services, terminals, academia, and investment, focused on AI memory and storage technology, market opportunities, cloud-edge-device expansion, and token efficiency.AI Industry and Investment Forum: a closed-door, invitation-only session on AI memory and storage, enterprise SSDs, compute infrastructure, edge and on-device AI, advanced packaging, and industry M&A.Summit features keynotes, matches, showcases, awards, rankings, & livestreams. Credit: SMIAGMIF 2026 will also present its annual awards across Technology Innovation, Market Services, Industry Contribution, AI Infrastructure, Terminal Applications, and Capital Value. Alongside the awards, the Shenzhen Memory Industry Association — together with the School of Integrated Circuits at Peking University, JWinsights, and other institutions — will release the Memory & Storage Industry Rankings 2026, spanning semiconductor memory & storage, AI optical interconnect, semiconductor equipment, and AI computing.GMIF 2026 presents annual awards and industry rankings for storage & AI. Credit: SMIAA Track Record of Impact: Proven Value as an Industry PlatformSince its launch in 2022, GMIF has grown into a leading annual platform for the global memory & storage industry, connecting wafer IDMs, controller and module makers, OSAT providers, equipment and materials suppliers, terminal companies, investors, and media. GMIF2025 brought together 42+ key companies, showcased 180+ innovative products, presented 37 annual awards, and drew over 1,600 on-site attendees — with total exposure exceeding 420 million impressions and international livestream viewership surpassing 700,000.In 2026, GMIF builds on that momentum, expanding its reach across AI infrastructure, cloud-edge-device applications, and industry capital as it evolves from an annual exchange into a full AI memory & storage industry collaboration platform.Full-Spectrum Media Reach, Amplifying the Industry's VoiceGMIF 2026 will run an integrated communications campaign — features, short video, online and offline advertising, and outreach through 50+ central, financial, and semiconductor/memory vertical media outlets — to bring the AI memory & storage conversation to decision-makers, technologists, and investors alike.Full-Spectrum Media Reach, Amplifying the Industry's Voice. Credit: SMIALet AI memory and storage be our starting point — together, let's explore the new value the token economy brings to the industry, and witness memory and storage step onto the center stage of AI infrastructure.Join us September 22–23, 2026, as the 5th GMIF Innovation Summit convenes in Shenzhen.Registration is now open. We welcome industry professionals, technology leaders, and ecosystem partners to join us. Registration, awards submission and for more information about GMIF, please visit.

For Malaysian engineering students entering their final semesters, the transition from academia to the professional world can feel daunting. Nicholas Tan Peng Gen, a Computer Engineering graduate from Asia Pacific University (APU), found himself at that exact crossroads just a year ago. Today, he is thriving as a Firmware Engineer at Phison Electronics' subsidiary MaiStorage in Malaysia, contributing to semiconductor R&D that powers storage devices globally. In a recent interview, Nicholas shared his journey of landing a role at Phison through the Taiwan Semiconductor Job Fair in Malaysia, the steep but rewarding learning curve of R&D work, and why more Malaysian students should consider global IC design houses like Phison to kickstart their careers.The Gateway: A "Two-for-One" Career OpportunityThe Taiwan Semiconductor Job Fair was organized as part of Taiwan's efforts to strengthen international semiconductor talent connections. Through initiatives supported by Taiwan's Industrial Development Administration (IDA), Ministry of Economic Affairs, Taiwanese semiconductor companies and academic institutions were brought together overseas to connect with promising STEM talents, introduce career opportunities, and build long-term talent partnerships with local universities.Nicholas's journey began when his university lecturers shared details about the Taiwan Semiconductor Job Fair. One lecturer even chartered a bus to ensure the entire class could attend. For Nicholas, who was seeking industry experience but was also curious about further studies, the fair proved to be an eye-opener."It wasn't just a regular job fair. It is an absolute must-attend because it's a rare 'two-for-one' opportunity. You aren't just getting face-to-face access to industrial heavyweights; you're also interacting directly with academic institutions