Chipbond Technology has achieved 70-80% capacity utilization for its gold bumping and tape carrier package (TCP) lines for TFT LCD driver ICs, said company president Fei-jain Wu.
The article requires paid subscription. Subscribe Now
Chipbond Technology has achieved 70-80% capacity utilization for its gold bumping and tape carrier package (TCP) lines for TFT LCD driver ICs, said company president Fei-jain Wu.