j5create, a global leader in 3C peripherals and smart workspace solutions, is showcasing a comprehensive lineup of new smart connectivity products at COMPUTEX 2026. Focusing on cross-device collaboration, wireless audio/video (AV), smart desktops, and AI-integrated applications, the exhibition demonstrates how j5create is expanding beyond traditional connectivity hardware to deliver a more intuitive, unconstrained digital experience.The year 2026 marks the 16th anniversary of the j5create brand. Originating from foundational 3C peripherals and adapters, j5create has consistently leveraged its core expertise in USB and video transmission technologies to expand product applications and user scenarios. Moving from "device connectivity" to "smart connectivity," the company is redefining how humans and devices interact within the modern digital experience.As hybrid work, mobile content creation, remote collaboration, and multi-device setups become the norm, users face challenges that go beyond a simple "lack of ports." The true demand lies in making the transition between different devices and spaces natural and seamless.At this year's exhibition, j5create centers its showcase on the core philosophy of  "Enabling Freedom of Flow in Digital Work and Life".  By introducing diverse solutions across smart desktops, cross-device collaboration, wireless AV, content creation, and AI applications, the company re-imagines how modern users interact with technology.JCD3195 — 4K144 Dashboard DockNext-Gen Dashboard Dock Redefines the Desktop Interaction ExperienceThe JCD3195 transcends traditional docking stations by integrating desktop connectivity, real-time information, and personalized interaction into a single device.As modern desks simultaneously host work, entertainment, creation, and communication, the dock is no longer just a hub hidden behind a monitor. Featuring a built-in interactive dashboard, the JCD3195 seamlessly integrates device status, world clocks, personalized imagery, and real-time data directly into the workspace—transforming the desk from a mere workstation into an intuitive digital interaction center.The product supports 4K @ 144Hz, 2K @ 240Hz, and 140W Power Delivery, catering to the demanding needs of high-performance workstations, content creators, and high-refresh-rate gamers, while signaling a new direction for smart workspaces and high-efficiency connectivity.JUAW22 — CrossLink Wireless Dongle AdapterAeroDrop Cross-Device Solution Makes Collaboration IntuitiveAs laptops, tablets, and smartphones become increasingly slim, physical ports on modern devices continue to disappear. This trend—especially prominent within mobile ecosystems and Apple environments—has turned cross-device data transfer and workflow switching into a widespread user pain point.As j5create's cross-device connectivity product incorporating its proprietary  "AERO DROP"  concept, the JUAW22 is more than a file transfer tool; it symbolizes a freer, more intuitive way for devices to interact.The adapter supports second-screen extension between Windows and iPad, mouse and keyboard sharing, clipboard synchronization, and AirDrop-like file transfers. This ensures files, displays, and workflows flow naturally across different operating systems.By delivering a seamless cross-platform experience, the JUAW22 liberates multi-device users from ecosystem and hardware constraints, re-linking disparate device scenarios in modern digital life.JVAW87 — ScreenCast 4K60 Wireless Display ExtenderThe New Flagship Wireless Display Solution for Premium AV ExperiencesAs the next-generation flagship of the j5create ScreenCast series, the JVAW87 packs high-definition, low-latency, and high-refresh-rate wireless transmission into a compact form factor. It enhances the practicality of wireless AV for entertainment, gaming, and cross-space scenarios, standing as the world's smallest 4K60 wireless display transmitter.Unlike conventional wireless display adapters that focus primarily on business presentations, the JVAW87 prioritizes premium, real-time AV experiences, supporting 4K @ 60Hz wireless transmission, 2K @ 144Hz / 1080p @ 240Hz high refresh rates, and ultra-low latency of under 30ms.These specifications ensure high-resolution media remains smooth and stable in a wireless environment. Additionally, the device supports DRM and HDCP technologies, allowing direct streaming of copyright-protected content from platforms like Netflix, Disney+, and Prime Video, thereby offering a complete solution for home entertainment and mobile media sharing.Furthermore, the JVAW86 and JVAW87 utilize a shared receiver architecture. Users can expand their setup with different transmitter (TX) versions based on their needs, creating a highly flexible wireless AV ecosystem and expanding j5create's overall footprint in the Wireless AV market.Simultaneous Expansion into Creator and AI ApplicationsIn addition to its flagship offerings, j5create is debuting several new products tailored for content creators and professional collaboration. The JCA3625 USB-C 4K Dual Display HDMI Video Capture Mini Dock integrates multi-monitor display, HDMI capture, and Picture-in-Picture (PiP) functionality to help creators and multitaskers build a more flexible content creation workspace. The JVK202 4K USB KVM with ALT Mode offers a software-free, browser-operated KVM control solution that simplifies multi-device collaborative demands. The JCDP4140 Dual 4K Powerbase Docking Station features a built-in power supply and integrated cable management to help users achieve a clean, clutter-free desktop. And the JSS830 3-in-1 Recording Speakerphone combines a speakerphone, voice recorder, and AI summarization capabilities, allowing meetings, interviews, and learning sessions to be transcribed and shared efficiently.Redefining the Modern Digital Experience Through Smart ConnectivityFrom its origins in baseline 3C peripherals to its current breakthroughs in smart desktops, wireless AV, cross-device collaboration, and AI integration, j5create continues to push the boundaries of digital life and work through smart connectivity technologies.From desktops to mobile devices, and from content creation to AI-driven collaboration tools, j5create is redefining the role of "connectivity" in modern life across its diverse product lines, moving steadily toward a freer and more intuitive digital experience.COMPUTEX 2026 Exhibition Informationj5create is exhibiting at COMPUTEX 2026 from June 2 to June 5 at the Taipei World Trade Center (TWTC), Exhibition Hall 1, Booth A333b.For more information, please visit the official j5create website. 