from Taiwan offering funded master's and PhD programs," he said.Walking into the fair, Nicholas secured a direct live screening session, allowing him to have a genuine conversation with Phison's recruitment team rather than simply submitting a resume through an online portal.Shedding "Vibe Coding" for Real-World EngineeringTransitioning from university projects to a global semiconductor firm brought a fundamental shift in perspective. Nicholas noted that in university, students often get by with short-term, loosely structured code as long as it functions by the deadline.At Phison, the standards are stringent. Every line of code must possess meaning, clarity, and purpose so that it remains readable and robust before being deployed on actual hardware. This completely eliminates what modern developers refer to as "vibe coding," because guessing or patching on the fly is highly risky when dealing with complex controller chips. Instead, engineers must trace code step by step and thoroughly understand the system architecture, backed by a rigorous peer-review process where technical logic is closely scrutinized by experienced senior engineers to rapidly accelerate a junior engineer's competence.Why Phison? Full-Stack Architecture Exposure with a Strong Support SystemOne of the key advantages of joining a prominent Taiwanese multinational like Phison from its Malaysian branch is the depth of technical support available. When tackling highly complex technical issues, local teams are never isolated - they have direct access to decades of foundational expertise and the engineering resources of Phison's Taiwan headquarters.Furthermore, rather than being confined to a single, repetitive task, firmware engineers at Phison are given ownership of the full development pipeline. They read and interpret core design specifications, implement advanced features, write testing scripts, verify across multiple hardware platforms, and execute end-to-end debugging. Handling the full pipeline naturally trains engineers to think like system architects, enabling them to see the bigger picture of how their code interacts with physical hardware - making them versatile professionals much faster, Nicholas said.This borderless collaboration also cultivates strong cross-cultural communication skills. Nicholas noted that while Mandarin is commonly used, teams regularly converse in English and utilize translation tools, making the language barrier a manageable factor. Learning to document complete code-tracing workflows for cross-border engineering teams rapidly builds global competitiveness.Life at Phison Malaysia: A 9-out-of-10 ExperienceWhen asked to rate his job satisfaction at Phison Malaysia, Nicholas gave it a 9 out of 10. The semiconductor industry is fast-paced and demanding, but the work environment allows engineers to maintain clear boundaries and protect their personal time. Working at Phison's established branch in Malaysia offers a premier international career path without requiring graduates to relocate away from their families, making it a compelling option for local talent.The company culture also fosters supportive autonomy. Team members are highly collaborative, and while senior engineers are always available to troubleshoot, they challenge junior engineers to bring their own analysis to the table first - fostering independence and professional accountability.Advice to Graduating StudentsAs global demand for semiconductors surges - driven by the explosive growth of AI hardware - Malaysia's semiconductor ecosystem is rapidly moving up the value chain from back-end assembly and packaging into high-value R&D and IC design.For students weighing their next career steps, Nicholas offered one definitive piece of advice regarding the upcoming career fair: "Just go. You might walk out of there with a lot more clarity for your future. Taking on challenges early in your career helps you grow much faster, and the skills you build at an international standard with Taiwanese companies such as Phison are instantly transferable worldwide."From a university student seeking his first career opportunity to a firmware engineer contributing to global semiconductor products, Nicholas's journey demonstrates how international talent engagement can create new pathways for young engineers to connect with Taiwan's semiconductor industry.Through collaboration among Taiwan's semiconductor companies, academic institutions, and global STEM talent communities, more students like Nicholas can discover opportunities within Taiwan's semiconductor ecosystem and contribute to the next generation of semiconductor innovation worldwide.

