LITEON Technology is actively capitalizing on the AI boom by restructuring its data center infrastructure around megawatt-scale power, rack and liquid cooling. The company has developed high-density 800 VDC power architectures and advanced cooling systems to support massive, next-generation AI accelerators.At COMPUTEX 2026, LITEON hosted the "AI Summit Panel" on the opening day, themed "Powering the AI-driven Future: Scaling AI Across Architecture, Systems, and Infrastructure." Moderated by Colley Hwang, Chairman of DIGITIMES, the Panel brought together industry leaders from NVIDIA, Infineon and GIGABYTE to examine how AI is reshaping the technology landscape. The discussion highlighted how rapid AI adoption is driving structural changes brought across the ecosystem, particularly in data center infrastructure and power demand. As AI scales, power availability and efficiency are becoming central considerations, with AI factories emerging as a defining paradigm in the next phase of industry development.Hwang opened by noting that AI has become a key driver of global productivity growth and is expected to generate trillions of dollars in economic value. As a result, infrastructure and deployment models are being fundamentally reshaped, with data centers rapidly evolving into AI factories. In this transition, the availability and reliability of energy have emerged as critical enablers of large-scale deployment, elevating power and cooling from supporting functions to core elements of system architecture.More than just chips, AI revolution requires huge energyNVIDIA Senior Director, HPC and AI Hyperscale infrastructure Solutions, Dion Harris spoke first. He referenced NVIDIA CEO Jensen Huang's speech in the NVIDIA GTC Taipei held in the previous day, addressing the "five-layer cake" analogy to illustrate AI from being just a software tool into a vast, vertically integrated industrial system. At the very bottom of the cake is "energy". Before the AI can showcase real-time intelligence, the systems fundamentally rely on efficient and stable power supply."Building AI factories goes beyond compute-you have to power them, cool them, and run them reliably to truly monetize AI," said Dion Harris at NVIDIA. "Infrastructure and energy play a critical role in determining token cost and performance per watt. As Jensen Huang's‘five-layer cake’ illustrates, without strong foundational layers, higher-level innovation cannot scale. This is why ecosystem collaboration is essential."Harris further mentioned NVIDIA DSX platform as a blueprint for AI factory development, defining how next-generation infrastructure is designed, built and operated. Under this framework, AI factories are evolving to support rapidly growing token demand driven by today's AI applications. He emphasized that achieving optimal token cost and performance per watt ultimately relies on strong ecosystem collaboration, noting that partners like LITEON play a critical role in delivering the power, cooling, and operational capabilities required to support frontier and open-source AI workloads at scale.Dr. Sergio Rossi, Vice President of Application Marketing at AI and Power division of Infineon Technologies, noted that AI adoption accelerates, the key competitive bottleneck is shifting from compute to energy, especially in regions such as Europe where electricity availability has become increasingly constrained. That's the reasons why LITEON, NVIDIA, GIGABYTE and Infineon engage in collaboration to have several steps forward to make sure the design is using the right technology, architecture and solutions for securing AI development to use energy in the most efficient manner."Just improving energy efficiency by a few percentage points can translate into saving power at the scale of an entire city, highlighting how critical efficiency has become in AI data center development," said Dr. Serio Rossi.Rossi further highlighted that the AI ecosystem is facing three key complexities, including acceleration, with development cycles shortening from 30 months to 6 months; increasing architectural complexity driven by the adoption of 800 VDC in next-generation data centers; and rapid innovation in power technologies such as SiCs and GaNs to enhance energy efficiency. To address these challenges, he emphasized the importance of close ecosystem collaboration, where infrastructure stakeholders work together to anticipate future demand and align on technology roadmaps with partners such as Infineon at an early stage. This enables faster development cycles and accelerates innovation in power and infrastructure solutions for evolving AI requirements.Leo Wang, EMEA regional Product & Marketing Lead at Giga Computing, talked about how the company collaborates with industry leaders to advance AI performance through hardware innovation and liquid-cooled server solutions optimized for AI workloads. He noted that as AI infrastructure evolves, the focus is extending beyond server performance to broader data center challenges, particularly in power and thermal management.Wang added that maximizing the value generated from available energy is becoming a key industry priority, making close ecosystem collaboration essential. Leveraging Taiwan's strong supply chain and close engagement with global partners, this collaboration is helping to establish scalable deployment models and best practices for global AI adoption."We are now dealing with increasingly heterogeneous machines, from training systems to different AI applications, so power and space both need to be carefully managed, as all of these resources are limited," said Leo Wang at Giga Computing, "Everything comes down to how we build a proper data center and a proper environment to serve the server in a consistent way. It is no longer just about building servers, but about optimizing at the data center level to ensure power is allocated and utilized in an effective and efficient way."From Power to Infrastructure: Enabling the Next Phase of AI ScalingIn response to the energy and infrastructure challenges highlighted in the panel, LITEON showcased its integrated capabilities across power, mechanical, and thermal systems to support next-generation AI infrastructure at COMPUTEX 2026. LITEON debuts 800 VDC liquid-cooled power rack, alongside a comprehensive portfolio of solutions, including the 110kW power shelf for NVIDIA Vera Rubin NVL72 platforms and the 280kW in-rack CDU. Together, these offerings address the growing demand for high-density and energy-efficient AI infrastructure, demonstrating LITEON's ability to integrate power delivery, thermal management, and system design to support scalable AI deployment, and reinforcing its role as a key enabler in the evolution toward megawatt-scale AI data centers.

