CONNECT WITH US

Chipbond Technology expects 3Q TFT LCD driver IC packaging market to remain strong

Nuying Huang, Hsinchu; Shih-wei Kao, DIGITIMES Asia 0

Chipbond Technology has achieved 70-80% capacity utilization for its gold bumping and tape carrier package (TCP) lines for TFT LCD driver ICs, said company president Fei-jain Wu.

The article requires paid subscription. Subscribe Now