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor industry events. The exhibition will take place from 2 to 4 September 2026 at TaiNEX 1 & 2 in Taipei, Taiwan. Visitors can visit ViTrox at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006.The semiconductor industry continues to face increasing challenges as packaging architectures such as SiP, memory technologies like HBM, and advanced processes such as CoWoS become more widely adopted. While these technologies enable higher performance and integration, they also introduce greater process complexity and stricter quality requirements.Key challenges include:-Precision Bottlenecks: Sub-micron defect detection requires inspection capabilities beyond conventional methods.-Hidden Complexity: Advanced 3D structures often conceal internal defects that are difficult to detect.-Yield Pressure: Rising investment in advanced manufacturing places greater emphasis on first-pass yield and equipment efficiency.To address these challenges, ViTrox provides next-generation AI-powered vision inspection solutions that enhance detection accuracy, improve process stability, and support efficient semiconductor manufacturing.At SEMICON Taiwan 2026, ViTrox will showcase a fully integrated inspection ecosystem that seamlessly supports the entire semiconductor manufacturing journey, delivering end-to-end quality assurance from wafer to board level.At the Wafer Level, we address the earliest stages of manufacturing with the WiX Ai Smart Wafer AOI Machine. This an unified platform that gives fabs full-depth wafer visibility, from surface to inner layer, before wafers progress to later stages. It detects sub-micron surface defects (< 1 µm) with AI-enhanced accuracy, while proprietary SWIR technology uncovers hidden inner cracks that conventional inspection cannot see.During Die Sorting & Packaging, once the wafer is transformed into dies, precision sorting becomes critical. Our PX40Ai Smart Die Sorting Machine streamlines high-speed sorting, six-sided inspection, and tape-and-reel packaging, replacing conventional manual inspection with exceptional accuracy and improved production efficiency.Designed to address the growing complexity of advanced packaging, the TH3000i Smart Tray Based Vision Handler combines an adaptive vision system with AI-powered defect detection to support diverse package inspection requirements. Building on this intelligent inspection capability, V-ONE In-Process Verification further enhances overall inspection efficiency by enabling remote inspection review and verification.During Final Assembly & Post-Seal, the VR20Ai G2 Smart Post Seal Vision Handler minimises machine idle time through a high-speed dual-track system design, while supporting automated tape insertion and width conversion (8 to 32 mm), ensuring compliance with international quality standards.At the Strip & Board Level Inspection stage, the V510Ai Smart 3D AOI System for Substrate-Level and SiP Inspection utilises high-resolution 3D measurements and SWIR imaging to detect surface anomalies, component offsets, and inner die cracks on strips and complex high-density modules, ensuring robust inspection for IC package integrity.During the show, ViTrox will also introduce our SMT Full Line Solutions, including Smart 3D SPI, Smart 3D AOI System, Smart 3D AXI System, and Smart Robotic Optical System (ARV). These smart manufacturing solutions are linked to ViTrox's Manufacturing Intelligence Solutions Towards Industry 5.0 – V-ONE to form an end-to-end AI-driven Inspection Ecosystem, guaranteeing seamless data connectivity and true closed-loop control. Ultimately, this comprehensive integration enables manufacturers to reduce human error, accurately detect defects early, optimise process performance, and maintain consistent product quality across every production stage.Visit at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006 to connect with experts and discover tailored inspection solutions for any manufacturing needs. To schedule a meeting with ViTrox team during the exhibition, simply complete the appointment form. For further inquiries, please contact us at enquiry@vitrox.com. 