PEGATRON Corporation (PEGATRON) officially opened its booth at COMPUTEX 2026, presenting its AI Tech Maker strategy and its role in helping move AI from infrastructure planning to real-world deployment.The showcase spans AI infrastructure, edge and industrial AI, autonomous systems, and physical AI applications. Together, these solutions reflect PEGATRON's focus on turning AI technologies into deployable systems through its design, manufacturing, and system integration capabilities.On the opening day, PEGATRON's booth welcomed President William Lai and NVIDIA Robotics Software Product Line Manager Spencer Huang. The visit included exchanges on AI infrastructure and physical AI applications. SIMBA II also joined the on-site demonstration, delivering a corporate gift made with circular materials to President Lai and offering a practical look at the robot's mobility and interaction capabilities in a live exhibition setting.During the exhibition, several international industry representatives also attended as invited guests of the opening ceremony, including AMD, Intel, Micron, Sagemcom, FUJISOFT, Chunghwa Telecom, Far EasTone Telecommunications, and Swiss precision drive technology company maxon. The participation of companies across computing, memory, communications, software services, and precision drive systems reflects the broader industry focus on connecting AI infrastructure with real-world applications.COMPUTEX is one of the world's major technology industry platforms. Under this year's theme,“AI Together,” the show brings together more than 1,500 exhibitors from 33 countries and focuses on AI computing, robotics and smart mobility, and next-generation technologies. As generative AI, agentic AI, and physical AI continue to advance, industry discussions are expanding from chips and servers to edge deployment, smart manufacturing, robotics, next-generation communications, and end-user applications.PEGATRON Chairman T.H. Tung said the AI industry remains in a phase of rapid development. Applications are moving from cloud and data centers into robotics, autonomous systems, smart healthcare, and everyday environments. In recent years, PEGATRON has continued to invest in AI servers, Digital Twin technologies, and physical AI, using its design, manufacturing, and system integration capabilities to help customers turn next-generation AI technologies into deployable products and systems.In response to this shift, PEGATRON's COMPUTEX showcase goes beyond individual products. Built on its design and manufacturing services (DMS) capabilities, the company connects computing, connectivity, sensing, mechanical design, and system engineering to demonstrate a path from AI infrastructure to field deployment.

PEGATRON Corporation (PEGATRON) announced a strategic collaboration with maxon, the Switzerland-based precision drive technology company. The two companies will jointly develop robotic joint drive technologies, motor modules, and integrated robotic systems. The collaboration will make its public debut at COMPUTEX 2026.At the exhibition, PEGATRON's  second-generation quadruped robot platform, SIMBA II, will integrate maxon's  High Efficiency Joint 90 (HEJ 90) system. PEGATRON said the collaboration focuses on motion control, sensing integration, and edge AI computing for autonomous systems, with the goal of improving robotic mobility and operational stability in complex environments.Headquartered in Switzerland, maxon specializes in precision motors and drive systems. Since its founding in 1961, the company has focused on high-precision electric drive technologies for applications including medical equipment, industrial automation, mobility systems, aerospace, and robotics. The HEJ 90 is a robotic joint module developed by maxon for robotics applications. It integrates the motor, gearbox, and control components into a single compact architecture while delivering high torque output and precise motion control.SIMBA II is PEGATRON's independently developed quadruped robotics platform. Built with a modular architecture, the system supports different sensor configurations and payload modules depending on deployment requirements. The platform also integrates edge AI computing capabilities for applications including smart inspection, industrial site monitoring, autonomous mobility, and AI development. With the integration of HEJ 90, SIMBA II further improves dynamic motion performance and platform stability across complex terrain conditions.PEGATRON stated that as AI, sensing, computing, and precision drive technologies continue to evolve, robotics is becoming an increasingly important direction for next-generation intelligent hardware. The collaboration with maxon also reflects PEGATRON's continued investment in robotics platforms and autonomous system technologies.From platform architecture and key modules to full system manufacturing, PEGATRON aims to build a more flexible and customizable robotics development framework capable of supporting different deployment environments and application requirements.Looking ahead, PEGATRON and maxon will continue expanding their collaboration in robotic drive modules and system development. By combining maxon's expertise in precision drive technologies with PEGATRON's strengths in design and manufacturing services, system development, and production management, the two companies aim to accelerate the adoption of intelligent mobile robots across industrial, commercial, and specialized applications.

