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ACE to mass produce new wafer-level packaging products, expects booming shipments in 2004

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia Tuesday 25 November 2003 0

Taiwan-based Advanced Chip Engineering (ACE) Technology expects to begin volume shipments of its new “enhanced wafer-level packaging (EWLP) – fan out type” products in January, according to company chairman Wen-kun Yang.

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