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Winbond to reduce commodity DRAM capacity allocation by 75% in 1Q

Hans Wu, Taipei; Jack Lu, DIGITIMES Asia 0

Winbond Electronics plans to lower the capacity it allocates to producing commodity DRAM for Infineon Technologies from 20,000 wafers per month in 2003 to 5,000 wafers per month in the first quarter of this year, according to sources.

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