Clientron, a premier global provider of smart endpoint solutions, today announced a strategic partnership with Parallels, a global leader in cross-platform and virtualization solutions. Through this collaboration, Clientron will bring Parallels Workspace solutions including Parallels RAS (Remote Application Server), Parallels Browser Isolation and Parallels DaaS to organizations across Southeast Asia, offering a simple, flexible, and secure alternative for businesses looking to modernize digital workspaces and reduce IT cost and complexity.In today's hybrid work era, IT teams across Southeast Asia are increasingly burdened by "Legacy VDI Platforms" and are increasingly looking for ways to simplify digital workspace management, reduce operational overhead, and improve cost efficiency. Parallels Workspace solutions address these challenges with streamlined deployment, flexible infrastructure support, and cost-effective application and desktop delivery across hybrid and multi-cloud environments."Businesses want to stop using old and costly systems," said Vivienne Weng, Vice President at Clientron. "Parallels is a great way to reduce the work for IT teams. With Clientron's high-performance hardware, we help IT managers in Asia move away from expensive setups to a smarter and easier way to manage their workspaces.""Many organizations across Southeast Asia are currently seeking solutions to modernize their digital workspace strategies," said Asif Khan, Country Sales Manager at Parallels. "As a strong mid-market enabler, Parallels helps organizations simplify application and desktop delivery with secure, flexible solutions designed for hybrid and multi-cloud environments - backed by competitive and cost-effective pricing. Together with Clientron, we're expanding access to these modern workspace solutions across the region."Key Advantages of Clientron x Parallels:1. Cost-Effective Seamless Access: Smoothly run critical apps on Mac, Windows, or Linux platforms while cutting Total Cost of Ownership (TCO); 2. Deployment Without Complexity: Parallels Workspace Solutions can be deployed in hours with minimal specialized training; 3. Ultimate IT Flexibility: Support workloads across hybrid, multi-cloud, and on-premises environments, protecting enterprises from vendor lock-in; 4. Stronger Security: Modern encryption and login technology to keep your data safe with high-class protection while staying fast and smooth; and 5. Localized Southeast Asia Support: Dedicated focus on key Southeast Asian markets including Malaysia, Thailand, the Philippines, Taiwan, Vietnam, and Indonesia, helping customers and partners access localized expertise, deployment support, and faster regional engagement.Moving forward, Clientron will continue to expand its footprint in Asia, working closely with channel partners to promote Parallels solutions and help enterprises build 'Smart Secure Workspaces' for the future.Deliver secure apps and desktops via Parallels RAS with simple VDI and seamless remote access.Credit: Clientron

Rugged edge computing brand – Cincoze will participate in Automate 2026 in Chicago, USA, from June 22–25 (Booth #861). Under the theme of "Empowering Smart Automation with Edge AI," Cincoze will present its complete range of Edge AI computing and automation solutions across four dedicated zones, including DIN-Rail Computers, Industrial Panel PCs and Monitors, Rugged Embedded Computers, and GPU Embedded Computers.DIN-Rail Computers Zone: The Optimal Computing Platform for Smart Manufacturing and Machine VisionThe Machine Computing — MAGNET product line is engineered for machine vision and smart manufacturing. The flagship MD-3000 Series, winner of the 2026 iF Design Award, will be on display, showing its powerful computing performance, flexible expandability, compact form factor, and DIN-rail installation. In addition to wide temperature and wide voltage support and EN 61000-6-2/6-4 industrial environment EMC compliance, the MD-3000 Series is powered by Intel Core desktop-class CPUs and supports up to 96 GB of DDR5 memory and dual NVMe SSDs, effortlessly handling the high-speed image processing and large-scale data storage demands of machine vision. The modular scalable architecture supports 2-, 4-, or 6-slot expansion decks with a variety of I/O interfaces, PoE modules, M.2 slots, and storage options to meet diverse integration needs. At just 150 mm in height, the compact chassis mounts on DIN rails for flexible deployment in production-line control cabinets, overcoming the challenges of space-constrained installations.Industrial Panel PCs and Monitors Zone: Complete HMI Solutions for Modern Factory ApplicationsThe Display Computing — CRYSTAL product line offers nearly 250 configurations of industrial panel PCs and monitors, covering a wide range of computing performance levels, screen sizes, display ratios, and touch technologies for harsh indoor industrial environments, high-brightness outdoor settings, and open-frame equipment integration. The entire series supports a wide temperature range and a wide voltage input, and is waterproof and dustproof, making it the go-to choice for HMI solutions in demanding industrial environments. The newly launched CV-200 Series features a ≤ 3 mm ultra-slim bezel design that combines performance with aesthetics. Its 178° wide viewing angle, Full HD resolution, and anti-glare coating ensure crisp, clear visuals even in bright indoor lighting. IP66-rated front panel protection, paired with wet touch tracking technology and EN 61000-6-2/6-4 industrial environment EMC compliance, enables long-term, reliable operation in harsh environments, making it an outstanding intelligent management solution for automated factories.Rugged Embedded Computers Zone: Built for Complex and Demanding Industrial EnvironmentsThe Rugged Computing — DIAMOND product line features six product series, all carrying UL safety certification to meet stringent international safety requirements. They support a wide temperature range and a