BIOSTAR, a leading manufacturer of edge AI solutions, industrial motherboards, and edge computing systems, today announces its participation in embedded world North America 2026, taking place September 22–24, 2026 at the Anaheim Convention Center in Anaheim, California, USA. At Booth 6512 in Hall B, BIOSTAR will showcase its latest edge AI and IPC computing solutions, giving visitors a firsthand look at technologies developed for smart manufacturing, smart cities, and smart retail applications.At this year's expo, BIOSTAR will feature a comprehensive portfolio of industrial motherboards and EdgeComp systems, along with live demonstrations designed to address a wide range of edge computing requirements. Highlights include AI IPC solutions powered by Intel Core Ultra platforms, edge AI computing solutions featuring NVIDIA Jetson Orin and Thor platforms, and industrial-grade systems built for dependable deployment across commercial and industrial environments.The industrial motherboard lineup will include the Intel W880, Panther Lake as well as Wildcat Lake platforms. Spanning a range of platform configurations, form factors, and connectivity options, these boards give developers, system integrators, and industrial solution providers a flexible foundation for building application-specific IPC systems.BIOSTAR will also present an extensive selection of EdgeComp systems, including the Intel Panther Lake and NVIDIA Jetson Thor, Jetson Orin edge AI platforms, together with the new WildCat SBC rugged system. Ranging from compact single-board designs to higher-performance networking and gateway platforms, this lineup supports both conventional edge computing workloads and emerging edge AI applications across smart manufacturing, smart cities, and smart retail environments.Live demonstrations will feature the EdgeComp edge AI platforms. Together, these demonstrations will give visitors a practical view of how compact edge platforms can support real-time data processing, intelligent monitoring, and connected industrial applications.BIOSTAR invites industry professionals, system integrators, technology partners, and IPC innovators to visit Booth 6512 in Hall B and experience its latest edge computing and edge AI solutions firsthand. The BIOSTAR team looks forward to connecting with industry peers, discussing emerging application requirements, and exploring new opportunities for collaboration at embedded world North America 2026.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has decided to build new fabs in Yongin and Cheongju to respond to the continuously growing demand for memory in the AI era.The company approved a total investment of approximately 54 trillion, on 35.2 trillion won in Yongin "Y2" fab and 19.1 trillion won in the Cheongju "M17" fab, in a board meeting.This decision represents execution of the mid-to-long-term investment strategy announced by the company last June. Under its master plan to invest 600 trillion won in the Yongin Semiconductor Cluster and 100 trillion won to expand its Cheongju production base, SK hynix is currently constructing its first fab in Yongin (Y1). With this latest decision, the company is embarking on the construction of subsequent fabs in both Yongin and Cheongju.According to market research firm Omdia, both DRAM and NAND demand are projected to maintain a compound annual growth rate (CAGR) of 19% from last year through 2030. The company views this growth not as a temporary supercycle, but as a structural transformation in which memory transcends its role as a mere component to become core infrastructure determining AI performance itself.SK hynix stated that in the AI era, technological competitiveness alone is not enough and the ability to supply the required volume at the exact moment customers need it is the ultimate competitive advantage. We reached this investment decision after a thorough review of market demand.Yongin Y2 is the second of four fabs planned sequentially for the Yongin Semiconductor Cluster. It will serve as a DRAM production base spanning a total floor area of 341,000 pyeong (approximately 1,130,000m2). Construction is scheduled to break ground in July next year, targeting the opening of its first cleanroom in June 2029 to produce high-bandwidth memory (HBM) and other next-generation DRAM products. Meanwhile, construction on Y1 is progressing smoothly toward its initial cleanroom opening target of February next year.SK hynix previously set a goal to advance the completion date of the Yongin Semiconductor Cluster by 12 years—from the originally planned 2045 to 2033—to finish constructing all four fabs. The Y2 construction serves as the second phase supporting this accelerated timeline and the investment spans to October 2031 sequentially.The investment amount includes construction costs for "Business Support Building" with administrative and welfare facilities for Y2 personnel, an "Integrated R&D Center" to consolidate product development testing, analysis, and experiments, as well as auxiliary infrastructure1..1Auxiliary infrastructure: Water treatment facilities, utility conduits (underground structures capable of accommodating power lines, telecommunications lines, water/sewer pipes, and thermal supply lines), substations, warehouses, etc.For the Yongin Semiconductor Cluster—sprawling over approximately 1.26 million pyeong(approximately 4,160,000m2) in Wonsam-myeon, Cheoin-gu, Yongin-si, Gyeonggi-do—Phase 1 power and water infrastructure required up through Y2 operation is nearing completion, currently at a 99% progress rate. As fab construction and infrastructure setup have been carried out