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Winbond increases 2006 capacity schedule for DDR2 production

Hans Wu, Taipei; Esther Lam, DIGITIMES Asia Tuesday 25 October 2005 0

With its technology partner Infineon Technologies maintaining a positive DDR2 outlook, Winbond Electronics has revised its 2006 monthly 12-inch capacity expansion plans upward by 4,000 12-inch wafers, with all the extra capacity set to be assigned to...

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