wide voltage input, with industrial-grade protection for high levels of ruggedness and reliability, ensuring worry-free deployment. Customers can select the right model based on desired performance, form factor, power consumption, and industry-specific certification requirements. The newest model, launched in 2026 and the highlight of the show, is the DX-1300 Series, a high-performance compact embedded computer. It supports the latest Intel Arrow Lake-S Core Ultra 200S processor and up to 6400 MHz DDR5 ECC memory, providing ample computing power for Edge AI applications and high-end image processing. Extensive I/O options and diverse expansion capabilities cover all application needs. The compact chassis, combined with a high-end processor and versatile expandability, makes it particularly well-suited for applications that demand high performance in space-constrained installations.GPU Embedded Computers Zone: Full Coverage for Every Edge AI Workload, from Light to HeavyThe GPU Computing — GOLD product line features three series designed to meet different tiers of AI application needs. The GJ Series is purpose-built for entry-level, Light AI applications, featuring NVIDIA Jetson SoM GPUs that deliver efficient AI acceleration with minimal power consumption. For mid-range AI workloads, the GM Series, which supports MXM GPU modules, is the recommended choice. On display is the award-winning GM-1100 Series, recipient of the 2025 Red Dot Design Award and the 2026 Taiwan Excellence Award, delivering outstanding computing performance in a compact chassis, combined with industrial-grade ruggedness and environmental resilience for autonomous mobility equipment, automotive, and image recognition applications. The GP Series excels at Heavy AI workloads, supporting Intel Core CPUs and up to two 300W full-length GPU cards. Three patented designs for expansion, thermal management, and vibration-resistant locking address key user pain points and help customers tackle the most complex and demanding Edge AI applications.

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications. Through this collaboration, Nuvoton will combine its tethered XR Glass–optimized SoCs with Snapdragon XR platforms, and its software ecosystem to accelerate the development and deployment of tethered XR Glass applications and to support industry expansion.XR glasses are increasingly being adopted, particularly in industrial and enterprise fields, for use cases such as operational support, remote assistance, and information visualization. At the same time, achieving compact and lightweight designs, long battery life, and comfortable user experience remains a key challenge for broader market adoption.Nuvoton has been providing SoCs that balance the processing performance and low power consumption required for tethered XR Glass applications. Through this collaboration with Qualcomm Technologies, Nuvoton aims to create an environment that enables more device manufacturers and developers to more easily enter the tethered XR Glass industry.Qualcomm Technologies'newest XR platform, Snapdragon Reality Elite, combined with Nuvoton's SoC, enables a practical and scalable tethered optical see-through (OST) architecture that balances performance, power efficiency, and system flexibility. This configuration allows computing intensive XR workloads to remain on the tethered device while delivering high quality, low latency display and sensor data to lightweight glasses. Together, Snapdragon Reality Elite and Nuvoton’s SoC form a strong foundation for OEMs to accelerate time-to-market for tethered OST designs while maintaining a clear path for future system evolution.Key Collaboration AreasEvaluation of optimized tethered XR Glass configurations by combining Nuvoton's SoCs with Qualcomm Technologies' XR platforms and related technologies.Nuvoton positions its SoC as a key enabler of AI-driven tethered XR platforms. The SoC provides a scalable architecture that decouples application processors from display and sensor subsystems, including cameras and microphones.By abstracting complex interfaces, it helps device manufacturers accelerate time-to-market, reuse designs across product generations, and optimize system performance and power efficiency, particularly for smart glasses.In addition to tethered XR Glass applications, the SoC supports emerging use cases such as agentic AI experiences by simplifying system integration and enabling flexible system architectures. Within the XR ecosystem, Nuvoton works with Qualcomm Technologies, OEMs, and partners at a platform level, supporting the evolution of XR as a next-generation AI computing platform.Value Proposition and BenefitsThrough this collaboration, the adoption of Nuvoton's XR Glass SoCs is expected to deliver the following benefits:1.A comfortable user experience enabled by high-performance, low-power designs optimized for tethered XR Glass use cases. 2.Superior connectivity and access to a rich software ecosystem through compatibility with Qualcomm Technologies platforms. 3.Reduced development effort and shortened time-to-market. 4.Support for a wide range of applications, from industrial to enterprise use cases."This collaboration with Qualcomm Technologies represents an important step in expanding the applicability of our SoC solutions for tethered XR Glass and emerging AI-driven XR platforms." said Ken Su, Vice President of Cloud Security Business Group at Nuvoton Technology Corporation."By working together within the ecosystem, we aim to support our customers in bringing innovative smart glasses and next-generation devices to market more efficiently.""By working with Nuvoton to pair Snapdragon XR platforms with their optimized SoC, we aim to support lightweight optical see-through designs that balance performance, power efficiency and system flexibility. This collaboration builds toward the next phase of the XR ecosystem." Sahil Bansal, Senior Director, Product Management at Qualcomm Technologies remarked.For more information.