concurrently, the company plans to proceed with the Y2 construction according to schedule.In the NAND market, demand is surging rapidly centered on enterprise SSDs driven by the full-scale expansion of AI services. This is further boosted by demand for key-value (KV) cache2 storage in AI inference, with application fields expected to broaden further as Agentic and Physical AI are introduced.2KV Cache: A technique that stores and reuses previously computed Key and Value vectors to minimize inefficient redundant calculations during inference.SK hynix selected Cheongju as its new NAND fab base because it offers the fastest fab construction timeline. The Cheongju Campus already houses the M11, M12, and M15 fabs, enabling efficient production linked to existing operations on sites equipped with substantial pre-established power and water infrastructure. Cheongju M17 will be built across a total area of 206,000 pyeong(approximately 680,000m2), breaking ground in February next year with plans to open its first cleanroom in December 2028. The investment period runs through April 2031 according to the master plan.SK hynix plans to proactively secure production infrastructure based on mid-to-long-term demand discussed with customers, while expanding actual production capacity in alignment with the timing of customer needs. Fabs will be constructed according to the master schedule, whereas cleanroom expansions and equipment installation will take place sequentially in line with demand trends to maximize capital efficiency.The company expects this investment to secure future growth foundations while strengthening the competitiveness of the domestic semiconductor ecosystem and boosting local economies. The large-scale simultaneous investments in Yongin and Cheongju are anticipated to expand joint growth opportunities for supply chain partners, generate employment, and revitalize local commercial districts, thereby contributing to the sustainable growth of the national economy.An SK hynix official stated that "This investment is a decision made to seize opportunities in line with the market's growth speed. By proactively securing production capabilities, we aim to establish ourselves as a key partner in AI infrastructure, contributing to the stability of the global AI semiconductor supply chain."SK hynix's Cheongju M17 fab.Credit: SK hynix

As global healthcare systems evolve, preventive medicine and digital health technologies are becoming key drivers of medical innovation. Aging populations, rising healthcare costs, and increasing chronic diseases are accelerating the transition from treatment-oriented care toward preventive, personalized, and data-driven health management.Within this transformation, Traditional Chinese Medicine (TCM) is being re-examined beyond its historical and cultural role. Increasingly, TCM is discussed in the context of systems-based healthcare, lifestyle regulation, and long-term health management. Its emphasis on prevention, adaptation, and holistic regulation reflects growing global interest in healthcare models that focus on maintaining balance and improving overall well-being.TCM has traditionally emphasized the dynamic relationship between human health and environmental changes. Practices such as seasonal adaptation, sleep regulation, dietary management, and stress balance share conceptual similarities with modern healthcare research in areas including circadian rhythms, lifestyle medicine, and preventive care.Meanwhile, advances in digital technologies are reshaping healthcare delivery. Wearable devices, mobile health platforms, and artificial intelligence (AI)-based analytics now enable continuous monitoring of physiological indicators, including heart rate variability, sleep patterns, activity levels, and stress-related signals. These technologies create new opportunities to connect traditional health concepts with modern data-driven healthcare systems.The integration of TCM with digital innovation has become an emerging interdisciplinary field. AI-assisted diagnosis, wearable health monitoring, smart herbal medicine production, digital supply chains, and biotechnology applications are opening new pathways for the modernization of traditional medicine.This article series explores the evolving role of TCM in modern healthcare, covering preventive health, lifestyle management, wearable technologies, AI applications, herbal biotechnology, smart agriculture, and the globalization of traditional medicine.Taiwan’s development in biotechnology, information technology, precision agriculture, and healthcare innovation provides a unique foundation for advancing this integration. Emerging research in plant-derived biomaterials, intelligent cultivation systems, and herbal medicine applications demonstrates the potential of combining traditional knowledge with modern science and engineering.The modernization of TCM does not mean replacing traditional practices with technology. Instead, it represents a process of reinterpretation—using scientific validation and digital tools to enhance understanding, application, and global communication of traditional healthcare concepts.Challenges remain, including standardization, clinical validation, regulatory frameworks, and data integration. However, as healthcare continues to move toward predictive, personalized, and continuously monitored models, TCM may contribute valuable perspectives on preventive care, holistic health management, and system-oriented healthcare thinking.The convergence of traditional medicine and digital innovation will continue to shape new possibilities for the future of global healthcare.