PEGATRON, a globally recognized total server solutions provider, today unveiled its next-generation AI infrastructure portfolio and AI factory validation framework at COMPUTEX 2026. Powered by NVIDIA Vera Rubin platform , NVIDIA HGX Rubin NVL8, and NVIDIA RTX PRO Servers, and aligned with the NVIDIA DSX AI factory reference design, Pegatron is advancing how AI factories are designed, validated, and deployed - from digital twin simulation to production-ready infrastructure.As an NVIDIA DSX ecosystem partner, Pegatron is extending AI infrastructure validation beyond traditional manufacturing by integrating SimReady digital twins and AI factory workflows into its server development and deployment process. Through the NVIDIA Omniverse DSX Blueprint Pegatron enables customers to simulate, validate, and optimize rack-scale AI infrastructure before deployment."AI factories require not only high-performance computing, but also end-to-end infrastructure intelligence,"said Gary Cheng, President & CEO of Pegatron."By leveraging NVIDIA DSX architecture, SimReady digital twins, and AI factory validation capabilities, Pegatron has strengthened both its manufacturing operations and AI infrastructure integration expertise. Together with NVIDIA, we aim to help customers simulate, validate, and optimize AI deployments, improving the scalability, reliability, and efficiency of next-generation AI data centers."NVIDIA Vera Rubin NVL72 Rack-Scale AI SupercomputerThe centerpiece of showcase is the NVIDIA Vera Rubin NVL72  Pegatron's RA4803-72N3, a fully liquid-cooled supercomputer built on the third-generation NVIDIA MGX rack design for seamless drop-in deployment into existing Blackwell data centers.Unified Fabric: Integrates 72 NVIDIA Rubin GPUs, 36 NVIDIA Vera CPUs, NVIDIA ConnectX-9 SuperNICs, and NVIDIA BlueField-4 DPUs. It scales up via NVIDIA NVLink 6 and scales out via NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-X Ethernet. Paired with NVIDIA Groq 3 LPX racks, it delivers ultra-fast trillion-parameter inference.TCO Optimization: Trains mixture-of-experts (MoE) models using 1/4th the GPUs, slashes token costs by 10X, and delivers 10X more tokens per megawatt compared to previous Blackwell architectures.NVIDIA Vera CPU: Purpose-built for agentic AI and reinforcement learning, completing workloads 50% faster with twice the efficiency of traditional CPUs.Scaling AI Factories with NVIDIA HGX Rubin NVL8Pegatron also introduced the AS210-2T1-8H3, a 2U fully liquid-cooled server based on NVIDIA HGX Rubin NVL8 with dual NVIDIA Vera CPUs or Intel Xeon 6 processors.The platform leverages NVIDIA Rubin GPUs, NVIDIA NVLink 6, NVIDIA ConnectX-9 SuperNICs, NVIDIA BlueField-4 DPUs, and NVIDIA Spectrum-X Ethernet to accelerate enterprise AI and HPC workloads.To support rack-scale deployments, Pegatron expanded the architecture into: RA4800-64H3 — supporting eight 2U systems per rack, up to 64 GPUs and 16 CPUs. RA4800-72H3 — supporting nine systems, up to 72 GPUs and 18 CPUs within a 48U liquid-cooled rack.Factory-Native NVIDIA DSX Integration and SimReady Digital TwinsBeyond hardware innovation, Pegatron showcased its NVIDIA DSX-aligned AI factory validation workflow, integrating digital twin simulation, thermal analysis, and full-load burn-in testing within the same manufacturing facility.Pegatron's L11 thermal lab combines Ansys Fluent CFD simulation, NVIDIA Omniverse digital twins, liquid cooling analysis, and power modeling to optimize AI factory infrastructure before deployment, while the L12 burn-in room validates every system at 100% TDP against DSX digital twin predictions prior to shipment.Using the NVIDIA AI Factory Digital Twin Pipeline Samples, Pegatron converts engineering data into SimReady OpenUSD assets for NVIDIA Omniverse DSX Blueprint environments, enabling customers to validate cooling, power, and rack-scale AI deployments before installation.Pegatron also highlighted PEGAVERSE, its AI-native manufacturing intelligence platform that combines simulation, factory telemetry, and AI-driven operational analysis to continuously optimize AI factory performance and efficiency.Experience the Future of AI Infrastructure at COMPUTEX 2026Pegatron invites customers, partners, and media representatives to explore its AI infrastructure and DSX-integrated digital twin ecosystem at COMPUTEX 2026.Date: June 2–5, 2026,Location: Taipei Nangang Exhibition Center Hall 1, 4F,Booth: L0104.

Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed around three core pillars: Business Development (AI Zone), Product R&D (R&D Zone), and Professional Manufacturing (Manufacturing Zone).The showcase fully highlights Chenbro's comprehensive end-to-end advantages, spanning from precise front-end business alignment and collaborative component design to high-value-added back-end manufacturing services. Furthermore, to address the massive demand fueled by the explosive growth of AI servers, Chenbro is unveiling its newly integrated "Rack Level Solution" for the very first time. Through live physical demonstrations on-site, Chenbro powerfully declares its determination and fruitful milestone achievements as it comprehensively advances into the mechanical components market.Blockbuster Debut: From Server Chassis to Rack Mechanical Integration, Expanding the Innovative Value of AI InfrastructureDriven by the rapid iteration of AI computing architectures, Chenbro officially ventured into the rack mechanical components business last year. Chenbro's CEO stated that industry trends and customer demands have clearly shifted from the "Server Level" to the "Rack Level." Embracing this trend, Chenbro has progressively expanded from traditional chassis to comprehensive rack-level solutions. The physical rack displayed at the exhibition fully demonstrates Chenbro's profound capabilities in mechanical design and manufacturing. With a deep understanding of thermal management technologies (including advanced liquid cooling solutions) and power configuration planning, Chenbro is able to start from the customers' system architecture requirements, translating complex technical demands into optimized mechanical design solutions. By co-developing rack mechanical integration solutions with clients, Chenbro helps accelerate the implementation and deployment of AI infrastructure. The CEO emphasized that amid this technological evolution, Chenbro is no longer solely focused on cost reduction (Cost down); instead, it aims to create higher value (Value up) through system-level collaborative design, truly realizing its strategic vision of becoming a "comprehensive mechanical solution partner."Closely Tracking AI Trends: Heavyweight Exhibition of Next-Generation NVIDIA MGX SolutionsIn the Off-The-Shelf (OTS) exhibition zone, Chenbro leverages modularity as its design foundation, demonstrating highly flexible configuration capabilities that fully cover four major application domains: AI, Cloud, Storage, and Edge computing. As a collaborator of NVIDIA MGX, Chenbro is publicly premiering its 1U NVIDIA Vera Rubin server chassis solution based on NVIDIA MGX, which supports the next-generation architecture. Simultaneously, it is exhibiting a full series of AI chassis products—including 1U, 2U, 4U, and 6U models—developed based on NVIDIA MGX architecture. This powerfully demonstrates Chenbro's top-tier development prowess in satisfying diverse market and customer application needs.Dual Engines of R&D and Smart Manufacturing: Innovative Collaborative Design and the Factory of the FutureTo highlight its ultimate efficiency from R&D to market realization, Chenbro showcases deep technological moats in both its JDM and OEM exhibition zones.Joint Design Manufacturing (JDM): The company displays high-U-count AI servers co-developed with clients, alongside a 21-inch chassis series compliant with OCP ORV3 specifications. By sharing its proprietary JPDP (Joint Product Design Process) and DFM (Design for Manufacturing) optimization mindsets, combined with tolerance analysis and around-the-clock technical services, Chenbro significantly enhances client collaboration efficiency and product stability.Original Equipment Manufacturing (OEM): This zone centers on "Chenbro's Factory of the Future," comprehensively introducing digital and automation technologies. By integrating big data analysis, AI, IoT, robotic arms, and AMR (Autonomous Mobile Robots), the exhibit perfectly demonstrates consistency in product quality and the maximized efficiency of its global localized production.Joining Forces: Building a Win-Win AI Server EcosystemAt this year's COMPUTEX, numerous leading global technology giants are also showcasing AI servers co-developed with Chenbro, fully validating Chenbro's pivotal position in the industry. CEO Corona Chen further pointed out that Chenbro will continue to deepen its partnerships with global CPU/GPU chip companies —such as NVIDIA, AMD, Intel, and Ampere—as well as its core clients, investing heavily in the R&D and manufacturing of next-generation high-end servers. Chenbro will keep exploring the blueprint driving the future of AI, committing to satisfying the diverse application demands of global data centers, and jointly creating a mutually beneficial and prosperous industry ecosystem.For more information , please visit.

PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing to help customers turn emerging technologies into production-ready products.AI is expanding beyond model training into enterprise and industrial applications. This shift shows that customers need not only computing performance, but also system integration, deployment flexibility, and long-term reliability. Through its AI Tech Maker strategy, PEGATRON turns compute, connectivity, sensing, and product design into deployable systems. PEGATRON will highlight three product areas in Computex: AI infrastructure for AI factories and high-performance computing; edge and industrial AI for manufacturing and communications; and physical AI platforms spanning robotics, drones, intelligent vehicles, and smart devices.Building AI Infrastructure for AI Factory and High-Performance ComputingLarge-scale AI deployment is driving new requirements for computing performance, networking bandwidth, thermal management, and system integration.At COMPUTEX 2026, PEGATRON presents a next-generation AI infrastructure portfolio that includes NVIDIA Vera Rubin NVL72, NVIDIA HGX Rubin NVL8, NVIDIA RTX PRO Server, and AMD Instinct MI355X and MI350P GPU server platforms. The solutions support enterprises and cloud service providers building next-generation AI Factory and high-performance computing environments.PEGATRON also showcases 400G, 800G, and 1.6T AI infrastructure switches designed for large-scale AI training and inference workloads requiring high-speed, low-latency data transmission. Open data center solutions compliant with Open Compute Project (OCP) standards are presented to improve scalability, deployment flexibility, and energy efficiency.The portfolio further integrates GPU servers, AI networking, liquid cooling, and full-rack system integration. This approach expands PEGATRON's role from hardware manufacturing toward comprehensive AI infrastructure platform deployment, helping customers shorten implementation