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers."The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK hynix, adding that "We will work closely with partners for mass production in a timely manner." The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models. These enhancements improve data processing capabilities for AI training and inference.The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments. This enables customers to increase efficiency in processing data for AI datacenters and large-scale computing systems. SK hynix utilizes Advanced MR-MUF technology for HBM4E products to achieve a 48GB capacity in a 12-layer stack while ensuring structural stability. In particular, the company has also improved heat resistance by 17 percent, compared to the preceding HBM4, enabling stable operation of memory chips in high-performance computing environments.SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4. Leveraging its market-proven product reliability and supply capabilities, the company will support the development of next-generation infrastructure while helping address AI system bottlenecks. "SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise," said Ahn Hyun, President and Chief Development Officer, adding, "Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator."Credit: SK hynix

Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material and Celeritas HM001 is a near-zero CTE material. Used together in a single stackup, they bring board CTE below 10 ppm/°C while simultaneously delivering Tier 9 electrical performance.Every hyperscaler building AI infrastructure is confronting the same pair of converging constraints. As AI accelerators scale beyond reticle limits, thermomechanical mismatch between silicon (2–4 ppm/°C) and standard PCB materials (~18 ppm/°C) produces catastrophic reflow warpage, package bow, and solder joint fatigue. Simultaneously, the explosive growth in data rates, driven by HBM, UCIe, and chip-to-chip interconnect operating at 100+ Gbps, is pushing signal integrity requirements beyond what standard PCB dielectrics can support. The industry has been searching for two separate solutions to two separate problems. ACCM has built one material family that addresses both.The industry's leading proposed fix of solid glass substrates remains positive in CTE and does not address the electrical side at all. ACCM today announced Celeritas HM50 and Celeritas HM001, which together solve both problems simultaneously. Programs can start today.Celeritas HM50 FEA – Standard PCB at 18 ppm/°C (left) vs. PCB with HM50 at 10 ppm/°C (right). FR4 PCB baseline fails JEDEC qualification, while the PCB with HM50 shows >100× improvement. Warpage and Package Bow are reduced by 64%, and 81%, respectively. Combined HM50+HM001 stackups achieve even lower effective CTE.Keshav Amla, COO of Advanced Chip & Circuit Materials, said,"Rather than incrementally tuning stackups, we are applying a breakthrough materials innovation to remove a fundamental limitation that has constrained system scaling. HM50, with its negative CTE of -8 PPM/°C, drives the effective CTE of the board down. Even with heavy copper designs, you could tune a board down to 12, 10, 8 PPM/°C or lower. And where next-generation data rates demand extreme loss performance, HM001 replaces those layers with a Tier 9 loss material that has a near-zero CTE. Together, they give designers headroom they simply have not had before."The HM Class of materials matches each layer type in an AI accelerator stackup with a material purpose-built for it: HM50 for the power planes, HM001 for the signal layers. As AI accelerators grow in scale, the industry has long struggled with two separate problems — boards warping under thermal stress, and signal loss at extreme data rates. ACCM's Celeritas material family tackles both within a single solution. Celeritas HM50 counteracts the thermal expansion mismatch that causes warpage and solder joint failures, enabling designs that previously failed industry qualification to now meet it with significant margin. Celeritas HM001 addresses the signal integrity side, supporting the data rate demands of next-generation AI interconnects while also contributing to thermal stability. Together, the two materials give chip and board designers headroom that standard PCB materials have not been able to provide. For more details, please visit here.Credit: Advanced Chip and Circuit Materials

As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation technologies, from enterprise data centers (EDCs) and AI PCs to the Internet of Things (IoT) and 6G communications, require unprecedented bandwidth. However, as data rates climb, ensuring signal integrity during semiconductor testing becomes exponentially more difficult. Even slight impedance mismatches or signal degradation can trigger false failures, compromise yields and delay critical product launches.To address these fundamental industry challenges, Smiths Interconnect, a Molex company, has introduced the DaVinci Gen V test socket. Built upon a patented mechanical foundation, this fifth-generation coaxial test socket provides an out-of-the-box solution engineered to overcome impedance tuning and signal degradation hurdles. The product rigorously tests semiconductor chips during manufacturing to ensure they deliver ultra-reliable, lab-grade accuracy in high-volume production environments.Core Mechanical InnovationsThe performance of the DaVinci Gen V is rooted in its core mechanical innovations. A new signal cavity design allows for superior impedance control, establishing a cleaner and more reliable signal path. This is achieved through enhanced conductor-to-ground concentricity, which minimizes signal degradation and surpasses all previous DaVinci series models. The socket utilizes spring probe technology featuring a homogeneous alloy plated with gold to ensure better grounding. These precision probes deliver a consistent, stable contact resistance averaging as low as 33 