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2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI

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LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity

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Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling

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Twinhead/Uniwill merger delayed until the end of 2001

David Tzeng, Kaohsiung, and Yu-Hsiang Wang, Taipei

May 29, 2001, 00:00 0

The long-awaited merger between Twinhead International and Uniwill Computer received a sudden blow on May 25...

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Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

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