cycles for generative AI, agentic AI, and enterprise AI applications.Bringing AI from Digital Twins to Edge ConnectivityAt the industrial AI layer, PEGATRON presents its PEGAVERSE portfolio, a smart manufacturing platform built around digital twins and agentic AI. The portfolio includes ARCHITECT for site planning, YODA for engineering knowledge training, and JEDI for intelligent manufacturing processes. These applications translate PEGATRON's manufacturing experience into repeatable and deliverable industrial AI offerings.In communications and edge AI, PEGATRON showcases next-generation 5G equipment, AI-RAN concepts, Wi-Fi 7 modules, and 6G antennas. The company is also integrating radio units (RUs) with NVIDIA DGX Spark, reflecting the growing convergence of AI compute and communications infrastructure.PEGATRON also presents its Scalable Central Computing Rack (SCCR) for smart mobility. As a vehicle central computing platform, SCCR integrates IVI, gateway, and ADAS functions, addressing the industry shift from distributed vehicle electronics toward centralized architectures and extending edge computing into mobility systems.Expanding Physical AI Across Ground and Aerial PlatformsAI is moving from data centers into physical environments, where autonomous systems must combine sensing, compute, and motion control to operate reliably in complex conditions. At COMPUTEX 2026, PEGATRON presents ground robot and aerial drone platforms that bring physical AI into mobility systems.SIMBA II, PEGATRON's next-generation quadruped robot platform, combines power electronics, mechanical design, sensing systems, and edge AI computing for inspection, monitoring, and automation tasks. Developed with Swiss precision drive specialist maxon, the platform integrates the HEJ 90 high-performance joint system to improve motion control and stability, while supporting real-time environment recognition and autonomous navigation.The G720 SOM+EVK and AI Companion Computer extend PEGATRON's edge computing and visual perception technologies to intelligent drone platforms. Built on MediaTek's MT8391 platform, they support ROS2 and MAVLink integration with flight control systems and mission workflows, enabling navigation, sensing, and real-time image processing. Vision perception and multi-camera imaging modules further support obstacle avoidance and environmental interpretation.Through its ground and aerial platforms, PEGATRON brings AI compute, sensing, and autonomous control into physical mobility systems, turning related technologies into deployable products.Bringing AI and Design into Smart Endpoint DevicesIn smart devices and user experience, PEGATRON applies its DMS model to combine industrial design, engineering, materials, and manufacturing into the product development process. The M16P Optimus modular laptop uses a modular architecture for key components such as the motherboard, I/O, keyboard, battery, and storage. The design allows flexible configuration based on customer requirements and supports easier maintenance, faster customization, and future platform upgrades.The award-winning Armo Emotion Sensing Game Handle brings sensing technology into interactive applications. It integrates heart rate, electrodermal activity, and temperature sensing to analyze physiological signals and adapt gameplay based on user conditions.In personal care, the PRIIo product line extends PEGATRON's design capabilities into everyday consumer applications. The products combine electronic control, sensing technology, and industrial design for facial and scalp care scenarios.PEGATRON said AI development is shifting from technology-led progress toward practical use. The key is turning innovation into products and systems that can operate reliably over time. The company will continue strengthening its productization and integration capabilities while working with global partners to support technology adoption across different environments.PEGATRON's COMPUTEX 2026 booth is located at L0104, 4F, Taipei Nangang Exhibition Center, Hall 1. Professional guided tours will be available during the show.

Edimax Group will host Expo 2026 during Computex 2026, bringing together its group companies, including EDIMAX Technology Co., Ltd. (TWSE: 3047, including its Edimax and Acelink business units), Comtrend Corporation (TWSE: 8089), and SMAX Technology Co., Ltd. The exhibition will take place from June 1 to June 11, 2026, at Edimax Group headquarters in Taipei.Edimax Group to Showcase AI Edge Innovation at Expo 2026. Credit: EdimaxThis year's Expo carries special meaning as Edimax Group marks its 40th anniversary. Since its founding, the Group has grown from a networking equipment developer into a global provider of connectivity technologies across home networking, enterprise and industrial networking, broadband communications, and AIoT applications.For four decades, Edimax Group has focused on one mission: making technology more reliable, practical, and closely connected to real-world business and lifestyle needs. As the company enters this important milestone year, Edimax Group extends its sincere appreciation to its global partners, customers, and supply chain partners for their long-standing trust and support.Expo 2026 Event InformationEdimax is pleased to announce its upcoming exclusive showcase, centered around the theme "AI Edge. Autonomous Future. Resilient Living." Running from June 1 to June 11, 2026, the event will take place at the Edimax Group Headquarters, located at No. 278, Xinhu 1st Road, Neihu District, Taipei, Taiwan.The showcase will be open from Monday to Friday, 9:00 AM to 6:00 PM. Please note that attendance is by appointment only. We cordially invite industry leaders and partners to schedule a visit and explore the next generation of technological innovation with us.Exhibition FocusExpo 2026 will highlight four key areas: Autonomous Future - AI Edge, autonomous operations, and self-service applications for scalable business growth. Ultra-Speed & Trusted Network - Wi-Fi 8, 25G networking, AI management, and green computing for next-generation connectivity. Secure and Resilient Connectivity - Edge networking and AI-driven management to strengthen security and network resilience. Market-Ready Solutions - Proven, ready-to-deploy solutions that help customers accelerate project launches and market adoption.Edimax Group stated that it will continue to deepen the integration of AI, broadband communications, and smart networking technologies while working closely with global partners to advance next-generation intelligent networks and digital applications.Expo 2026 will be held by appointment only. Global partners and customers are invited to visit and experience Edimax Group's latest innovations, celebrate the company's 40-year milestone, and explore the future of smart connectivity.

Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs designed for immersion cooling and engineered for AI-driven data centers, along with a comprehensive portfolio of industrial and enterprise SSD solutions.As generative AI and high-density computing evolve, thermal management is critical. To address this, SSSTC has optimized its SSDs for immersion cooling environments by enhancing corrosion resistance through specialized materials, component protection, and structural design. The lineup includes the SATA ER3, ER4, and ER5 series, as well as the PCIe U.2 PJ1 and EJ5 series.These SSDs are optimized for immersion cooling environments, where systems are submerged in non-conductive dielectric fluids. By leveraging the high heat capacity and convective properties of liquids, heat can be efficiently dissipated through fluid circulation and heat exchange. This approach reduces reliance on traditional air cooling while improving Power Usage Effectiveness (PUE) and overall system reliability.SSSTC is also highlighting a range of industrial and enterprise SSDs optimized for AI and edge applications. Industrial SSDs support Edge AI and harsh environment deployments, with operating temperatures ranging from -40-degrees Celsius to 85degrees Celsius, along with anti-vibration and shock-resistant designs for outdoor and industrial environments. The pSLC architecture enhances endurance for sustained write-intensive workloads, while a multi-tier PLP (Power Loss Protection) framework -  including hardware PLP, firmware PLP, and PLN -  provides flexible data protection.Enterprise eTLC SSDs are designed to deliver stable performance for AI workloads, offering endurance options of 1 and 3 DWPD over a five-year period for varying workload intensities. Under sustained workloads, they maintain more than 90% random IOPS consistency, minimizing performance fluctuations. Firmware optimized for high-density computing enables low latency operation, while capacitor-based PLP and immersion cooling support ensure reliable performance in demanding deployment environments.With more than 18 years of in-house firmware development expertise, SSSTC understands diverse storage requirements across industries and provides flexible customization options, including configurable over-provisioning, lifespan and capacity optimization, performance and power tuning, and application-specific firmware development. SSSTC remains committed to helping customers build stable, efficient, and sustainable AI storage infrastructures.Founded in 2008, SSSTC became a subsidiary of Kioxia Corporation in 2020 and delivers high-quality SSDs through in-house firmware and NAND expertise. For more information, visit the SSSTC website.Remark: PCIe is a registered trademark of PCI-SIG.Credit: SSSTC

The global semiconductor landscape is undergoing a fundamental shift, moving from a focus on raw training power to the practical complexities of large-scale deployment. In an in-depth interview, Wallace Kou, President and CEO of Silicon Motion, detailed how the generative AI has evolved beyond its initial stages. While the market's early gaze was fixed almost exclusively on NVIDIA's GPUs, the High Bandwidth Memory (HBM), and the CoWoS advanced packaging technology, Kou argues that the industry is now entering the "Inference" era that is turning previous under-estimation about storage's importance on their head.The Shift from Training to InferenceThe turning point for this realization occurred during the NVIDIA GTC conference in March 2026. CEO Jensen Huang unveiled the Vera Rubin architecture, a move that signaled a massive spike in demand for NAND flash memory. During the initial AI boom, the industry was preoccupied with training massive models, a process that relies heavily on the lightning-fast throughput of HBM. However, as these models move into the inference phase - where they are actually used by end-users to generate content or solve problems - the access to context, historical data, and massive datasets storage become the primary bottleneck.Kou notes a dramatic shift in market sentiment. Only two years ago, storage was often an afterthought in the AI conversation; today, it is a critical scarcity. "There is currently not a single global cloud service provider or major smartphone manufacturer whose demand for DRAM and NAND is being fully satisfied," Kou observed. This supply-demand gap has triggered a financial windfall for storage module manufacturers and memory giants, with some stock prices skyrocketing up to tenfold as the market reacts to persistent shortages and rising prices.Technical Paradigm Shift: CMX and the Infrastructure of ThoughtAt the heart of this transition is a new architecture introduced by NVIDIA: the CMX Context Memory Storage platform. This architecture is designed specifically to handle the "KV Cache" (Key-Value Cache), which allows AI models to remember the context of a conversation or a complex task during the inference process.The hardware requirements for the CMX architecture are staggering in their scale and technical demands. Each individual Rubin GPU requires 16TB of dedicated storage to function effectively within this framework. At a system-level scale, a single NV72 Vera-Rubin setup can demand more than 1 Petabyte, or 1,000 Terabytes, of total storage capacity. Beyond mere capacity, the CMX architecture facilitates direct GPU access to storage, a feature that bypasses traditional latency bottlenecks and ensures that AI inference remains fluid and responsive.While this creates a massive commercial opportunity for the storage industry, it also places an unprecedented strain on NAND production. Kou emphasizes that this is not just a cloud-based phenomenon. The explosion of Edge AI - AI processed locally on devices - is further complicating the supply chain. For instance, driven by major players like Meta, the market for smart glasses is expected to reach 60 million units this year. These wearable devices require high-performance embedded storage, creating a secondary front in the war for NAND capacity.Silicon Motion's Role: Solving the QoS BottleneckAs the world's leading NAND controller maker, Silicon Motion sits at the