milliohms and boast a long contact life that has been tested up to 500,000 insertions.Electrical Performance and Signal IntegrityThe electrical performance of the DaVinci Gen V sets a new benchmark for semiconductor validation. Designed to overcome the physical challenge of scaling impedance for next-generation chips, the socket supports staggering digital speeds. It enables unprecedented signaling speeds of up to 224Gbps PAM-4 for AI accelerators and speeds beyond 100 GHz for future 6G networks.In terms of RF characteristics, the DaVinci Gen V delivers a bandwidth greater than 84 GHz at a -1 dB insertion loss. The architecture utilizes a short signal path with a 4.90mm test height and the impedance can be precisely tuned to match the system or be defined as needed.Operational and Manufacturing AdvantagesBeyond raw speed, the DaVinci Gen V is engineered for streamlined, scalable manufacturing. The socket accommodates high co-planarity and features a tri-temp design capable of operating in extreme environments ranging from -55°C to 150°C. This robust mechanical performance ensures that the exact same socket can be utilized across manual test, bench test and high-volume manufacturing production test stages, guaranteeing consistency.Recognizing that modern integrated circuits are rapidly growing in complexity and size, the DaVinci Gen V was designed to easily accommodate an increase in next-generation ASIC (application specific integrated circuit) sizes. Despite this scalability, it maintains full compatibility with existing test hardware and PCB socket footprints. This backward compatibility allows manufacturers to transition effortlessly, saving costs, reducing development cycles and significantly accelerating time-to-market. The socket is also highly serviceable in the field, permitting the replacement of a single probe or the full array, and can be cleaned while the system is running using a cleaning surrogate.Target End Markets and Proven ApplicationsThe broad capabilities of the DaVinci Gen V make it well suited for a wide range of advanced semiconductor applications. Target end markets include data center processors such as CPUs and GPUs, AI accelerators and ASICs, high-performance computing and tensor processors, network switches and FPGA-based 224G SerDes devices, as well as autonomous vehicle and ADAS chips. As demand for higher bandwidth and faster data processing continues to grow, these applications require increasingly stringent testing accuracy and signal integrity performance.Its effectiveness in high-stakes, high-volume environments is already proven. Since the product's launch, Smiths Interconnect has secured a key program with a leading technology company to support their advanced AI GPU accelerator chips.Building on this initial success, the company was subsequently awarded a next-generation accelerator chip program with the same partner. This continued partnership  underscores the superior performance, innovation, and reliability of Smiths Interconnect’s test socket technology.The DaVinci Gen V test socket redefines high-speed semiconductor testing by combining advanced, patented insulated metal technology with precision impedance tuning. It effectively eliminates measurement errors while guaranteeing lab-grade accuracy and repeatability in robust production settings. By enabling the reliable validation of high-bandwidth devices, the DaVinci Gen V ensures that manufacturers are fully equipped to meet the performance demands and future-readiness requirements of tomorrow's most complex integrated circuits. Contact Smiths Interconnect  to learn more.DaVinci Gen V supports AI accelerators, GPUs and data center processors. Credit: Smiths Interconnect

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers.DIN-Rail Computers Zone: The Premier Solution for Machine VisionThe Machine Computing - MAGNET product line is engineered for machine vision. The flagship MD-3000 series of high-performance, scalable DIN-rail computers, and winner of the 2026 iF Design Award, will be on display, with live demonstrations of its highly modular system configuration and application flexibility. At just 150 mm in height, the MD-3000 Series fits seamlessly into production-line control cabinets. Powered by Intel Core desktop-class CPUs and supporting up to 96GB of DDR5 memory and dual NVMe SSDs, it effortlessly handles the high-speed image processing and storage demands of machine vision applications. The modular expansion architecture supports 2-, 4-, or 6-slot expansion decks for flexible addition of I/O interfaces, storage, and wireless modules. Wide temperature and wide voltage support, along with EN 61000-6-2/6-4 industrial EMC compliance, ensure stable operation even in high-interference environments.Industrial Panel PCs and Monitors Zone: Industrial HMI Blending Aesthetics and PerformanceThe Display Computing - CRYSTAL product line offers a diverse range of models with comprehensive options for computing performance, screen sizes, display ratios, and touch technologies. Applications span harsh indoor industrial environments, high-brightness outdoor settings, and open-frame installations for seamless equipment integration. Across the entire lineup, industrial-grade materials, wide temperature and wide voltage designs, and up to IP66-rated front panel protection provide reliable HMI solutions for demanding environments. The highlight is the new ultra-slim bezel industrial panel PC, the CV-200 Series, featuring a ≤ 3 mm ultra-thin bezel, Full HD resolution, a 178 degrees wide viewing angle, and anti-glare treatment, making it an ideal solution for efficient human-machine interaction and intelligent management in modern automated factories.GPU Embedded Computers Zone Meeting Every Level of Edge AI Demand. Credit: Cincoze Rugged Embedded Computers Zone: Solid Foundation for Diverse Harsh EnvironmentsThe Rugged Computing - DIAMOND product line is purpose-built for harsh industrial environments. Its six product series share core rugged