中文網
Taipei
Fri, Jun 18, 2021
12:44
mostly clear
35°C
CONNECT WITH US
NEWS TAGGED HUAWEI
Friday 11 June 2021
Global smartphone AP market posts double-digit growth in 1Q21
The global smartphone applications processor (AP) market surged 21% on year to US$6.8 billion in the first quarter of 2021, according to Strategy Analytics.
Thursday 27 May 2021
Global tablet market – 1Q 2021
First-quarter 2021 global tablet shipments amounted to 35.96 million units, down 22.7% from a quarter ago but up 45.5% from a year ago.
Friday 21 May 2021
China smartphone AP shipments – 1Q 2021
First-quarter 2021 smartphone AP shipments to China-based vendors amounted to 212 million units, maintaining a similar level to the prior quarter and soaring 56.9% from a year ago.
Thursday 20 May 2021
China smartphone market and industry – 1Q 2021
First-quarter 2021 smartphone shipments to the China market amounted to 94.6 million units. The volume represented a growth of 9% quarter-over-quarter and an upsurge of 99.6% year-over-year...
Tuesday 4 May 2021
Global tablet shipments drop sequentially in 1Q21
Global tablet shipments totaled 35.95 million units in the first quarter of 2021, down 22.7% sequentially, but 45.5% on year, meeting Digitimes Research's forecast in January.
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Friday 30 April 2021
China smartphone vendors see combined shipments drop in 1Q21
China-based smartphone vendors saw their combined first-quarter 2021 shipments decline 9.7% sequentially to 191 million units, which, however, represented a sharp on-year increase...
Thursday 22 April 2021
Malaysia invites telecom equipment vendors to 5G bidding, says report
Digital Nasional Berhad (DNB) under Malaysia's Ministry of Finance has invited Ericsson, Huawei, ZTE, Cisco, NEC, Nokia, Samsung Electronics and FiberHome to participate in the bidding...
Monday 19 April 2021
Huawei reportedly to release 3 new foldable smartphones in 2H21
Huawei reportedly plans to launch three new foldable smartphones in the second half of 2021, having launched its foldable Mate X2 in February, according to industry sources.
Thursday 15 April 2021
China PCB maker Shennan facing headwinds
China's leading PCB maker Shennan Circuits is facing increasing pressure on its business operations in 2021 due to losses of orders from Huawei for 5G infrastructure applications...
Friday 9 April 2021
TSMC posts record revenue for March , 1Q21
TSMC's consolidated revenue for March and first-quarter 2021 both set record highs.
Wednesday 31 March 2021
Tape COF substrate supply to become tight for processing OLED DDI
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Monday 29 March 2021
PCB demand for 5G infrastructure vital to Wus business results in 2021
China-based PCB maker Wus Printed Circuits will see its revenue performance for 2021 hinge largely on whether demand for 5G infrastructure applications in China will rebound, according...
Monday 29 March 2021
MediaTek named biggest smartphone chipset supplier for 1st time
In 2020, MediaTek's chipset shipments to the major smartphone OEMs reached 351.8 million units, compared to 238 million units the company supplied in 2019, according to Omdia. MediaTek's...
Wednesday 24 March 2021
CCL makers asked to ready shipments for China 5G infrastructure despite uncertainty
Overall components shipments for 5G infrastructure construction in China remain in low gear, but Taiwan's CCL makers are still being asked by Chinese clients to prepare for possible...
Monday 4 September 2017
IFA 2017: Huawei Kirin 970
Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of the cloud with the speed and responsiveness of native AI processing, according to the company. Cloud AI has seen broad application, but user experience still has room for improvement, including latency, stability, and privacy, according to the vendor. Cloud AI and on-device AI can complement each other. On-device AI offers strong sensing capabilities, which are the foundation of understanding and assisting people. Sensors produce a large amount of real-time, scenario-specific, and personalized data. Supported by strong chip processing capabilities, devices will become more cognitive of user needs, providing personalized and readily accessible services. Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one square centimeter. Huawei's new flagship Kirin 970 is its first mobile AI computing platform featuring a dedicated neural processing unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970's new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. The Kirin 970 can perform the same AI computing tasks faster and with far less power, Huawei claims. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market. Huawei is positioning the Kirin 970 as an open platform for mobile AI, opening up the chipset to developers and partners.