intersection of these competing demands. The primary technical challenge in modern AI environments is maintaining Quality of Service (QoS). In a multi-tenant cloud environment, where multiple GPUs are accessing shared storage simultaneously for different inference tasks, data transfer speeds can often fluctuate or drop.To solve this, Silicon Motion has deployed its proprietary PerformaShape technology. This technology ensures that even under heavy, concurrent workloads, the transmission speed remains stable. By stabilizing these data flows, Silicon Motion has positioned itself as an "indispensable stabilizer" in the AI ecosystem.Beyond data path optimization, Silicon Motion is also extending its role into system-level infrastructure by providing enterprise-grade boot drives for leading AI GPU, TPU, and DPU platforms, ensuring system reliability and fast initialization at scale.The Crisis of Imbalance: Kou's "Capacity Persuasion" EffortsDespite the record-breaking revenues, Kou is deeply concerned about the "shadows" lurking behind this prosperity. The current memory market is suffering from a dangerous imbalance. To maximize profits and satisfy the insatiable hunger of AI cloud giants, major manufacturers like Samsung, SK Hynix, and Micron are funneling the majority of their capital expenditure (CAPEX) into HBM and DDR5 production.This strategic pivot has effectively "squeezed" the production capacity available for standard NAND flash. Kou warns that this "AI squeezing effect" could lead to a collapse in traditional sectors. Over the past eight months, Kou has embarked on a global mission, meeting with leaders at Samsung, SK Hynix, Kioxia, SanDisk, YMTC, and Micron. His message is one of "capacity persuasion": he is urging these giants to reserve a portion of their production lines for the automotive, PC, and smartphone industries."If these foundational industries break because they cannot find parts, Edge AI will have no 'soil' to grow in," Kou warned. He believes that a total focus on the high-margin AI server market could eventually backfire, destroying the broader technology ecosystem that supports AI development.A Stabilizing Strategy: From Cloud to EdgeSilicon Motion is positioning itself as the "transition enabler" for an industry in flux amid an expected 2–3 year supply shortage. As NAND manufacturers concentrate their internal resources on AI-driven initiatives, they are increasingly outsourcing non-core and mainstream projects, such as PCIe Gen5 controllers and embedded solutions. In this shift, Silicon Motion has emerged as a preferred partner to fill the resulting gap.At the same time, as rising prices weigh on demand in the PC and smartphone markets, the company is helping customers pivot toward automotive and AIoT applications, including rapidly growing segments such as smart glasses, which are seeing a surge in shipments this year.One of the most critical areas is the automotive sector, where Silicon Motion has spent a decade building a presence. While memory giants might see automotive requirements as "niche" or low volume compared to AI servers, Kou views them as essential to global stability. When major OEMs consider abandoning these specialized demands due to capacity constraints, Silicon Motion steps in to ensure the global automotive supply chain does not grind to a halt."We are not just looking for a surge in revenue; we want to fulfill our responsibility to the industry," Kou said. By providing stable controllers and storage solutions for AIoT and automotive applications, Silicon Motion is effectively repairing the cracks in a fractured global supply chain.Future Outlook: 2027 and BeyondThe current supply-demand imbalance is not a temporary glitch but a structural reality that Kou expects to persist until at least late 2027 or 2028. Several factors make it nearly impossible to add capacity quickly, for example, land acquisition is increasingly difficult. The lead time for building specialized cleanrooms and procuring critical equipment now exceeds one year.Kou predicts that while the DRAM shortage might begin to ease by the end of 2027, the relief for NAND will likely come even later. In this high-pressure environment, Silicon Motion's role as a key stabilizing force becomes increasingly important.Particularly in emerging sectors such as smart IoT and automotive applications, Silicon Motion delivers reliable controller and storage solutions, filling the vacuum left by production shifts at major manufacturers or by projects lacking sufficient engineering support.By helping global clients navigate the complexities of geopolitics and capacity wars, Silicon Motion aims to ensure that the AI revolution leads to a steady, sustainable future rather than a chaotic collapse of the broader tech industry.AI inference boom fuels supply-demand imbalance until 2027-2028, says Wallace Kou. Credit: Silicon Motion

As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this backdrop, Infineon Technologies is redefining power infrastructure of AI era through its comprehensive "From Grid to Core" strategy, integrating energy efficiency, power density, and system resilience from the electrical grid to the processor core.Scaling AI: Strategic Power Solutions MatterThe evolution of artificial intelligence (AI) has accelerated far beyond the trajectory once predicted by Moore's Law. As AI models continue to expand in parameter scale and real-time inference becomes increasingly critical, demand for computing power is rising at an unprecedented pace.Today, the power consumption of a single GPU is rapidly approaching the kilowatt level, and the power density of a server rack has increased significantly from less than 60kW in the past to exceeding 100kW, now moving toward a new threshold in the megawatt range.This is not just numerical growth; it represents a fundamental shift in power architecture. As AI computing clusters expand rapidly, traditional 48V busbars and AC power distribution architectures are quickly approaching their physical limits in terms of power loss, thermal management, and spatial constraints.Adam White, President of Infineon's Power & Sensor Systems Division, emphasized