standards, including wide temperature range, wide voltage input, and industrial-grade protection, and the entire lineup carries UL safety certification for internationally recognized reliability and safety. Customers can select the right model based on computing performance, expandability, form factor, power consumption, and industry certification requirements. The DX-1300 Series, the newest model launched in 2026, is a high-performance compact embedded computer that supports an Intel Arrow Lake-S Core Ultra 200S processor in a compact 242×173×75 mm chassis, making it easy to deploy in space-constrained environments for complex Edge AI workloads. The DX-1300 Series also offers extensive expansion capabilities, including diverse I/O options and built-in M.2 B/E Key slots, supporting equipment integration, data acquisition, and wireless communication.GPU Embedded Computers Zone: Meeting Every Level of Edge AI DemandThe GPU Computing -  GOLD product line features three series, each designed to meet a different tier of AI application needs. The GJ Series targets entry-level, Light AI applications, featuring NVIDIA Jetson SoM GPUs for low power consumption and efficient AI acceleration. The GM Series, which supports MXM GPU modules, is a popular choice for Medium AI and Edge AI applications. On display is the award-winning GM-1100 Series, recipient of the 2025 Red Dot Design Award and the 2026 Taiwan Excellence Award, combining powerful CPU and GPU performance, a compact form factor, and outstanding environmental adaptability for autonomous mobile equipment, automotive AI, and image recognition applications. The flagship GP Series supports up to two 300W high-end GPU cards and features three patented technologies for thermal management, expansion, and locking mechanisms, making it the top choice for Heavy AI applications. For more information, please visit www.cincoze.com, or contact us by email: info@cincoze.com. Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026. Credit: Cincoze

DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and next-generation memory products designed for both enterprise and consumer markets.As artificial intelligence continues to reshape global business, content creation, gaming, and digital workflows, storage has become a critical foundation of AI infrastructure. At COMPUTEX 2026, DATOTEK demonstrated how intelligent storage, AI-assisted data management, advanced cooling solutions, and sustainable product development can support the next generation of AI computing and intelligent storage innovation.Explore QTARS, our premium edge AI-assisted portable storage. Credit: Datotek Inc.AI Storage Solutions for Edge AI Computing and Intelligent Data ManagementAt Booth I1124 in the Component and Advanced Power Technology Zone, DATOTEK introduced the AI QTARS and AI QUASAR MagSafe Portable SSDs, two AI-powered storage solutions designed to bring intelligent data processing directly to users through edge AI computing. The devices integrate Generative AI applications, Retrieval-Augmented Generation (RAG) intelligent search, AI knowledge retrieval, multi-factor data encryption, S.M.A.R.T. 2.0 drive health monitoring, and intelligent document management.By combining AI-assisted workflows with high-speed USB4 connectivity, users can summarize documents, organize digital assets, retrieve information, and manage data with greater privacy, efficiency, and control. These portable SSDs are positioned for enterprise customers, system integrators, technology partners, creators, and mobile professionals seeking practical AI storage solutions for modern business and creative environments.The AI QTARS and AI QUASAR Portable SSDs also combine secure MagSafe-compatible attachment technology with a clean silver-white minimalist design, creating a storage platform that is both functional and accessible. This combination strengthens their appeal for buyers searching for AI portable SSD, USB4 SSD, edge AI storage, and smart external storage solutions.Advanced PCIe Gen5 Thermal Solutions for AI InfrastructureAs AI workloads continue to expand across data-intensive environments, thermal management has become essential for maintaining SSD reliability and performance. At COMPUTEX 2026, DATOTEK showcased the AEROFIN PCIe Gen5 SSD Active Cooling System, an advanced thermal solution engineered for AI workstations, high-performance gaming systems, content creation platforms, and enterprise computing environments.The AEROFIN solution combines an ultra-slim active cooling architecture, a high-density skived-fin heatsink design, and precision micro cooling fan technology to improve thermal dissipation efficiency. By minimizing thermal throttling and maintaining stable SSD performance under sustained workloads, AEROFIN helps enhance long-term stability, system reliability, and storage efficiency.For buyers searching for PCIe Gen5 SSD cooling solutions, Gen5 thermal management, AI workstation hardware, and enterprise storage infrastructure, AEROFIN delivers a compelling answer designed for the AI era. It also supports DATOTEK's positioning as a provider of performance-driven, sustainable hardware innovation.ARES Q4+ USB4 Portable SSD designed for professional creators. Credit: Datotek Inc.USB4 Portable SSD Designed for Professional CreatorsAt Booth L2006 in the Taiwan Excellence Pavilion, DATOTEK presented the ARES Q4+ USB4 Portable SSD, a premium high-speed storage solution for professional creators, videographers, photographers, and mobile professionals. Powered by USB4 Gen3x2, the ARES Q4+ delivers transfer speeds of up to 4,000 MB/s and is optimized for 4K and 8K video production, direct recording workflows, fast backup operations, and cross-platform content creation.The device features a durable aluminum alloy enclosure for structural protection and efficient heat dissipation, while its MagSafe-compatible magnetic attachment system improves convenience for mobile workflows. This makes the ARES Q4+ especially relevant for users and buyers