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.The announcement coincides with the opening of 'FMS (Future of Memory and Storage) 2026,' held at the Santa Clara Convention Center in California from August 4 to 6 (local time). The company is set to present HBF as a key technology to overcome memory bottlenecks in the AI era through keynote speeches and panel discussions during the event.HBF technology is a new memory layer between HBM and SSDs. It enables high-speed data transfer similar to HBM while significantly expanding capacity by leveraging NAND technology. With the expansion of AI inference driving a surge in data volumes to process, HBF is gaining attention as a technology that simultaneously resolves bandwidth and capacity scalability challenges.This milestone comes about six months after launching the consortium in February this year, following the initial standardization partnership with Sandisk in August 2025. Capacity specifications cover up to 512GB based on two stack configurations (8-high and 16-high NAND dies). Bandwidth is categorized into three grades (Grade1~3), delivering scalable performance from approximately 0.4TB/s to 3.0TB/s.A key highlight is the interconnect linking HBF technology and processors. HBF technology adopts UCIe, an industry standard connection interface, laying the groundwork to flexibly integrate HBF technology across different processor types, including GPUs and CPUs.The standard also outlines 1. connection interfaces and electrical characteristics, 2. reliability and packaging guidelines for HBF die stack process, 3. software I/O guidelines.The specification was disclosed through the Open Compute Project (OCP), world's largest open data center technology initiative, positioning it as an open standard for the entire industry rather than a proprietary technology.SK hynix plans to leverage this release to expand the adoption of HBF technology in the AI storage market and foster the surrounding ecosystem. With Google and Tenstorrent currently participating in the HBF consortium, the consortium aims to expand its reach while enhancing technical maturity and market acceptance based on open collaboration.On the opening day of FMS 2026 (August 4, local time), SK hynix Executive Vice President Kim Chun-sung (Head of Solution Development) and Vice President Kang Uk-song (Head of Next Generation Product Planning) will deliver a joint keynote address, titled 'Orchestrating Efficient AI Infrastructure through Tiered Memory in the Era of Agentic AI.'As Agentic AI rapidly commercializes, the volume of data to process is surging alongside growing demands for higher speed and efficiency. Recognizing that a single memory type cannot address these complex challenges, both speakers will present the necessity and future direction of a next-generation architecture based on 'Tiered Memory' a framework that connects and optimizes diverse memory types into a unified system.On August 6, SK hynix Vice President Lim Eui-cheol (Head of Solution AT), Sandisk Vice President Rajeev Nagabhirava and Google DeepMind Senior Staff Engineer Xiaoyu Ma will join a panel discussion titled 'Breaking the Memory Wall with High Bandwidth Flash.' Bringing together key leaders across memory, storage and AI, the session will examine fundamental shifts in memory architecture across AI infrastructure and highlight the potential and role of HBF as a transformative solution.Furthermore, SK hynix will host an exhibition booth throughout FMS 2026, featuring a Partnership Zone, a Next-Generation Tech Zone and Tech Sessions.Notably, the company will publicly reveal for the first time its tenth-generation (V10) 375-layer 4D NAND wafer and products, which are currently under development. The 375-layer 4D NAND improves performance per watt by 2.5 times compared to the previous generation, making it optimized for AI infrastructure environments like data centers that demand high power efficiency and performance. The company plans to initiate mass production of high-performance, high capacity eSSDs based on the 375-layer 4D NAND early next year to reinforce its leadership in the AI NAND market.SK hynix will also display a versatile product lineup spanning mobile, PC, automotive and robotics, showcasing the company's competitive edge in memory technology and its collaborative achievements with customers in the AI era."With the rapid spread of AI applications, we are at a point where overall data processing structures must be redesigned," said SK hynix Executive Vice President and Head of Solution Development Kim Chun-sung, adding, "Through HBF, SK hynix will expand the boundaries between memory and storage and contribute to building new architectures that enhance overall system efficiency."SK hynix exhibition booth at FMS 2026. SK hynix