On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking most-favored-nation (MFN) rates. This makes Taiwan the first country to secure tariff relief under Section 232. Both sides also plan to expand supply chain investment cooperation. Hsu called this a very positive outcome for Taiwan's overall industry and said it has eased market concerns.
GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company's global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya, Japan, as well as Denmark, all hitting record revenues in 2025. Niche products like gallium nitride (GaN) stood out for their strong performance. Hsu also outlined GlobalWafers' 2026 strategy and shared her outlook on market conditions.
Electronics manufacturing services (EMS) providers are sharpening their competitive positions around AI-era infrastructure, shifting attention from cyclical end markets to longer-cycle platform builds for cloud, networking, and data centers. Recent company updates from Celestica, Sanmina, Jabil, and Flex show a common playbook: move up the value chain, standardize repeatable system designs, and invest in power, thermal, and integration capabilities that shorten deployment times for hyperscale customers.
A cluster of China's leading electronics manufacturers and component suppliers is entering the new year with a clearer division of labor across the AI device wave, automotive electrification, and globalized manufacturing. Recent company filings, investor communications, and post‑autumn analyst commentary point to a common theme: growth is being pursued less through single-product cycles and more through platform capabilities—vertical integration, module-level design, and cross‑sector customer expansion—while capital market actions and overseas footprints are being positioned as strategic amplifiers.
Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates high-performance computing (HPC) with quantum computing (QC). Based in southern Taiwan, the system is intended to accelerate real-world applications through international cooperation, leveraging the country's strong semiconductor manufacturing expertise.
China-based electronics manufacturing giant Luxshare Precision has been hit by a major cybersecurity incident, with a ransomware group claiming it breached the company's internal systems and stole large volumes of sensitive engineering and operational data tied to products for leading technology clients, including Apple, Nvidia, Tesla, Meta Platforms, Qualcomm, and LG Electronics. If confirmed, the incident could pose risks to the global consumer electronics supply chain.
Taiwanese electronics manufacturing services (EMS) and original design manufacturing (ODM) companies continue to dominate the global industry, with combined revenues of the world's top 20 players projected to climb sharply in 2025, according to estimates compiled by DIGITIMES.
Sino-American Silicon Products (SAS) chairwoman Doris Hsu emphasized power supply issues affecting Taiwan-US industry expansion, including Taiwan's green energy shortages and US AI data center conflicts. SAS is committing to 100% green energy for new plants and integrating green energy certificates with wafer sales.
Geopolitical uncertainty shows little sign of easing, driving continued adjustments across the global consumer electronics supply chain. In manufacturing, the industry is moving beyond simple capacity dispersion and entering a new phase marked by the geographic redistribution of engineering capabilities. Recent market reports that Google plans to relocate portions of new product introduction (NPI) work for select high-end smartphone models to Vietnam starting in 2026 have drawn close attention across the industry.
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major cloud service providers (CSPs), but Taiwanese firms MediaTek, Alchip, and GUC also have new products entering mass production. These developments are expected to deliver solid revenue contributions despite ongoing market uncertainties.
Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.
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