searching for USB4 portable SSD, high-speed external SSD, creator storage, and MagSafe SSD solutions.As AI-assisted content creation becomes increasingly common, portable high-speed storage solutions remain essential for professionals seeking fast, reliable, and secure data management. The ARES Q4+ aligns with both B2B procurement needs and B2C premium product demand across international markets.DATO microSD cards deliver high-speed storage for gaming and mobile devices. Credit: Datotek Inc.High-Speed Memory Solutions for Gaming and Mobile DevicesAt Booth R0902 in the SD Association Pavilion, DATOTEK showcased its professional-grade microSD memory card portfolio for gaming, drones, smartphones, action cameras, and professional imaging devices. The microSD Express Card is built on PCIe Gen3x1 and NVMe architecture, delivering read and write speeds of up to 800 MB/s and 700 MB/s while maintaining backward compatibility with UHS-I devices.The microSD Advance+ Card supports capacities from 128GB to 1.5TB and complies with UHS-I U3 and V30 standards, making it suitable for 4K video recording, mobile content creation, drone applications, and professional photography. The microSD Lightning Card supports UHS-II technology and V60 video performance, delivering read speeds of up to 280 MB/s and write speeds of up to 180 MB/s for professional cameras, handheld gaming systems, and demanding multimedia workflows.Together, these products strengthen DATOTEK's visibility in search queries related to microSD Express, high-speed memory card, gaming storage, and mobile storage solutions. They also provide a broader product story that connects performance, portability, and application diversity.Sustainable AI Computing and the Future of Intelligent StorageBeyond performance innovation, sustainability remains a core pillar of DATOTEK's long-term strategy. The company continues to advance green supply chain initiatives, environmentally responsible product development, intelligent cooling innovation, and sustainable manufacturing practices throughout its memory and storage portfolio.As AI adoption accelerates worldwide, DATOTEK believes future storage technologies must be faster, smarter, more energy-efficient, and more environmentally responsible. By integrating AI-powered storage solutions with sustainable computing principles, the company is helping build a smarter and more sustainable digital future.AI Together: Accelerating Global Digital TransformationCOMPUTEX 2026 highlighted how collaboration across AI, storage, computing, and sustainability ecosystems can accelerate innovation worldwide. Guided by its core philosophy of Technology Innovation and Sustainable Development, DATOTEK remains committed to advancing AI-powered storage, intelligent memory technologies, enterprise AI infrastructure, and next-generation computing solutions.From AI portable SSDs and PCIe Gen5 thermal management systems to USB4 storage solutions and high-performance memory products, DATOTEK continues to empower creators, gamers, enterprises, distributors, and technology partners worldwide to unlock the full potential of the AI era. Visitors seeking AI-powered storage solutions, sustainable AI infrastructure, enterprise storage technologies, and next-generation memory products are invited to explore DATOTEK's innovations and discover how the company is shaping the future of intelligent storage. For more information, please visit Datotek Official Website and Datotek Facebook Page. 

The global semiconductor industry is undergoing profound transformation-not only in process technologies and transistor density, but also in the composition of its workforce. Taiwan, the undisputed center of advanced semiconductor manufacturing, is increasingly attracting a new generation of technical talent: female engineers. By choosing Taiwan as the starting point of their professional journeys, these women are bridging the gap between academic training and industrial practice, while bringing fresh perspectives to a field that depends on precision, resilience, and collaboration.The Industrial Development Administration under the Ministry of Economic Affairs is committed to building a comprehensive support and training ecosystem for international talents in Taiwan. The program covers key semiconductor technologies, cross-cultural communication, and local integration, while also leveraging online learning resources that connect talent across regions.Designed to help outstanding international students and professionals transition smoothly into Taiwan's semiconductor industry, the initiative provides early exposure to the local industrial ecosystem and offers diverse mentorship and support services to strengthen long-term adaptation and career development in Taiwan. Through these efforts, Taiwan aims to foster a more inclusive environment for global talent while enhancing the international competitiveness of its semiconductor industry.Through the stories of Phan Thi Kim Ngan from Vietnam and Alyana Denise Ramirez from the Philippines, a broader narrative emerges-one defined by perseverance, cross-cultural adaptation, and a shared ambition to shape the future of technology.A Strategic Choice: Why Taiwan?For many aspiring engineers across Southeast Asia, Taiwan represents the pinnacle of the global semiconductor industry-a place where innovation is not only developed, but realized at scale.Alyana Denise Ramirez, an A3 EE Assistant Engineer at ASE and a student at I-Shou University, says she came to Taiwan driven by both purpose and opportunity. For her, working in Taiwan provides a critical pathway to career growth, allowing her to directly apply academic knowledge in real industrial settings.Phan Thi Kim Ngan, who recently completed her Master of Science in Electrical Engineering at National Yang Ming Chiao Tung University (NYCU), shares a similar perspective. Coming from Vietnam-a rapidly developing economy with strong momentum in manufacturing and services-she found Taiwan' highly specialized ecosystem in semiconductors, AI, and computer science to be a decisive attraction.  "Taiwan is the leader in semiconductor manufacturing in the world, and there is no better place to learn the most advanced technology in semiconductor than here," said Ngan.This close proximity to the "real industry" is one of the strongest motivations for international students who want to see their ideas move beyond the classroom and into production lines that power the global technology supply chain.The Female Edge in EngineeringWhen asked what unique perspectives female engineers bring to the industry, both women point to structured thinking, adaptability, and diversity in problem-solving.Alyana observes that female engineers often bring stronger attention to detail and greater creativity when addressing technical challenges. This helps prevent solutions from becoming one-dimensional and ensures that multiple perspectives are considered before final decisions are made.For Kim Ngan, building influence within a team - especially in multinational environments - is less about speaking the most and more about building reliability over time.By consistently following through on commitments and communicating clearly, she found that trust and influence develop naturally.The Philosophy of Consistent Small ImprovementsEntering the high-pressure world of semiconductor manufacturing and AI development can be intimidating. Kim Ngan recalls her early experiences in team discussions, where she often felt uncertain and hesitant to speak up.Rather than trying to solve every challenge at once, she adopted a philosophy of steady, incremental growth."Growth does not come from sudden breakthroughs, but from consistent small improvements," Kim Ngan says.This methodical mindset often meant spending nearly an hour preparing a single question for her supervisor-ensuring both clarity and confidence before speaking. Such discipline reflects the essence of engineering: breaking down complex challenges into manageable, solvable steps.Bridging Cultural and Communication GapsWhile technical challenges are significant, cultural adaptation can be equally demanding. For Alyana, the greatest challenge was not engineering itself, but language. "Chinese is not my forte," she admits, noting that learning Mandarin has been one of the most difficult aspects of both studying and working in Taiwan. She hopes to pursue a master's degree abroad in the future after gaining more professional experience and further advancing her career.Language barriers remain one of the key challenges in retaining international talent. Recognizing this, ASE provides Mandarin classes to support foreign employees' workplace integration. Alyana believes language is essential-not only for work efficiency, but also for building friendships and stronger professional relationships.Kim Ngan also observed distinct workplace differences in Taiwan, particularly in how professionals think, communicate, and present ideas during meetings. During her internship at Micron, she learned that even seemingly small pieces of data can influence decisions across multiple teams.This experience taught her that engineering is not only about technical accuracy, but also about how ideas are communicated, applied, and shared across highly collaborative environments.Corporate Support and the Pursuit of StabilityTaiwan's semiconductor companies increasingly understand that attracting talent is only half the challenge-retention is the true long-term priority. As a result, many companies are building workplace environments that emphasize employee well-being, career development, and long-term stability.Specialized Healthcare: ASE provides female-focused healthcare services, including pap smears and pregnancy-related health checkups through its on-site clinics.Mentorship: Supervisors and team leaders offer constructive feedback and help international engineers prepare for major presentations, reducing anxiety and strengthening confidence.Financial & Career Growth: Competitive salaries and clearly defined career development paths are key reasons many foreign professionals choose to remain in Taiwan long-term.Daily Life Stability: Public safety, convenient transportation such as HSR and MRT systems, and accessible 24-hour public amenities create a stable and low-stress living environment.Integration Beyond the WorkplaceLife for these engineers extends far beyond laboratories and cleanrooms. Integration into local communities often happens through shared everyday experiences-playing tennis with Taiwanese colleagues, gathering during Lunar New Year celebrations, singing together, and sharing traditional foods from home.Kim Ngan finds comfort in the similarities between Taiwanese and Vietnamese cuisine, while also enjoying introducing her colleagues to Vietnamese spring rolls. These moments of cultural exchange help foster the trust and mutual understanding that she believes form the foundation of strong teams.A Message to the Next GenerationBoth women share a clear message for young female students in their home countries: the opportunity is real, and the door is open.Alyana encourages them not to fear continuous learning or change. Kim Ngan offers equally practical advice: "You do not need to be fully ready to begin-you only need to be willing to make mistakes and keep learning."Taiwan's semiconductor industry is more than a collection of factories; it is an ecosystem that offers a genuine stepping stone for ambition, growth, and long-term career development.As Kim Ngan prepares to begin her full-time career at Micron following graduation, her journey stands as proof that with curiosity, persistence, and the right support system, the future of engineering is becoming increasingly global-and increasingly female.By emphasizing consistency, reliability, and the connection between theory and practice, these women are not simply participating in the industry-they are helping lead its transformation toward a more inclusive and innovative future.