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Order of Nvidia GB200 supply alters; 2nd-tier ODMs to benefit

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Korean chipmakers consider reducing LPDDR4 memory output

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Given Rapidus' bleak outlook, can TSMC restore Japan's industry?

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Ultra-large TVs drive overall TV sales value during Double 11

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Brands pursue supply chain relocation as globalization fades

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AUO steadily expands its smart mobility offerings

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Is the potential for robotics startups surging? Industry development takes time

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MCU firm Padauk pursues cost structure optimization

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Microsoft CVP considers Taiwan's supply chain important as data center demand develops

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New US ban on China on its way; Taiwan IC design houses may gain

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Molicel enters supply chain for AI BBU

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Home Tech Semiconductors

ASE kicks off volume production of 12-inch bumping

Pei-chun Tang, Taipei; Jane Wang, DIGITIMES Asia Wednesday 30 October 2002 0

Advanced Semiconductor Engineering (ASE) on October 29 announced that its 12-inch wafer solder bumping line is ready for volume production. The technology will be used to package high-frequency communications chips, high-end graphics chips and proces...

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Crypto market capitalization tops US$3.2 billion on Trump's victory

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