that future competition in AI infrastructure will no longer be limited to chip performance. Instead, it will be a cross-disciplinary integration battle encompassing power electronics, materials technology, and system architecture.From Grid to Core: Rethinking the power delivery architectureAt this critical turning point for the industry, Infineon's competitive advantage lies not in a single breakthrough product, but in its ability to orchestrate and optimize the entire power delivery chain at the system level."From Grid to Core" is more than a product strategy - it is a multi-phase architectural framework designed to reshape the future AI energy chain. Developed through early collaboration with global hyperscalers and ecosystem partners, the strategy enables Infineon to address evolving AI power demands across every phase of infrastructure, from utility grids to processor-level power management.Power grid: Enabling a sustainable, high-efficiency power with HVDCAt the front end of the data center, power infrastructure is transitioning from traditional mechanical systems to highly integrated solid-state solutions. Future AI facilities are expected to increasingly adopt decentralized DC microgrids, enabling greater efficiency, flexibility, and resilience in energy management.By leveraging silicon carbide (SiC) technology in solid-state transformers (SSTs), system weight can be dramatically reduced - from nearly 20 tons to approximately 500 kilograms—while simultaneously improving overall energy efficiency by more than 1%. Beyond optimizing space utilization and operational costs, this advancement signals a broader industry migration from electromechanical infrastructure toward semiconductor-driven power systems.As SSTs and related technologies become integrated into AI power infrastructure, a multi-billion-dollar semiconductor opportunity is emerging across next-generation energy systems.At the same time, the power grid is evolving beyond its traditional role as just an energy source. Through digitally controlled power systems with real-time monitoring and remote management capabilities, combined with solid-state circuit breakers (SSCBs) featuring microsecond-level response times, the grid is becoming an intelligent energy platform capable of continuous optimization and predictive management.Server rack: Reshaping power density and maximizing efficiencyAs data centers advance toward GW-scale deployments, power distribution architecture is undergoing a fundamental redesign. Infineon is driving the industry's transition from traditional 48V systems to ±400V and 800V high-voltage DC architectures. Through the design of three-phase power sidecars, Infineon is restructuring power supply and computing systems to establish a more efficient and flexible power distribution model.At the same time, the power architecture of AI data centers is following a clear evolutionary path: moving from integrated server rack designs to high-voltage DC and sidecar power supply configurations, and ultimately advancing to gigawatt-scale infrastructures that incorporate DC microgrids.Meanwhile, The high-frequency characteristics of gallium nitride (GaN) components enable intermediate bus converters (IBCs) to achieve over 98% conversion efficiency and exceptionally high power density in an extremely compact form factor, significantly reducing power transmission losses and freeing up more space for AI computing resources.Processor core: Power density and new architectures for next-gen AI computeAt the processor core—the final stage of power delivery—the challenge shifts toward managing extreme current density and ultra-fast transient response.To support next-generation GPUs requiring massive current delivery and rapid load transitions, Infineon has introduced a digital multiphase PWM controller alongside the industry's first TLVR four-phase power module. These technologies are engineered to provide highly stable, efficient, and responsive power delivery for AI processors operating under increasingly demanding workloads.In response to the next generation of GPUs demanding ultra-high current and rapid load changes, Infineon has introduced digital multiphase PWM controllers and the industry's first TLVR quad-phase module. By leveraging high-precision telemetry and digital control technologies, power systems have transformed from energy suppliers into intelligent platforms capable of real-time monitoring, prediction, and optimization.From AI data center to physical AIIf data centers form the foundation of AI computing power, the physical world will be where AI's true value is ultimately realized. As AI increasingly expands into humanoid robots, autonomous systems, and intelligent manufacturing equipment, demands for energy efficiency, real-time responsiveness, and system reliability will become even more critical.Infineon is extending its long-established expertise in power management beyond data centers into the emerging era of Physical AI. By integrating sensing technologies, actuate, security and connectivity solutions, and high-efficiency power modules, the company is enabling a comprehensive functional blocks that empower humanoid robots to perceive, think, act and connect, safely and secured in a real-world environment.Push the boundaries of power technology in AI era"We Power AI" is not just a slogan for Infineon—it is a concrete commitment to the future of the industry. From gigawatt-scale data centers to physical AI, Infineon continues to push the boundaries of power technology, ensuring that every watt of energy is transformed into the greatest possible value for AI.As the industry advances toward the next generation of computing, energy management will become the decisive key to truly unlocking the full potential of AI. In this wave of transformation, Infineon is joining forces with ecosystem partners to stand at the forefront of defining the future.Editor's Note: Adam White will deliver a keynote address at COMPUTEX 2026 on June 4 titled  "Infineon Powering AI from Grid to Core to Physical AI."  The session will explore emerging trends and strategic opportunities in power infrastructure of AI era.Credit: Infineon