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Dec 26
Huawei details Ascend AI chip roadmap built around in-house HBM, massive clusters
Huawei is clarifying how it intends to compete in global AI computing despite being cut off from leading-edge foundries and US-origin GPUs. Instead of chasing rivals on single-chip performance, the company is leaning into scale, systems engineering, and vertical integration—a strategy it is now preparing to test outside China, beginning with South Korea.
Global high-performance transmission cable maker Wonderful Hi Tech offered an optimistic outlook at its investor briefing on November 18, 2025. Despite a slight year-over-year revenue decline in the third quarter of 2025—attributed to the end of pre-stockpiling by clients ahead of tariff changes—company executives said the inventory adjustment is expected to conclude by year-end, setting the stage for a robust start to 2026. With continued growth in AI and low-Earth-orbit (LEO) satellite markets, the company anticipates 2026 will be a high-growth year.
The surge in AI-driven high-speed computing and data transmission demands has prompted major players to invest heavily in co-packaged optics (CPO) technology. Compound semiconductor firm IntelliEPI announced a share-swap partnership with optical communications company EZconn, drawing renewed market attention.
As generative AI and large language models scale rapidly, the computing race is shifting toward a quieter but decisive battleground: how data is stored, accessed, and utilized. According to Sina and Securities Times, Huawei has launched a global call for solutions through the sixth OlympusMons Awards, which opened on December 26, 2025. With a total prize pool of CNY3 million (US$426,000), the program seeks innovations aimed at overcoming storage and memory bottlenecks in the AI era.
GPU prices are expected to rise in early 2026 as memory costs surge. AMD may implement hikes starting in January 2026, with Nvidia following in February 2026, according to industry sources. Pricing adjustments will likely continue for several months.
After briefly approaching a US$5 trillion market capitalisation, Nvidia spent 2025 deploying capital at an unprecedented pace, backing Groq, OpenAI, Nokia, Synopsys, and Intel through technology deals, equity stakes, and strategic partnerships. The objective is straightforward: convert AI-driven cash inflows into a durable, structural influence across the AI ecosystem.
ASIC design service and artificial intelligence (AI) software solution provider Microip announced on December 26, 2025, that its first self-developed near-field communication (NFC) transceiver IC has completed chip testing and verification, achieving a first-time right (FTR) initial test yield of as high as 99%.
The global unmanned vehicle market is booming with explosive growth. This surge has revitalized existing sectors while boosting related supply chains that are now targeting a second growth curve. Key component suppliers, such as those from the communication technology and IC design sector,s are seizing new business opportunities.
AI supercycle and replacement demand support Foxconn's growth in 2026
Dec 29, 11:05
Foxconn's operating structure is clearly shifting. Previously driven mainly by consumer electronics cycles, it is now gradually tilting toward AI servers, cloud, AI infrastructure, and high-performance computing (HPC). With continued investment and deployment in emerging businesses such as electric vehicles (EVs), results are expected to surface in 2026.
Nvidia has reportedly invested US$20 billion to acquire technology licenses from Groq, marking its largest investment to date. The move is drawing significant attention in South Korea as Groq is backed by Samsung Electronics and collaborates with it in the foundry sector.
Set-top box maker Skardin Industrial confirmed that it has recovered a portion of its bad debt from an Argentine client, recognizing approximately NT$110 million (US$3.5 million) in bad-debt reversal gains, which have significantly strengthened operating cash flow. The company plans to continue advancing its transformation strategy, focusing on green energy, internet data centers (IDC), and resilient communications modules as its next growth engines.
According to Nikkei, although electric vehicle (EV) demand has been below expectations, weighing heavily on Rohm Semiconductor's SiC power semiconductor equipment investments, the company has decided to expand applications into the AI server sector. Rohm's annual revenue from server-related fields is only around JPY10 billion (approx. US$64 million), but it has already started supplying new products in collaboration with Nvidia.