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Sep 16
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy of leasing facilities in North America, the company is making a major investment to purchase land and build its own plants.
AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse than in 2026, with cost pressure already spreading to smartphones and notebook PCs.
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and gigawatt-scale infrastructure.

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being seen with a Galaxy Z Fold7 earlier in 2026. The latest sighting has drawn fresh attention to the close partnership between Samsung Electronics and Nvidia.

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

"The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings about AI bringing civilization to an end.

As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve their semiconductor and manufacturing advantages has become a focal point. DIGITIMES and IC975 chairman Colley Hwang said the two sides should look for complementary strengths, work together to help Vietnam, Malaysia, and other countries develop, and first increase corporate exchanges to build a positive environment for cooperation.

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not only on next-generation TPU products but also on how rising AI compute demand is accelerating TPU iteration and deployment.

Leotek Electronics has completed a real-world deployment of its Interlux AI Traffic Signal System in Georgia, highlighting how cities worldwide can adopt smarter traffic management, connected-vehicle tools, and AI-based road safety systems. The test could inform future urban transport upgrades in the US and beyond.

US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a turbulent economic period marked by an April 2025 tariff surge where both nations raised levies above 100% before reaching a temporary stalemate. Alongside traditional trade discussions and potential climate change or pandemic prevention talks, technology leadership, export controls, and regulatory frameworks are set to dominate the agenda.
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser, and higher-performing, bolstering the value of the advanced packaging end of the chip process.
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal management and system reliability rather than production capacity.